JP4206372B2 - Peeling device - Google Patents

Description

The present invention relates to a stripping equipment.

  A liquid crystal display device adjusts the transmittance of light from a backlight or the like by changing the alignment state of liquid crystal molecules of a liquid crystal layer sandwiched between a pair of electrode substrates according to an applied voltage between the electrode substrates, and thereby displays an image. To display.

  By the way, an alignment film is interposed between the electrode substrate and the liquid crystal layer, and the liquid crystal molecules of the liquid crystal layer are aligned in a certain direction as a whole by this alignment film. For example, in the case of a horizontal alignment film, the liquid crystal molecules try to lie on the electrode substrate surface without being inclined or standing vertically.

  This alignment film is generally formed by printing polyimide resin with a flexographic printing apparatus.

  FIG. 2 is a schematic configuration diagram of the flexographic printing apparatus 30.

  The flexographic printing apparatus 30 includes a columnar doctor roll 25, a columnar anilox roll 24 provided so as to be in contact with the doctor roll 25 obliquely below the doctor roll 25, a doctor roll 25, and an anilox roll 24. A dispenser 26 provided above, a cylindrical plate cylinder 23 provided in contact with the anilox roll 4 on the side of the doctor roll 3 obliquely below the anilox roll 24, and a peripheral wall on the outer side of the plate cylinder 23. A partially mounted resin relief plate 22 and an application table 21 provided so that the resin relief plate 22 of the plate cylinder 23 and the application surface (surface of the electrode substrate 5a) are in contact with each other are provided.

  The application table 21 is configured to reciprocate in parallel between the anilox roll 24 side (inlet side) and the plate cylinder 23 side (outlet side) as the plate cylinder 23 rotates.

And when printing a polyimide thin film using this flexographic printing apparatus 30, between the doctor roll 25 and the anilox roll 24 which rotate in a mutually reverse direction, the polyimide resin solution 27 is supplied along the rotation direction from the dispenser 26. By adding and supplying, the polyimide resin solution 27 is kneaded between the doctor roll 25 and the anilox roll 24 and held as a thin film on the surface of the anilox roll 24, and is transferred from the anilox roll 24 to the resin relief plate 22 on the plate cylinder 23. When the thin film-like polyimide resin solution 27 is transferred and the electrode substrate 5a fixed on the coating table 21 passes immediately below the plate cylinder 23, the thin-film polyimide resin solution 27 is transferred from the resin relief plate 22 to the electrode substrate 5a. Transfer-applied (printed) on the surface. Subsequently, by heating the electrode substrate 5a on which the polyimide resin solution 27 is transferred and applied, the solvent in the polyimide resin solution 27 is scattered to form the polyimide thin film 5b. (The alignment film is then formed by rubbing the surface of the polyimide resin thin film 5b.)
By the way, before printing a polyimide resin on an electrode substrate such as a TFT array substrate or a color filter substrate, it is necessary to test print the polyimide resin on several tens of glass substrates to stabilize the printing state.

  Since the test printing process is a process that should be carried out every time the product specifications of the electrode substrate and the replacement of the resin relief printing plate, a large amount of raw glass substrate on which a polyimide thin film is formed is generated in the manufacturing process of the liquid crystal display device. It will be. Therefore, a technique for removing (recycling) the raw glass substrate by removing the polyimide thin film from the raw glass substrate is important.

  As a method of removing the polyimide thin film from the raw glass substrate, a method of peeling the polyimide thin film from the raw glass substrate by peeling the raw glass substrate on which the polyimide thin film is formed with a peeling solution containing an inorganic alkaline aqueous solution is well known. It has been.

  FIG. 3 is a schematic configuration diagram of a general peeling apparatus 40 for peeling a polyimide thin film.

  The peeling device 40 includes a first peeling chamber 15a, a second peeling chamber 15b, and a rinsing chamber 16, a stripping solution tank 10a, and a rinsing water tank 10b, which are sequentially provided.

  Inside each of the 1st peeling chamber 15a and the 2nd peeling chamber 15b, the conveyance roller 2, the peeling tank 8a (8b), the shower nozzle 1a for peeling liquid, and the rotating brush 3 are provided.

  The stripping tank 8a (8b) and the stripping solution tank 10a are connected by a stripping solution pipe 14a.

  The stripping solution tank 10a and the stripping solution shower nozzle 1a are connected by a stripping solution pipe 14b, and a pump 11a and a filter 12a are provided on the stripping solution tank 14a side of the stripping solution pipe 14b.

