JP2003126764A - Method and apparatus for treating substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently carry out the substitution of a liquid on a substrate to be treated in flat flowing system. SOLUTION: A liquid A on a substrate G, which is delivered from a treating part of the preceding stage, is swept out to the side or the side direction by the flow of a rinse liquid B by supplying the rinse liquid B from a V-shaped nozzle 160 on the surface-to-be treated of the substrate G transported in horizontal attitude in a transporting passage 114 to flow in the oblique direction to the transporting direction. In more detail, the surface-to-be-treated on the substrate G is divided left and right two parts, the liquid is passed to the left direction from the left nozzle part 160L of the V-shape nozzle 160 in the left half region and the liquid is passed to the right direction from the right nozzle part 160R of the V-shaped nozzle 160 in the right half region to efficiently sweep out the liquid A present on each part of the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for carrying out a predetermined processing on a substrate while horizontally transferring the substrate to be processed.

[0002]

2. Description of the Related Art Recently, LCD (Liquid Crystal Display)
In the resist coating development processing system in manufacturing, LC
As a cleaning method or a developing method that can advantageously cope with an increase in the size of the D substrate, the cleaning process or the developing process is performed while the LCD substrate is being transported on a transport path in which a transport roller and a transport belt are laid horizontally. The so-called flat flow method is drawing attention. Compared to the spinner method of rotating the substrate, such a flat-flow method has a simpler handling of the substrate and the configuration of the transfer system and the drive system, and has an advantage that mist is not generated or redeposition on the substrate is small. is there.

[0003]

Generally, in a flat-flow type cleaning treatment apparatus, a rinse nozzle is arranged above a conveying path on the downstream side in parallel with a cleaning means such as a brush scrubber or a jet scrubber, and directly below the rinse nozzle. The rinse liquid is jetted toward the substrate passing through the substrate to replace the dirty liquid on the substrate with the rinse liquid. However,
Unlike the spinner method, the flat flow method does not exert a centrifugal force on the substrate, which makes it difficult to sweep out the liquid from the substrate and has a problem that the substitution efficiency is not good.

Further, even in the flat-flow type developing apparatus, in the rinse section or the drying section provided on the downstream side of the developing section,
For example, after the bubble rinse, the dirty liquid on the substrate may be replaced with a new rinse liquid, but the replacement efficiency is not good as in the above case. The present invention has been made in view of the above conventional problems, and provides a substrate processing method and a substrate processing apparatus capable of efficiently and satisfactorily replacing a liquid on a substrate to be processed in a flat flow system. The purpose is to

[0005]

In order to achieve the above-mentioned object, the substrate processing method of the present invention is a substrate processing method for substituting a first liquid with a second liquid on a substrate to be processed. Of the substrate is conveyed in a horizontal direction with the surface to be treated facing upward, and the second liquid flows to the surface to be treated of the substrate obliquely or laterally with respect to the conveying direction on the substrate. It is a method of supplying and sweeping the first liquid in the flowing direction of the second liquid from the substrate.

Further, the substrate processing apparatus of the present invention comprises a transfer path for horizontally supporting and transferring the substrate to be processed with the surface to be processed facing upward, and the transfer in which the first liquid is present. Liquid supply means for supplying a second liquid to the surface to be processed of the substrate on the path so as to flow obliquely or laterally with respect to the transport direction on the substrate, and the first liquid on the substrate The liquid was swept out in the flowing direction of the second liquid and replaced with the second liquid.

In the present invention, the second liquid is caused to flow obliquely or laterally with respect to the transfer direction on the substrate, so that the first liquid (the liquid to be replaced) on the substrate is transferred by the flow of the second liquid. It can be swept laterally or laterally of the substrate with respect to the direction.

One embodiment of the present invention is a system in which the second liquid is slanted to the left side or the right side in a direction against the progress of the substrate. According to such a method, the first liquid on the substrate can be scraped out by the flow of the second liquid, and can be swept laterally or laterally of the substrate more reliably and efficiently.

In the method of the above aspect, it is preferable that, on the substrate, the surface to be processed on the left side of the boundary line set parallel to the transport direction is inclined to the left side in a direction countering the progress of the second liquid. The second liquid may be made to flow diagonally to the right in a direction against the progress of the substrate in the surface area to be processed on the right side of the boundary line. in this way,
The surface to be processed on the substrate is divided into left and right, and the second liquid is caused to flow in the opposite and obliquely outward directions with respect to the respective areas of the surface to be processed, so that the first liquid on the substrate is closer to each position. It can be swept out to the side efficiently.

According to another aspect of the present invention, the second liquid is caused to flow laterally to the left in a surface area to be processed on the left side of the boundary line set parallel to the transport direction on the substrate, As for the surface to be treated on the right side, the second liquid is laterally flowed to the right side. Also in this system, the first liquid on the substrate can be efficiently swept from each position to the side of the substrate which is closer to the first liquid.

Another aspect of the present invention is a system in which the second liquid is flowed across the substrate from one side edge of the substrate to the other side edge thereof. Also in this system, the first liquid on the substrate can be swept laterally or laterally of the substrate with respect to the transport direction by the flow of the second liquid. In this method, it is preferable that a new second liquid flow is added and merged midway on the substrate in order to enhance the flow of the second liquid from one side end of the substrate. Good.

In each aspect of the present invention, it is also effective to supply a fluid for rectifying the flow of the second liquid in a desired direction on the substrate.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a coating and developing treatment system as one structural example to which the developing treatment apparatus of the present invention can be applied. The coating and developing treatment system 10 is installed in a clean room, and uses, for example, an LCD substrate as a substrate to be treated, and performs various treatments such as cleaning, resist coating, prebaking, developing and postbaking in the photolithography process in the LCD manufacturing process. It is a thing. The exposure process is performed by an external exposure device 12 installed adjacent to this system.

In the coating and developing system 10, a horizontally long process station (P / S) 16 is arranged at the center, and cassette stations (C / S) 14 and interface stations (P / S) 16 are provided at both ends in the longitudinal direction (X direction). I
/ F) 18 are arranged.

