JP4218816B2 - 針荷重測定方法、検査方法及び検査装置 - Google Patents

針荷重測定方法、検査方法及び検査装置 Download PDF

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Publication number
JP4218816B2
JP4218816B2 JP2000036361A JP2000036361A JP4218816B2 JP 4218816 B2 JP4218816 B2 JP 4218816B2 JP 2000036361 A JP2000036361 A JP 2000036361A JP 2000036361 A JP2000036361 A JP 2000036361A JP 4218816 B2 JP4218816 B2 JP 4218816B2
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Japan
Prior art keywords
mounting table
amount
overdrive
needle load
probes
Prior art date
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Expired - Fee Related
Application number
JP2000036361A
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English (en)
Japanese (ja)
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JP2001228212A5 (enExample
JP2001228212A (ja
Inventor
清 竹腰
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2000036361A priority Critical patent/JP4218816B2/ja
Priority to US09/776,686 priority patent/US20010013787A1/en
Priority to KR1020010007206A priority patent/KR100618747B1/ko
Publication of JP2001228212A publication Critical patent/JP2001228212A/ja
Priority to US10/360,811 priority patent/US6707310B2/en
Publication of JP2001228212A5 publication Critical patent/JP2001228212A5/ja
Application granted granted Critical
Publication of JP4218816B2 publication Critical patent/JP4218816B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2000036361A 2000-02-15 2000-02-15 針荷重測定方法、検査方法及び検査装置 Expired - Fee Related JP4218816B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2000036361A JP4218816B2 (ja) 2000-02-15 2000-02-15 針荷重測定方法、検査方法及び検査装置
US09/776,686 US20010013787A1 (en) 2000-02-15 2001-02-06 Needle load measuring method, needle load setting method and needle load detecting mechanism
KR1020010007206A KR100618747B1 (ko) 2000-02-15 2001-02-14 프로브 장치, 침 하중 측정 방법 및 피검사체의 전기 특성 검사 방법
US10/360,811 US6707310B2 (en) 2000-02-15 2003-02-10 Needle load measuring method, needle load setting method and needle load detecting mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000036361A JP4218816B2 (ja) 2000-02-15 2000-02-15 針荷重測定方法、検査方法及び検査装置

Publications (3)

Publication Number Publication Date
JP2001228212A JP2001228212A (ja) 2001-08-24
JP2001228212A5 JP2001228212A5 (enExample) 2007-04-19
JP4218816B2 true JP4218816B2 (ja) 2009-02-04

Family

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Family Applications (1)

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JP2000036361A Expired - Fee Related JP4218816B2 (ja) 2000-02-15 2000-02-15 針荷重測定方法、検査方法及び検査装置

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Country Link
US (2) US20010013787A1 (enExample)
JP (1) JP4218816B2 (enExample)
KR (1) KR100618747B1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003168707A (ja) * 2001-11-30 2003-06-13 Tokyo Electron Ltd プローブ装置
US7368929B2 (en) * 2006-01-18 2008-05-06 Electroglas, Inc. Methods and apparatuses for improved positioning in a probing system
KR100981648B1 (ko) * 2006-02-23 2010-09-10 씨에스전자(주) 수동식 반도체 웨이퍼 검사장치
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
JP2008272931A (ja) * 2007-04-30 2008-11-13 Suss Microtec Test Systems Gmbh 運動装置を制御する装置と方法
US7573283B2 (en) * 2007-06-19 2009-08-11 Suss Micro Tec Test Systems Gmbh Method for measurement of a device under test
JP4999615B2 (ja) * 2007-08-31 2012-08-15 東京エレクトロン株式会社 検査装置及び検査方法
JP5221118B2 (ja) * 2007-12-14 2013-06-26 東京エレクトロン株式会社 検査装置
KR101032959B1 (ko) * 2009-05-20 2011-05-09 주식회사 쎄믹스 웨이퍼 프로버의 니들 클리너 위치제어장치 및 위치제어방법
JP5213930B2 (ja) * 2010-09-27 2013-06-19 要一 手塚 ピックル液注入方法及びその装置
CN102721487A (zh) * 2011-03-31 2012-10-10 旺矽科技股份有限公司 探针针压监测方法
US8659308B1 (en) * 2012-10-09 2014-02-25 Rudolph Technolgies, Inc. Selective overtravel during electrical test of probe cards
KR20190052533A (ko) * 2017-11-08 2019-05-16 삼성전자주식회사 기판 지지 및 이송 장치, 기판 지지 및 이송 방법 및 이를 이용한 표시 장치의 제조 방법
JP7421990B2 (ja) * 2020-04-08 2024-01-25 株式会社日本マイクロニクス 電気的接続装置および検査方法
JP7714392B2 (ja) * 2021-07-01 2025-07-29 株式会社日本マイクロニクス 検査装置、位置調整ユニット及び位置調整方法
JP7773620B2 (ja) * 2022-03-10 2025-11-19 株式会社Fuji プラズマ照射装置及びプラズマ処理液体製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6465848A (en) 1987-09-04 1989-03-13 Canon Kk Alignment
JP3208734B2 (ja) 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
JPH06124982A (ja) * 1992-01-14 1994-05-06 Mitsubishi Electric Corp 半導体試験装置
JP3219844B2 (ja) 1992-06-01 2001-10-15 東京エレクトロン株式会社 プローブ装置
JP3163221B2 (ja) * 1993-08-25 2001-05-08 東京エレクトロン株式会社 プローブ装置
JP2818363B2 (ja) 1993-08-31 1998-10-30 株式会社東芝 半導体製造装置
KR100248569B1 (ko) 1993-12-22 2000-03-15 히가시 데쓰로 프로우브장치
JP3138908B2 (ja) * 1995-03-20 2001-02-26 東京エレクトロン株式会社 プローブ装置
US5777485A (en) 1995-03-20 1998-07-07 Tokyo Electron Limited Probe method and apparatus with improved probe contact
US5773987A (en) 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
US5872458A (en) 1996-07-08 1999-02-16 Motorola, Inc. Method for electrically contacting semiconductor devices in trays and test contactor useful therefor
JP3639887B2 (ja) 1997-01-30 2005-04-20 東京エレクトロン株式会社 検査方法及び検査装置
JP3423979B2 (ja) 1997-07-11 2003-07-07 東京エレクトロン株式会社 プローブ方法及びプローブ装置
JP2000252304A (ja) 1999-03-02 2000-09-14 Toshiba Corp 半導体製造装置

Also Published As

Publication number Publication date
KR100618747B1 (ko) 2006-08-31
US20010013787A1 (en) 2001-08-16
US20030117160A1 (en) 2003-06-26
KR20010082618A (ko) 2001-08-30
JP2001228212A (ja) 2001-08-24
US6707310B2 (en) 2004-03-16

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