  Inside the rinsing chamber 16, a transport roller 2, a rinsing tank 9, and a rinsing water shower nozzle 1b are provided.

  The rinsing tank 9 and the rinsing water tank 10b are connected by a rinsing water pipe 18a.

  The rinse water tank 10b and the rinse water shower nozzle 1b are connected by a rinse water pipe 18b, and a pump 11b and a filter 12b are provided on the rinse water tank 10b side of the rinse water pipe 18b.

  When the polyimide thin film is peeled off using the peeling device 40, the substrate surface of the raw glass substrate (processing substrate 5) on which the polyimide thin film is formed is carried on the carrying roller 2 in the peeling chambers 15a and 15b. A stripping solution 6 made of an inorganic alkaline aqueous solution such as sodium hydroxide is supplied to the (polyimide thin film forming side) from the shower nozzle 1 a in a shower form, and the polyimide thin film is peeled by brush cleaning with the rotating brush 3. Then, in the rinsing chamber 16, while the processing substrate 5 is transported on the transport roller 2, the rinsing water 7 is supplied to the upper surface (polyimide thin film forming side) from the rinsing water shower nozzle 1 b in a shower shape, thereby processing substrate. 5 is washed.

  The stripping solution 6 is circulated by a pump 11a between the stripping solution shower nozzle 1a, the stripping tank 8a (8b), the stripping solution pipe 14a, the stripping solution tank 10a, and the stripping solution pipe 14b. Since the water evaporates and concentrates when it comes into contact with air during use, it is necessary to check the amount of water periodically and replenish the water appropriately to manage the stripping solution.

Patent Document 1 discloses a method for managing a resist stripping solution, which is not stripping a polyimide thin film, but maintains the carbon dioxide gas concentration in the resist stripping solution at 3% by weight or less in stripping a photoresist having a phenolic hydroxyl group. It is disclosed. And according to this, since the concentration of bicarbonate ions and carbonate ions in the stripping solution is managed low, it is stated that the dissolution amount of the photoresist is maintained and the performance degradation of the resist stripping solution is suppressed. Yes.
JP 2003-122029 A

  By the way, when the polyimide thin film is peeled off using the peeling device 30 as described above, in the inside of the peeling chambers 15a and 15b of the peeling device 30 only by the management of the peeling liquid for replenishing moisture, the carbon dioxide in the air. Carbon and sodium hydroxide react to form sodium carbonate as a salt.

  However, this sodium carbonate may adhere and adhere as a powder to the transport roller 2 inside the peeling chambers 15a and 15b, the bearing that receives the shaft of the transport roller 2, or the like. In this case, there arises a problem that the processing substrate 5 is not normally conveyed in the peeling chambers 15a and 15b.

  Further, when this powder adheres to the light receiving portion of the sensor 19 that detects the position of the processing substrate 5 in the peeling chambers 15a and 15b, the sensor 19 malfunctions, for example, the processing substrate 5 is conveyed to a predetermined position. In spite of coming, there is a possibility that a trouble of conveyance that frequently detects that the processing substrate 5 is not conveyed to a predetermined position occurs. Further, there is a problem that the filter 12a in the stripping solution pipe 14b is clogged and the replacement frequency of the filter 12a is increased.

This invention is made | formed in view of this point, The place made into the objective is attributed to peeling liquid when peeling the polyimide thin film of a substrate surface from a board | substrate using the peeling liquid containing inorganic alkali aqueous solution. It is to reduce the generation of powder to be performed and to suppress the trouble of transporting the substrate inside the processing chamber .

  In the present invention, a stripping solution containing nitrogen gas is used, and a polyimide thin film is stripped in an atmosphere of nitrogen gas.

Peeling device according to the specifically this invention, using a stripping solution containing an inorganic alkaline aqueous solution, a polyimide film adhered to the surface of the substrate a stripping device for peeling from the substrate, to accommodate the substrate A processing chamber for processing the substrate while transporting the substrate; a first gas supply means for supplying nitrogen gas to the stripping solution to contain the nitrogen gas; and a stripping solution containing the nitrogen gas. A stripping solution supplying means for supplying the polyimide thin film on the substrate surface accommodated in the substrate, a second gas supplying means for supplying nitrogen gas into the processing chamber, and a lower side of the substrate accommodated in the processing chamber. And a sensor for detecting the presence or absence of the substrate .