The cassette station (C / S) 14 is
A cassette stage 20 which is a cassette loading / unloading port of the system 10 and on which a plurality of cassettes C capable of accommodating a plurality of substrates G can be placed side by side in a horizontal direction, for example, in the Y direction, on the stage 20. And a transport mechanism 22 for loading / unloading the substrate G into / from the cassette C. The transfer mechanism 22 has a means for holding the substrate G, for example, a transfer arm 22a, and can operate on four axes of X, Y, Z, and θ, and the adjacent process station (P / S) 16 side and the substrate G. It can be handed over.

The process station (P / S) 16 is
The processing units are arranged in the order of process flow or steps on a pair of parallel and opposite lines A and B extending in the system longitudinal direction (X direction). More specifically, in the upstream process line A from the cassette station (C / S) 14 side to the interface station (I / F) 18 side, a cleaning process section 24 and a first thermal processing section 26 are provided.
The coating process section 28 and the second thermal processing section 30 are arranged in a horizontal row. On the other hand, from the interface station (I / F) 18 side to the cassette station (C /
S) In the process line B on the downstream side toward the 14 side, the second
The thermal processing section 30, the development processing section 32, the decolorization processing section 34, and the third thermal processing section 36 are arranged in a horizontal row. In this line form, the second thermal processing unit 30
Is located at the end of the upstream process line A and at the beginning of the downstream process line B,
It straddles both lines A and B.

An auxiliary transfer space 38 is provided between the two process lines A and B, and a shuttle 40 capable of horizontally mounting the substrates G one by one is arranged in a line direction (X direction) by a drive mechanism (not shown). You can move in both directions.

In the upstream process line A, the cleaning process section 24 includes a scrubber cleaning unit (SCR) 4
This includes 2 scrubber cleaning units (SCR)
An excimer UV irradiation unit (e-UV) 41 is arranged in a position adjacent to the cassette station (C / S) 10 in 42. As will be described later, the cleaning section in the scrubber cleaning unit (SCR) 42 brushes the upper surface (processed surface) of the substrate G while the LCD substrate G is being horizontally transported by the roller transport or the belt transport in the line A direction. And blow cleaning.

The first thermal processing section 26 adjacent to the downstream side of the cleaning process section 24 is provided with a vertical transfer mechanism 46 at the center along the process line A, and a plurality of units are provided on both the front and rear sides thereof in multiple stages. Are arranged in layers. For example, as shown in FIG. 2, the upstream multi-stage unit (TB) 44 has a substrate transfer pass unit (PASS) 50,
Heating units (DHP) 52 and 54 for dehydration baking and an adhesion unit (AD) 56 are stacked in order from the bottom. Here, the pass unit (PASS) 50
Is used to transfer the substrate G to and from the scrubber cleaning unit (SCR) 42 side. Further, the downstream multi-stage unit (TB) 48 includes a substrate transfer pass unit (PASS) 60, a cooling unit (CL) 62,
64 and adhesion unit (AD) 66 are stacked in order from the bottom. Here, pass unit (PAS
S) 60 is for transferring the substrate G to and from the coating process unit 28 side.

As shown in FIG. 2, the transport mechanism 46 includes an elevating / conveying body 70 which can be moved up and down along a guide rail 68 extending in the vertical direction, and on the elevating / conveying body 70, it rotates or swivels in the θ direction. It has a rotatable carrier 72 and a carrier arm or tweezers 74 that can move forward and backward or extend and retract while supporting the substrate G on the carrier 72. A drive unit 76 for raising and lowering the elevation carrier 70
Is provided on the base end side of the vertical guide rail 68, and a drive unit 78 for driving the turning carrier 72 to rotate is provided on the vertical carrier 7.
A drive unit 80, which is attached to 0 and drives the transport arm 74 forward and backward, is attached to the rotary transport body 72.
Each drive unit 76, 78, 80 may be composed of, for example, an electric motor or the like.

The transport mechanism 46 constructed as described above is
It is possible to move up and down or rotate at high speed to access an arbitrary unit in the multi-stage unit sections (TB) 44 and 48 on both sides, and to transfer the substrate G to and from the shuttle 40 on the auxiliary transfer space 38 side. .

The coating process unit 28 adjacent to the downstream side of the first thermal processing unit 26 has a resist coating unit (CT) 82 and a reduced pressure drying unit (VD) 8 as shown in FIG.
4 and the edge remover unit (ER) 86 are arranged in a line along the process line A. Although not shown, in the coating process unit 28, the substrate G is provided in these three units (CT) 82, (VD) 84, and (ER) 86.
A transport device is provided for loading and unloading the sheets one by one in the order of steps, and each unit (CT) 82, (VD) 8
4. In the (ER) 86, each process is performed on a substrate-by-substrate basis.

The second thermal processing section 30 adjacent to the downstream side of the coating process section 28 has the same structure as the first thermal processing section 26, and is located between both process lines A and B. Is provided with a vertical transfer mechanism 90, one multi-stage unit (TB) 88 is provided on the process line A side (last), and the other multi-stage unit (T) is provided on the process line B side (head).
B) 92 is provided.

Although not shown, for example, in the multi-stage unit (TB) 88 on the process line A side, a substrate transfer pass unit (PASS) is placed at the bottom, and a pre-baking heating unit (PASS) is placed thereon. PREBAKE)
May be stacked in three layers, for example. In the multi-stage unit (TB) 92 on the process line B side, a substrate transfer pass unit (PASS) is placed at the bottom.
For example, a cooling unit (COL) is stacked on top of it, and a heating unit for pre-baking (PREBA) is placed on it.
KE) may for example be stacked in two layers.

The transport mechanism 9 in the second thermal processing section 30.
0 indicates the coating process unit 2 via the respective pass units (PASS) of the multi-stage unit units (TB) 88, 92.
8 and the development process unit 32 and the substrate G can be delivered one by one, and also the shuttle 40 in the auxiliary transfer space 38 and an interface station (I / F) described later.
The substrate 18 can be handed over in a unit of 18.

