JP4208775B2 - 光電信号検出器 - Google Patents
光電信号検出器 Download PDFInfo
- Publication number
- JP4208775B2 JP4208775B2 JP2004186836A JP2004186836A JP4208775B2 JP 4208775 B2 JP4208775 B2 JP 4208775B2 JP 2004186836 A JP2004186836 A JP 2004186836A JP 2004186836 A JP2004186836 A JP 2004186836A JP 4208775 B2 JP4208775 B2 JP 4208775B2
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- Prior art keywords
- plate
- signal detector
- photodetector
- electronic cooling
- photoelectric signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000001816 cooling Methods 0.000 claims description 45
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 4
- 239000008103 glucose Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012503 blood component Substances 0.000 description 1
- 210000001124 body fluid Anatomy 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
子が電気的に連結される配線層が形成され、さらに望ましくは、前記温度センサーは前記
配線層に直接連結され、前記光センサーはTO缶タイプである。
前記本発明の光電信号検出器において、前記ヘッドは缶タイプであることが望ましい。
また、熱抵抗の高い断熱材料で形成され、前記光検出器と前記電子冷却素子とを所定の開口部を除いて覆い、前記第2プレートをヒートシンクに密着させるようにして固定する固定部材を更に備えることが望ましい。
図1は、本発明による光電信号検出器の概略的斜視図であり、図2は、図1に示された本発明による光電信号検出器の概略的断面図である。
図1ないし図3を参照すれば、TO缶タイプの光検出器10が電子冷却装置20上に固定されており、前記光検出器10及び電子冷却装置20は断熱材料で形成されたブラケット30により保護されている。
21 吸熱側の第1プレート
21a、22a 貫通孔
22 放熱側の第2プレート
22b 配線層
23 電子冷却素子
23a 第1リード
50 温度センサー
50a 第2リード
Claims (6)
- 光信号を電気的信号に変換する光電変換素子を備えた光検出器と、
前記光検出器が密着して配設される吸熱側第1プレートと、前記吸熱側第1プレートに対向する放熱側第2プレートと、前記第1プレートと第2プレートと間に多数配列される熱電冷却素子とからなり、前記光検出器から突出する複数のリードを、前記第1プレートから第2プレートを抜けて導出させるべく前記第1プレートと前記第2プレートに形成された複数の貫通孔を有する電子冷却素子と、
前記電子冷却素子の前記第1プレートの内面に密着させて取り付けられた温度センサーと、
を具備することを特徴とする光電信号検出器。 - 前記光検出器は前記光電変換素子が内蔵されるヘッドとそれを支持するベース及び前記光電変換素子に電気的に連結されるものであって、前記ベースから延びる複数のリードを備えることを特徴とする請求項1に記載の光電信号検出器。
- 前記第1プレートの内面には前記電子冷却素子が電気的に連結される配線層が形成されていることを特徴とする請求項1に記載の光電信号検出器。
- 前記温度センサーは前記配線層に直接連結されることを特徴とする請求項3に記載の光電信号検出器。
- 前記光検出器はTO缶タイプであることを特徴とする請求項1または2に記載の光電信号検出器。
- 熱抵抗の高い断熱材料で形成され、前記光検出器と前記電子冷却素子とを所定の開口部を除いて覆い、前記第2プレートをヒートシンクに密着させるようにして固定する固定部材を更に備えることを特徴とする請求項1に記載の光電信号検出器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0042130A KR100513728B1 (ko) | 2003-06-26 | 2003-06-26 | 광전 신호 검출기 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005020003A JP2005020003A (ja) | 2005-01-20 |
JP4208775B2 true JP4208775B2 (ja) | 2009-01-14 |
Family
ID=33411789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004186836A Expired - Fee Related JP4208775B2 (ja) | 2003-06-26 | 2004-06-24 | 光電信号検出器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6995931B2 (ja) |
EP (1) | EP1491868B1 (ja) |
JP (1) | JP4208775B2 (ja) |
KR (1) | KR100513728B1 (ja) |
DE (1) | DE602004003745T2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080087316A1 (en) * | 2006-10-12 | 2008-04-17 | Masa Inaba | Thermoelectric device with internal sensor |
JP4905185B2 (ja) * | 2007-03-07 | 2012-03-28 | ヤマハ株式会社 | 熱電モジュール |
KR101378297B1 (ko) * | 2010-09-06 | 2014-03-27 | 한국전자통신연구원 | 냉각기를 구비하는 광 송신 장치 |
US9465049B2 (en) * | 2012-04-13 | 2016-10-11 | James B. Colvin | Apparatus and method for electronic sample preparation |
JP6049489B2 (ja) * | 2013-02-15 | 2016-12-21 | 三菱電機株式会社 | 光源モジュール |