In the downstream process line B, the developing process section 32 includes a so-called flat-flow developing unit (DEV) 94 which carries out a series of developing processing steps while the substrate G is conveyed in a horizontal posture.

A third thermal processing section 36 is arranged downstream of the developing process section 32 with a decolorizing process section 34 interposed therebetween. The decolorization processing unit 34 irradiates the surface to be processed of the substrate G with i-line (wavelength 365 nm) to perform the decolorization process.
A line UV irradiation unit (i-UV) 96 is provided.

The third thermal processing section 36 has the same structure as the first thermal processing section 26 and the second thermal processing section 30, and is of a vertical type along the process line B. Transport mechanism 10
0 and a pair of multi-stage unit parts (TB) 9 on the front and back sides
8, 102 are provided.

Although not shown, for example, a pass unit (PASS) is placed at the lowermost stage in the multi-stage unit (TB) 98 on the upstream side, and a heating unit (POBAKE) for post-baking is provided on the pass unit (PASS). It may be stacked. In addition, the downstream multi-stage unit (TB) 1
02 has a post-baking unit (PO
BAKE) may be placed on top of which one pass / cooling unit (PASS / COL) for substrate transfer and cooling may be stacked, and two heating units (POBAKE) for post-baking may be stacked thereon.

The transport mechanism 1 in the third thermal processing section 36
00 is an i-ray UV irradiation unit (i-UV) 96 and a cassette station (C / C) via a pass unit (PASS) and a pass cooling unit (PASS / COL) of both multi-stage unit sections (TB) 98 and 102, respectively. S) 14 and the substrate G can be delivered not only in the unit of one sheet, but also the substrate G can be delivered in the unit of one sheet with the shuttle 40 in the auxiliary transport space 38.

Interface station (I / F) 1
8 has a transfer device 104 for exchanging the substrate G with the adjacent exposure device 12, and a buffer stage (BUF) 105, an extension cooling stage (EXT, COL) 106, and a peripheral device 1 around the transfer device 104.
10 are arranged. Buffer stage (BUF) 1
In 05, a stationary buffer cassette (not shown) is placed. Extension cooling stage (EXT
COL) 106 is a substrate transfer stage having a cooling function, and includes a process station (P / S) 1
It is used when exchanging the substrate G with the 6 side. The peripheral device 110 may have a structure in which, for example, a TITLER and a peripheral exposure device (EE) are vertically stacked. The transfer device 104 has a means capable of holding the substrate G, for example, a transfer arm 104a, and is provided with an adjacent exposure device 12 and each unit (BUF) 105, (EXT.COL) 10.
6, (TITLER / EE) 110 and the substrate G can be transferred.

FIG. 3 shows a processing procedure in this coating and developing processing system. First, the cassette station (C
/ S) 14, the transport mechanism 22 takes out one substrate G from the predetermined cassette C on the stage 20,
It is carried into the excimer UV irradiation unit (e-UV) 41 of the cleaning process section 24 of the process station (P / S) 16 (step S1).

Excimer UV irradiation unit (e-UV) 4
In 1 the substrate G is subjected to dry cleaning by UV irradiation (step S2). This ultraviolet cleaning mainly removes organic substances on the substrate surface. After the UV cleaning is completed, the substrate G is transferred to the scrubber cleaning unit (SCR) 42 of the cleaning process unit 24 by the transfer mechanism 22 of the cassette station (C / S) 14.

In the scrubber cleaning unit (SCR) 42, as described above, the substrate G is brushed on the upper surface (processed surface) of the substrate G while being horizontally conveyed by the roller conveyance or belt conveyance in the horizontal direction in the process line A direction. By performing cleaning or blow cleaning, particulate dirt is removed from the substrate surface (step S3). Then, after cleaning, the substrate G is subjected to a rinsing treatment while being conveyed in a uniform flow, and finally the substrate G is dried using an air knife or the like.

The substrate G, which has been cleaned in the scrubber cleaning unit (SCR) 42, passes through the pass unit (P) in the upstream multi-stage unit (TB) 44 of the first thermal processing section 26.
ASS) 50.

In the first thermal processing section 26, the substrate G is rotated by the transfer mechanism 46 in a predetermined unit in a predetermined sequence. For example, the substrate G may be first processed from the pass unit (PASS) 50 to the heating unit (DHP) 52, 5
It is moved to one of 4 and undergoes dehydration treatment there (step S4). Next, the substrate G is cooled by the cooling unit (COL) 6
It is moved to one of the Nos. 2 and 64 and cooled there to a constant substrate temperature (Step S5). Thereafter, the substrate G is transferred to the adhesion unit (AD) 56, where it is subjected to a hydrophobic treatment (step S6). After the completion of the hydrophobic treatment, the substrate G is cooled by one of the cooling units (COL) 62, 64.
Then, it is cooled to a constant substrate temperature (step S7).
Finally, the substrate G is transferred to the pass unit (PASS) 50 belonging to the downstream multi-stage unit section (TB) 48.

As described above, in the first thermal processing section 26, the substrate G has the multi-stage unit section (TB) 44 on the upstream side and the multi-stage unit section (TB) on the downstream side via the transfer mechanism 46.
You can go back and forth between the 48 and the other. The second and third thermal processing units 30 and 36 can perform the same substrate transfer operation.

The substrate G which has been subjected to the series of thermal or thermal processing as described above in the first thermal processing section 26 is a pass unit (PASS) in the downstream multi-stage unit section (TB) 48.
From 60, it is moved to the resist coating unit (CT) 82 of the coating process unit 28 on the downstream side.

The substrate G is a resist coating unit (CT) 8
In 2, the resist solution is applied to the upper surface (the surface to be processed) of the substrate by, for example, the spin coating method, and immediately after that, the vacuum drying unit (VD) 84 adjacent on the downstream side is subjected to the drying processing under reduced pressure,
Next to the downstream edge remover unit (ER) 8
In step 6, excess (unnecessary) resist on the peripheral portion of the substrate is removed (step S8).

The substrate G that has undergone the resist coating process as described above passes from the vacuum drying unit (VD) 84 to the pass unit (TB) 88 belonging to the upstream multi-stage unit (TB) 88 of the second thermal processing unit 30 adjacent thereto. PASS).

In the second thermal processing section 30, the substrate G is rotated by the transfer mechanism 90 in a predetermined sequence in a predetermined unit. For example, the substrate G is the first from the pass unit (PASS) to the heating unit (PREBAKE).
And is subjected to baking after resist application (step S9). Next, the substrate G is transferred to one of the cooling units (COL) and cooled there to a constant substrate temperature (step S10). Thereafter, the substrate G is transferred to the path unit (PA) on the downstream multi-stage unit (TB) 92 side.
It is transferred to the extension / cooling stage (EXT / COL) 106 on the side of the interface station (I / F) 18 via the SS) or not.

Interface station (I / F) 1
8, the substrate G is moved from the extension / cooling stage (EXT / COL) 106 to the peripheral device 110.
Is carried into the peripheral exposure apparatus (EE), where it is exposed to remove the resist adhering to the peripheral portion of the substrate G during development, and then sent to the adjacent exposure apparatus 12 (step S11).

In the exposure device 12, a predetermined circuit pattern is exposed on the resist on the substrate G. Then, the substrate G that has undergone the pattern exposure is returned from the exposure device 12 to the interface station (I / F) 18 (step S1).
1) First, the peripheral device 110 Titler (TITLRE
R), where predetermined information is written on a predetermined portion on the substrate (step S12). After that, the substrate G is mounted on the extension / cooling stage (EXT / CO).
L) 106. Substrate G Transport and Exposure Apparatus 1 at Interface Station (I / F) 18
The transfer device 104 exchanges the substrate G with the substrate 2.

In the process station (P / S) 16, the transfer mechanism 90 in the second thermal processing section 30 has an extension / cooling stage (EXT / COL).
The exposed substrate G is received from 106 and is transferred to the development process section 32 via the pass unit (PASS) in the multi-stage unit section (TB) 92 on the process line B side.

In the developing process section 32, the substrate G received from the pass unit (PASS) in the multi-stage unit section (TB) 92 is carried into the developing unit (DEV) 94. In the developing unit (DEV) 94, the substrate G is conveyed toward the downstream of the process line B in a flat flow system, and a series of development processing steps of developing, rinsing and drying are performed during the conveyance (step S13).

The substrate G which has been subjected to the development processing in the development processing section 32 is carried into the adjacent decolorization processing section 34 on the downstream side, where it is subjected to the decolorization processing by i-ray irradiation (step S14).
The substrate G that has been subjected to the decolorization treatment is passed through the pass unit (P) in the upstream multi-stage unit (TB) 98 of the third thermal treatment unit 36.
ASS).

In the third thermal processing section (TB) 98,
The substrate G is first transferred from the pass unit (PASS) to one of the heating units (POBAKE), where it is post-baked (step S15). Next, the substrate G
Is transferred to the pass cooling unit (PASS COL) in the downstream multi-stage unit (TB) 102, where it is cooled to a predetermined substrate temperature (step S16). Third
The transfer of the substrate G in the thermal processing section 36 is performed by the transfer mechanism 10.
Performed by 0.

On the cassette station (C / S) 14 side, the transfer mechanism 22 transfers the substrate G from the pass cooling unit (PASS / COL) of the third thermal processing section 36 to which all the steps of coating / developing processing have been completed. The received substrate G is received and accommodated in any one of the cassettes C (step S
1).

In the coating and developing treatment system 10, the present invention can be applied to the scrubber cleaning unit (SCR) 42 of the cleaning process unit 24, for example. Hereinafter, an embodiment in which the present invention is applied to a scrubber cleaning unit (SCR) 42 will be described with reference to FIGS. 4 to 12.

FIG. 4 shows the overall construction of the scrubber cleaning unit (SCR) 42 according to one embodiment of the present invention. The scrubber cleaning unit (SCR) 42 has a roller-conveying type conveying path 114 in which conveying rollers 112 are laid in the horizontal direction (X direction) along the process line A, and partition walls are provided along the conveying path 114. Six blocks or modules M1 to M6 are continuously arranged in a row via 116.

Of these six modules M1 to M6,
The first module M1 located at the most upstream end constitutes the substrate loading section, the second module M2 constitutes the scrubbing cleaning processing section, the third module M3 constitutes the blow cleaning processing section, and the fourth module M3. The module M4 constitutes a rinse processing section, the fifth module M5 constitutes a drying processing section, and the sixth module M6, which is the last module, constitutes a substrate unloading section.

A plurality of lift pins capable of moving up and down for receiving the substrate G handed from a substrate transport mechanism (not shown) adjacent to the upstream side in a horizontal posture and transferring it onto the transport path 114 in the substrate loading section M1. 118 is provided. The substrate unloading section M6 is also provided with a plurality of lift pins 120 that can be raised and lowered to lift the substrate G in a horizontal posture and hand it to an adjacent substrate transfer mechanism (not shown).

In the scrubbing cleaning processing section M2, the chemical solution nozzle 122, the pre-wet cleaning spray tube 124, the scrubbing cleaning roll brushes 126 and 128, and the cleaning spray tube for cleaning are sequentially provided from the upstream side along the transport path 114. 130 etc. are arranged in a line. Further, at the downstream end or near the wall, an air curtain forming portion or an air blowing portion 13 for shutting off the atmosphere from the adjacent chamber (M3).
Two are provided.

In the blow cleaning processing section M3, a cleaning nozzle 134 composed of, for example, a two-fluid jet nozzle is provided in the transport path 1.
An air curtain forming portion 136 is provided above and below (in the illustrated example, a pair) with 14 sandwiched therebetween, and for shutting off the atmosphere from the adjacent chamber (M4) on the downstream side.

In the rinse processing section M4, the rinse nozzle 138 of this embodiment is arranged, and an air curtain forming section 140 for shutting off the atmosphere from the adjacent chamber (M5) on the downstream side is also provided.

In the drying processing section M5, liquid cutting air knives 142 are vertically arranged (two pairs in the illustrated example) with the transport path 114 interposed therebetween.