CN111016756B (zh) | 2014-02-14 | 2023-08-08 | 金瑟姆股份公司 | 传导对流气候控制组件 |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
EP3726594B1 (en) | 2014-11-14 | 2022-05-04 | Gentherm Incorporated | Heating and cooling technologies |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
KR101875902B1 (ko) * | 2016-05-13 | 2018-07-06 | 티엠에스테크 주식회사 | 열전소자 및 열전소자 제조 방법 |
US10908208B2 (en) * | 2017-01-13 | 2021-02-02 | ams Sensors Singapore. Pte. Ltd. | Apparatus for testing an optoelectronic device and method of operating the same |
US20200035898A1 (en) | 2018-07-30 | 2020-01-30 | Gentherm Incorporated | Thermoelectric device having circuitry that facilitates manufacture |
JP2022511801A (ja) | 2018-11-30 | 2022-02-01 | ジェンサーム インコーポレイテッド | 熱電調整システム及び方法 |
US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
DE102020120167A1 (de) | 2020-07-30 | 2022-02-03 | Schott Ag | Gehäuse, vorzugsweise TO-Gehäuse, Sockel für Gehäuse und Baugruppe mit einem solchen Gehäuse und/oder Sockel |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4611124A (en) * | 1984-06-13 | 1986-09-09 | The United States Of America As Represented By The Secretary Of The Air Force | Fly's eye sensor nonlinear signal processing |
JPH02221823A (ja) | 1989-02-22 | 1990-09-04 | Hitachi Ltd | 光度計 |
US6509520B1 (en) * | 1995-06-07 | 2003-01-21 | Raytheon Company | High strength composite thermoelectric cooler and method for making same |
KR970059716A (ko) | 1996-01-10 | 1997-08-12 | 권문구 | 분포형 광온도센서 |
US5918469A (en) * | 1996-01-11 | 1999-07-06 | Silicon Thermal, Inc. | Cooling system and method of cooling electronic devices |
US5704212A (en) * | 1996-09-13 | 1998-01-06 | Itronix Corporation | Active cooling system for cradle of portable electronic devices |
US6230497B1 (en) * | 1999-12-06 | 2001-05-15 | Motorola, Inc. | Semiconductor circuit temperature monitoring and controlling apparatus and method |
KR20020035961A (ko) | 2000-11-07 | 2002-05-16 | 송문섭 | 전자냉각소자를 이용한 이동통신단말기 내 전력증폭기의온도제어장치 |
US20020121094A1 (en) * | 2001-03-02 | 2002-09-05 | Vanhoudt Paulus Joseph | Switch-mode bi-directional thermoelectric control of laser diode temperature |
US7403347B2 (en) * | 2002-04-04 | 2008-07-22 | The Furukawa Electric Co., Ltd. | Optical transmission module with temperature control |
-
2003
- 2003-06-26 KR KR10-2003-0042130A patent/KR100513728B1/ko active IP Right Grant
-
2004
- 2004-04-07 DE DE602004003745T patent/DE602004003745T2/de not_active Expired - Lifetime
- 2004-04-07 EP EP04252079A patent/EP1491868B1/en not_active Expired - Lifetime
- 2004-04-26 US US10/831,121 patent/US6995931B2/en not_active Expired - Lifetime
- 2004-06-24 JP JP2004186836A patent/JP4208775B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE602004003745T2 (de) | 2007-10-11 |
EP1491868A1 (en) | 2004-12-29 |
EP1491868B1 (en) | 2006-12-20 |
US20040264009A1 (en) | 2004-12-30 |
KR100513728B1 (ko) | 2005-09-08 |
DE602004003745D1 (de) | 2007-02-01 |
US6995931B2 (en) | 2006-02-07 |
JP2005020003A (ja) | 2005-01-20 |
KR20050001795A (ko) | 2005-01-07 |
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