In the processing units M2 to M5, the transport path 114
Pans 144 and 14 for collecting the liquid that has fallen below
6, 148 and 150 are provided respectively. Pipes of a recovery system or a drainage system are connected to the drainage ports provided on the bottoms of the pans 144 to 150.

Here, this scrubber cleaning unit (SC
The overall operation and action of R) 42 will be described. The substrate loading unit M1 receives the substrates G one by one from an adjacent substrate transport mechanism (not shown) and transfers or loads them onto the transport path 114. Conveying roller 112 that constitutes the conveying path 114
Is a transmission mechanism (not shown) such as a rotary drive shaft or gear.
The motor is rotated in the forward direction by the driving force of an electric motor (not shown). Therefore, the substrate G placed on the transport path 112 is immediately transported to the adjacent scrubbing cleaning processing unit M2. Normally, the LCD substrate G is formed in a rectangular shape, and is transported on the transport path 114 in a direction in which the long side direction is parallel to the transport direction.

In the scrubbing cleaning processing section M2, the chemical liquid nozzle 122 first applies an acid or alkaline chemical liquid to the upper surface (processed surface) of the substrate G transported on the transport path 114. Immediately after spraying on the entire surface, the cleaning spray pipe 124 sprays a cleaning liquid for prewetting, for example, pure water. Although not shown, the transport path 114
A similar chemical solution nozzle and a cleaning spray pipe may be disposed below the same to spray the chemical solution or the pre-wet solution onto the substrate G as well.

Then, the substrate G is covered with the roll brushes 126, 1
28 between the roll brushes 126, 1
28 scrapes off foreign matter (dust, debris, contaminants, etc.) on the surface to be processed and the back surface of the substrate G, respectively. Immediately after that, the cleaning spray tube 124 sprays a cleaning liquid, for example, pure water, onto the entire surface of the substrate G to be processed, and rinses foreign substances floating on the substrate.

When passing through the scrubbing cleaning section M2,
Substrate G then enters blow cleaning process M3. In the blow cleaning processing unit M3, the upper and lower cleaning nozzles 134 mix pressurized cleaning liquid (for example, pure water) and pressurized gas (for example, nitrogen) inside the nozzle to generate granular droplets, The generated droplets are jetted toward the upper and lower surfaces of the substrate G. In this way, the cleaning liquid in which the gas is dissolved collides with the surface of the substrate G, so that the foreign matter attached to or remaining on the substrate surface is removed.

Subsequent to the blow cleaning processing unit M3, the substrate G passes through the rinse processing unit M4. In the rinse processing unit M4, the rinse nozzle 138 moves the rinse liquid, for example, pure water, on the substrate G to be processed on the transfer path 114 in a horizontal posture in the transfer direction (X direction). Supply so that it flows diagonally or laterally. As a result, the liquid on the substrate G (liquid in which foreign matter is suspended) brought in from the blow cleaning processing unit M3 flows along with the rinse liquid and is swept out to the side, and is smoothly replaced by the rinse liquid. The transport path 1
It is also possible to provide a rinse nozzle (not shown) of the same type or a different type under 14 so that the rinse liquid is similarly applied toward the lower surface (back surface) of the substrate G.

Subsequent to the rinse processing section M4, the substrate G is sent to the drying processing section M5. In the drying processing section M5, the upper and lower air knives 142 apply a knife-like sharp gas flow, eg, air, to the upper and lower surfaces of the substrate G conveyed in a horizontal position on the conveyance path 114, whereby the entire surface of the substrate G is exposed. The rinse liquid is discharged from the back of the substrate (drained). It should be noted that, in order to prevent water scales partially or locally remaining on the substrate G after the drying process, pure water, for example, pure water is supplied from a pre-wetting nozzle (not shown) slightly upstream of the air knife 142. It is preferable to spray it on the upper surface or the entire surface of.

The substrate G drained in the drying processing section M5 is sent to the substrate unloading section M6 along the transport path 114 as it is. The substrate carry-out section M6 has the same configuration as the substrate carry-in section M1 and operates in the same manner as the substrate carry-in section M1 except that the substrate transfer procedure is reversed between carry-in and carry-out. That is,
The substrate transfer lift pins 120 are made to stand by at a position lower than the transport path 114 so that the substrate G is on the upstream side (drying unit M5).
When the substrate G reaches a predetermined position directly above the lift pin 120, the lift pin 120 is pushed upward to lift the substrate G in a horizontal posture, and the substrate G is transferred to an adjacent substrate transfer mechanism (not shown).

Next, an example of the rinse nozzle 138 provided in the rinse processing section M4 of this embodiment will be described with reference to FIGS.

FIG. 5 shows a rinse nozzle 138 according to the first embodiment. The rinse nozzle 138 is composed of a V-shaped nozzle 160 composed of a pipe formed in a “V” shape or a “V” shape. A rinse liquid inlet 162 is provided at the top or bent portion of the V-shaped nozzle 160, and a rinse liquid supply pipe (not shown) is provided at the rinse liquid inlet 162.
Are connected. A plurality of outlets 164 are provided at regular intervals in the axial direction in both blade nozzle portions 160L and 160R that branch diagonally from the top of the V-shaped nozzle 160 to the left and right. In this embodiment, “left” and “right” are defined (as a reference) in the transport direction (X direction).

As shown in the figure, in the V-shaped nozzle 160, each discharge port 164 is oriented in the direction opposite to the progress of the substrate, preferably the top is located in the widthwise center of the transport path 114, and the left and right nozzles 160L and 160R are provided. It is horizontally arranged above (or below) the transport path 114 so as to cover the left half region and the right half region of the substrate G, respectively. Each discharge port 164
May be oriented at a predetermined angle toward the transport path 114 with respect to the horizontal plane.

Therefore, the substrate G is V on the transfer path 114.
When passing directly under the mold nozzle 160, the rinse liquid B is pressure-fed to the V-shaped nozzle 160 from the rinse liquid supply unit (not shown), and the rinse liquid is discharged or jetted toward the substrate G from each discharge port 164. It Then, the left nozzle 160L
The rinsing liquid B discharged from each of the discharge ports 164 of the right nozzle portion 160R flows diagonally to the left in the direction against the progress of the substrate as schematically shown by the arrow L on the substrate G, and each of the discharge ports 1 of the right nozzle portion 160R.
The rinse liquid B discharged from 64 flows obliquely to the right on the substrate G in a direction against the progress of the substrate as schematically shown by an arrow R.

In this configuration example, since the rinse liquid inlet is provided at the center of the V-shaped nozzle 160, the left and right nozzle portions 1
In each of 60L and 160R, the rinse liquid B is discharged with a larger pressure or flow rate toward the discharge port 164 closer to the center of the substrate. In this way, the former processing unit (blow cleaning processing unit M
3) The liquid A on the substrate G brought from the V-shaped nozzle 16
The rinse liquid B supplied from the left and right nozzle portions 160L and 160R of 0 is swept out to the left and right sides of the left half region and the right half region of the substrate surface to be processed. As a result, only the rinse liquid B remains on the substrate G on the downstream side of the V-shaped nozzle 160.

Thus, in this embodiment, the transport path 11
The V-shaped nozzle 160 supplies the rinse liquid B to the surface to be processed of the substrate G conveyed in a horizontal posture on the substrate 4 in such a manner that the rinse liquid B flows obliquely to the conveyance direction on the substrate G. Since the liquid A on the substrate G brought in from the processing section (M3) is swept (extruded) to the side or the side of the substrate by the flow of the rinse liquid B, the rinse liquid B can be easily and easily replaced. it can.

Further, in this embodiment, the surface to be processed on the substrate G is divided into left and right parts, the left half region is made to flow leftward by the left nozzle portion 160L of the V-shaped nozzle 160, and the right half region is made to flow. The right nozzle portion 16 of the V-shaped nozzle 160
Since the liquid is caused to flow to the right by 0R, the old liquid or the liquid to be replaced A existing in each part on the substrate can be efficiently swept out to the side. Moreover, since the rinse liquid B flows on the substrate G in a direction against the progress of the substrate by the left and right nozzle portions 160L and 160R of the V-shaped nozzle 160, the old liquid or the liquid to be replaced A on the substrate G is forcibly scraped out. Can be swept laterally or laterally more efficiently and better.

The V-shaped nozzle 1 in this embodiment is also used.
Since 60 requires a small space in the carrying direction,
This is advantageous for downsizing the device.

In this embodiment, the boundary line for dividing the replacement area on the substrate G into the right and left (the line parallel to the carrying direction and passing through the center of the V-shaped nozzle 160) is set in the center of the substrate.
It is also possible to offset to the left or right as appropriate. The rinse liquid introduction port of the nozzle 160 can be provided in an arbitrary number and in an arbitrary number.

Further, in this embodiment, in order to surely perform the liquid replacement even in the vicinity of the boundary line between the left and right regions on the substrate G,
In the V-shaped nozzle 160, the left and right nozzle portions 160L, 16
The discharge ports 164 and 164 near the top of the 0R may be arranged as close as possible. Alternatively, as shown in FIG. 6, a discharge port 164 may be provided at the top of the nozzle 160, and the rinse liquid B may be discharged from the top discharge port 164 in the direction opposite to the transport direction.

Further, as shown in FIG. 7, the V-shaped nozzle 16
In the left and right branch portions 160L and 160R of 0, the rinse liquid ejecting portion can be configured by the slit 166 extending in the axial direction. Further, as a modification of the first embodiment (FIGS. 5 to 7) described above, the left and right branch portions 160L and 160R of the V-shaped nozzle 160 may be configured as independent or separate nozzles.

FIG. 8 shows a rinse nozzle 138 according to the second embodiment. The rinse nozzle 138 has a pair of nozzles 168, 1 in the vicinity of the central portion in the width direction of the conveyance path toward the left direction and the right direction substantially orthogonal to the conveyance direction.
70 are arranged in parallel. The discharge ports of both nozzles 168 and 170 may be of a multi-mouth type or a slit type. Both nozzles 16
8 and 170 are connected to a rinse liquid supply unit (not shown) via a pipe (not shown).

One of the nozzles 168 discharges or jets the rinse liquid B in the left direction substantially perpendicular to the carrying direction, and the other nozzle 170 discharges the rinse liquid B in the right direction substantially perpendicular to the carrying direction. . As a result, in the left half region on the substrate G, the rinse liquid B from the nozzle 168 flows to the left so as to cross the substrate from the central portion of the substrate as schematically shown by the arrow L, and the rinse liquid B The old liquid or the liquid A to be replaced in each part is swept out to the left by the flow. On the other hand, the substrate G
In the upper right half region, as schematically shown by an arrow R, the rinse liquid B from the nozzle 170 flows to the right from the center of the substrate so as to traverse over the substrate, and the flow of the rinse liquid B causes each portion to be covered. The substitution liquid A is swept out to the right. Thus, on the downstream side of both nozzles 168 and 170, the rinse liquid B is deposited on the substrate G.
Only remains.

Arrangement positions of both nozzles 168 and 170 may be arbitrarily changed or adjusted. In particular, both nozzles 168,
By appropriately offsetting 170 in the width direction of the conveyance path,
The rinsing liquid B can be sufficiently applied to the vicinity of the boundary between the left and right regions on the substrate G to perform good replacement.

Alternatively, as shown in FIG. 9, the rinse liquid B may be discharged laterally from one nozzle 172 having discharge ports 172L and 172R on the left and right. In this case, in order to sufficiently apply the rinse liquid B also to the central portion of the substrate passing directly under the nozzle 172, the left and right discharge ports 17 are formed.
2L, 172R central discharge port provided on the upstream side
It is preferable that the rinse liquid B is discharged from 72C in a direction opposite to the transport direction or in a direction substantially perpendicular to the substrate surface.

As described above, in the second embodiment, the left and / or right sides of the surface of the substrate G conveyed in the horizontal posture on the conveyance path 114 are moved substantially at right angles to the conveyance direction. Nozzles (168, 170) with facing outlets,
172 supplies the rinse liquid B so as to flow on the substrate G in the lateral direction with respect to the transport direction, so that the liquid A to be replaced on the substrate G brought from the processing unit (M3) in the preceding stage is replaced with the rinse liquid B. Since the substrate is swept out laterally or laterally by the flow, the rinse liquid B can be replaced easily and easily.

Furthermore, in the second embodiment, the surface to be processed on the substrate G is divided into two parts to the left and right with respect to the carrying direction, and the left half region is leftwardly moved by the nozzle 168 or the nozzle discharge port 172L. The nozzle 170 or the nozzle outlet 172R facing right in the right half area
As a result, the liquid is swept out to the right, so that the liquid A to be replaced existing in each part on the substrate can be swept out to the side of the substrate efficiently.

Also in the second embodiment, the boundary line that divides the surface to be processed on the substrate G into the right and left is not limited to the vicinity of the central portion of the substrate, and can be appropriately offset to the left or right.

FIG. 10 shows a rinse nozzle 138 according to the third embodiment. The rinse nozzle 138 is used for the transport path 1.
A plurality of nozzles 174, 176, for example, two nozzles 174, 176 are arranged in series in a direction traversing 14. More specifically, the nozzle 174 sprays the rinse liquid B from the left side to the right side of the transport path 114, and the rinse liquid B sprayed from the nozzle 174 hits the left end portion of the substrate G and crosses the substrate G rightward. Flow like you do. Nozzle 176 is transport path 1
The rinse liquid B is sprayed rightward from above 14 to the nozzle 1
The rinse liquid B sprayed from 76 hits the substrate center of the substrate G, merges with the flow of the rinse liquid B from the nozzle 174 side, and flows across the substrate G to the right. Thus, the nozzle 17 on the upstream side in the direction traversing the substrate G is
4. The flow of the rinse liquid B from the nozzle 176 on the downstream side is multiplexed or merged with the flow of the rinse liquid B from No. 4 to enhance the flow of the rinse liquid B and satisfactorily sweep out the liquid A to be replaced. You can In this embodiment, the number of nozzles arranged in series is not limited to two, and three or more nozzles are also possible.

FIG. 11 shows a rinse nozzle 138 according to the fourth embodiment. The rinse nozzle 138 is used for the transport path 1.
Nozzle 178 for injecting rinsing liquid B rightward toward the surface to be processed of substrate G from the side near 14 and nozzle 1,
And a spray tube type nozzle 180 that applies a fluid, for example, the rinse liquid B from the side (upstream and / or downstream side in the transport direction) to the transverse flow of the rinse liquid B formed on the substrate G by 78. It

In this structure, by forming a fluid curtain on the substrate G by the nozzle 180, the flow of the rinse liquid B from the nozzle 178 side is rectified in the lateral direction (preventing the spread), and the substrate G is removed. The lateral sweeping out of the liquid to be replaced A can be favorably performed. Moreover,
The same liquid as the nozzle 178 (rinse liquid B) is applied to the nozzle 180.
Since it is supplied more, the effect of enhancing the flow of the rinse liquid B from the nozzle 178 side can also be obtained.

It is also possible to arrange the nozzle 180 only on one side. Further, the fluid discharged from the nozzle 180 may be gas such as air or nitrogen gas.

FIG. 12 shows a rinse nozzle 138 according to the fifth embodiment. The rinse nozzle 138 is composed of a spray tube type nozzle 182 that is provided above the transport path 114 so as to cross the substrate G obliquely. This nozzle 1
A large number of discharge ports 184 are provided at a constant interval in the axial direction on the side surface of the side opposite to the conveying direction of 82. These ejection ports 184 eject or eject the rinse liquid B toward the surface to be processed of the substrate G in an oblique direction (left oblique direction in the illustrated example) in a direction counter to the progress of the substrate. The rinse liquid B ejected from each of the ejection ports 184 flows diagonally to the left on the substrate G in a direction against the progress of the substrate as schematically shown by an arrow L. In this case, it is preferable to increase the discharge pressure or flow rate of the discharge port 184 toward the right end side, and the rinse liquid introduction port 186 of the nozzle 182 may be provided at the right end portion.

Further, in this embodiment, at the right end of the nozzle 182, one or a plurality of discharge ports 188 facing the downstream side in the carrying direction are provided. The rinse liquid B discharged from the discharge port 188 crosses the right end portion of the substrate G and flows out of the substrate, and the liquid to be replaced B remaining at the right end portion of the substrate is swept out to the right.

The configuration of each part in the above-described embodiment is an example, and various modifications can be made not only to the rinse nozzle 138 but also to other parts in the scrubber cleaning unit (SCR) 42. In the above-described embodiment, the roller conveying type conveying path 114 is configured by laying the conveying rollers 112 in the horizontal direction. In such a roller transport type transport path, a substrate transport roller may be attached at an intermediate position between the pair of transport rollers 112, 112 facing each other. Further, a belt-conveying type conveying path in which a pair of belts are laid horizontally in a certain interval is also possible.

In the middle of the conveying path, for example, the rinse processing unit M
It is also possible to stop or convey the substrate G in a tilted state within 4. In that case, gravity is added to the liquid replacement method of the present invention.

Although the above-described embodiment relates to the scrubber cleaning unit or the cleaning processing apparatus, the present invention can be applied to a substrate processing apparatus other than the cleaning processing apparatus. For example, the coating and developing processing system as described above. In, it is also applicable to the developing unit (DEV) 94. That is, the same liquid replacement process as that in the above-described embodiment can be performed in the final rinse section on the downstream side of the development stopping rinse section on the transport path in the developing unit (DEV) 94. Further, the present invention can be applied to the replacement of any liquid other than the rinse liquid. The substrate to be processed in the present invention is not limited to the LCD substrate, but includes any substrate to be processed that requires liquid replacement during processing.

[0093]

As described above, according to the substrate processing apparatus of the present invention, the liquid on the substrate to be processed can be efficiently and satisfactorily replaced in the flat flow system.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of a coating and developing treatment system to which a substrate treating apparatus of the present invention can be applied.

FIG. 2 is a side view showing a configuration of a thermal processing unit in the coating and developing processing system.

FIG. 3 is a flowchart showing a processing procedure in the coating and developing processing system.

FIG. 4 is a front view showing the overall configuration of a scrubber cleaning unit in the embodiment.

FIG. 5 is a plan view showing the configuration of a rinse nozzle according to the first embodiment.

FIG. 6 is a plan view showing the configuration of a rinse nozzle according to a modification of the first embodiment.

FIG. 7 is a plan view showing the configuration of a rinse nozzle according to a modification of the first embodiment.

FIG. 8 is a plan view showing a configuration of a rinse nozzle according to a second embodiment.

FIG. 9 is a plan view showing the configuration of a rinse nozzle according to a modification of the second embodiment.

FIG. 10 is a plan view showing a configuration of a rinse nozzle according to a third embodiment.

FIG. 11 is a plan view showing a configuration of a rinse nozzle according to a fourth embodiment.

FIG. 12 is a plan view showing the configuration of a rinse nozzle according to a fifth embodiment.

[Explanation of symbols]

10 Coating and developing system 16 (P / S) process station 24 Cleaning process section 42 Scrubber cleaning unit 112 Conveyor roller 114 transport path M4 rinse processing section 138 Rinse nozzle 160 V type nozzle 160L left nozzle 160R right nozzle 164 Discharge port 166 Slit (Discharge part) 168, 170, 172 nozzles 174,176,178 nozzles 180 nozzles 182 nozzles

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hiroshi Nagata             TBS release, 5-3-6 Akasaka, Minato-ku, Tokyo             Sending Center Tokyo Electron Limited (72) Inventor Kenya Shinozaki             TBS release, 5-3-6 Akasaka, Minato-ku, Tokyo             Sending Center Tokyo Electron Limited F-term (reference) 2H088 FA21 FA23 FA25 FA30 HA01                       MA20                 2H090 JC07 JC19                 3B201 AA02 AB14 AB44 BA02 BB88                       BB90 BB93 BC01 CB15 CC01                       CC12 CC15                 4D075 AC07 AC09 AC13 AC72 AC74                       AC93 BB65Z CA47 DA06                       DB13 DC24 EA06 EA07 EA45                 4F042 AA02 AA10 BA08 DA01 DF16                       EB25

Claims (14)

[Claims] 1. A substrate processing method for replacing a first liquid with a second liquid on a substrate to be processed, wherein the substrate is conveyed horizontally with the surface to be processed of the substrate facing upward, The second liquid is supplied to the surface to be processed so as to flow obliquely or laterally with respect to the transfer direction on the substrate, and the first liquid flows from the substrate on the second liquid. Substrate processing method that sweeps out in the direction. 2. The substrate processing method according to claim 1, wherein the second liquid is caused to flow obliquely to the left side or the right side in a direction against the progress of the substrate on the substrate. 3. The processed surface region on the left side of a boundary line set parallel to the transport direction on the substrate is the second surface.
Liquid is flown diagonally to the left in the direction against the advance of the substrate, and the second liquid is flown diagonally to the right in the direction against the advance of the substrate for the surface area to be processed on the right side of the boundary line. The substrate processing method according to claim 1. 4. The processed surface region on the left side of a boundary line set parallel to the transport direction on the substrate is the second surface.
2. The substrate processing method according to claim 1, wherein said liquid is laterally flowed to the left side, and said second liquid is laterally flowed to the processed surface region on the right side of said boundary line. 5. The substrate processing method according to claim 1, wherein the second liquid is caused to flow across the substrate from one side end portion of the substrate to the other side end portion thereof. 6. The second substrate from one side edge of the substrate.
3. The substrate processing method according to claim 2, wherein a new flow of the second liquid is added midway on the substrate to the flow of the liquid. 7. The substrate processing method according to claim 1, wherein a fluid for rectifying the flow of the second liquid in a desired direction is supplied onto the substrate. 8. A transport path for horizontally transporting a substrate to be processed with the surface to be processed facing upward, and a surface to be processed of the substrate on the transport path in which the first liquid is present. Liquid supply means for supplying the second liquid so as to flow obliquely or laterally with respect to the transport direction on the substrate, and the first liquid flows on the substrate in the direction in which the second liquid flows. A substrate processing apparatus that sweeps out to a second liquid and replaces it with a second liquid. 9. The second liquid supply means is arranged in an oblique direction with respect to the transfer direction in a direction against the progress of the substrate from above the transfer path toward the surface to be processed of the substrate. The substrate processing apparatus according to claim 8, further comprising a jetting nozzle. 10. The liquid supply means sets the second liquid to the left in a direction against the progress of the substrate with respect to a surface area to be processed on the left side of a boundary line set parallel to the transport direction on the substrate. A first nozzle portion that jets and flows in an oblique direction, and jets the second liquid in a right diagonal direction against the progress of the substrate to a surface area to be processed on the right side of the boundary line on the substrate. 9. The substrate processing apparatus according to claim 8, further comprising a second nozzle portion that flows in a flowing manner. 11. The liquid supply means jets the second liquid laterally to the left side of a surface to be processed on the left side of a boundary line set parallel to the transport direction on the substrate and flows the second liquid. 9. A third nozzle section and a fourth nozzle section which jets the second liquid laterally to the right side of the boundary line on the substrate and jets the second liquid to the right side. The substrate processing apparatus according to. 12. The substrate processing apparatus according to claim 8, wherein the liquid supply unit includes a fifth nozzle unit that jets the second liquid from the side of the transport path toward the surface to be processed of the substrate. . 13. The surface to be processed of the substrate from above the transfer path in order that the liquid supply means enhances the flow of the second liquid supplied onto the substrate from the fifth nozzle portion. 13. The substrate processing apparatus according to claim 12, further comprising a sixth nozzle portion that jets and flows the second liquid toward the nozzle. 14. The substrate processing apparatus according to claim 8, further comprising means for ejecting a fluid for rectifying the flow of the second liquid in a desired direction on the substrate.