According to said structure, nitrogen gas is included in stripping solution by the 1st gas supply means, The stripping solution containing the nitrogen gas is supplied to the polyimide thin film adhering to the surface of a board | substrate by stripping solution supply means. As a result, the polyimide thin film on the substrate surface is peeled off from the substrate. In addition, since nitrogen gas is supplied into the processing chamber containing the substrate by the second gas supply means, the stripping solution is supplied to the polyimide thin film on the substrate surface in an atmosphere of nitrogen gas. Therefore, the contact between the inorganic alkali component contained in the stripping solution and carbon dioxide in the air is suppressed, and the production of powder due to the reaction between the inorganic alkali component and carbon dioxide is reduced. Thereby, since it is suppressed that a powder adheres to the sensor arrange | positioned under the board | substrate accommodated in the inside of a process chamber, the conveyance trouble of the board | substrate inside a process chamber is suppressed. Therefore, when stripping the polyimide thin film on the substrate surface from the substrate using a stripping solution containing an inorganic alkaline aqueous solution, the generation of powder due to the stripping solution is reduced and troubles in transporting the substrate inside the processing chamber are suppressed. It becomes possible to do.

  The first gas supply unit may include a storage tank that stores the stripping solution and a bubbling unit that bubbles nitrogen gas into the stripping solution stored in the storage tank.

  According to the above configuration, nitrogen gas can be efficiently contained in the stripping solution by bubbling nitrogen gas into the stripping solution inside the storage tank via the bubbling unit, and the stripping solution is not contained. Become active.

  The processing chamber may be provided with a liquid draining means for spraying nitrogen gas onto the stripping liquid adhering to the surface of the substrate to drain the liquid.

  According to the above configuration, for example, after the polyimide thin film adhering to the surface of the substrate is peeled off from the substrate, the stripping solution adhering to the surface of the substrate is drained by nitrogen gas sprayed from the liquid draining means. Therefore, the contact between the inorganic alkali component contained in the stripping solution and carbon dioxide in the air is suppressed.

  The inorganic alkaline aqueous solution may be a potassium hydroxide aqueous solution.

According to said structure, when potassium hydroxide and the carbon dioxide in the air react, potassium carbonate will produce | generate as a salt. For example, when sodium hydroxide, which is a general inorganic alkali, reacts with carbon dioxide in the air, sodium carbonate is generated as a salt. Here, since the solubility with respect to water is potassium carbonate higher than sodium carbonate, potassium carbonate is hard to produce | generate as a powder rather than sodium carbonate. Thereby, if the inorganic alkaline aqueous solution is a potassium hydroxide aqueous solution, the production | generation of the powder by reaction with a carbon dioxide will be reduced rather than the case where an inorganic alkaline aqueous solution is a sodium hydroxide aqueous solution .

In the stripping apparatus of the present invention, nitrogen gas is supplied into the stripping liquid by the first gas supply means, and the stripping liquid containing the nitrogen gas is supplied to the polyimide thin film on the substrate by the stripping liquid supply means. Will peel from the substrate. In addition, since nitrogen gas is supplied into the processing chamber containing the substrate by the second gas supply means, the stripping solution is supplied to the polyimide thin film on the substrate surface in an atmosphere of nitrogen gas. For this reason, contact between the inorganic alkali component contained in the stripper and carbon dioxide in the air is suppressed, reducing the generation of powder due to the reaction between the inorganic alkali component and carbon dioxide, and troubles in transporting the substrate inside the processing chamber. Can be suppressed .

  Hereinafter, a peeling apparatus and a polyimide thin film peeling method according to an embodiment of the present invention will be described in detail based on the drawings.

  First, the peeling apparatus used for the polyimide thin film peeling method will be described.

  FIG. 1 is a schematic configuration diagram of a peeling apparatus 20 of the present embodiment.

  Here, the process board | substrate 5 which performs a peeling process is demonstrated.

  The processing substrate 5 is a dummy substrate corresponding to, for example, a TFT array substrate and a counter substrate constituting a liquid crystal display device, and a polyimide resin (thin film) is attached to the surface by trial printing. And a polyimide thin film formed on a raw glass substrate.

  The peeling device 20 stores a first peeling chamber 15a (processing chamber), a second peeling chamber 15b (processing chamber) and a rinsing chamber 16 that are arranged in order from the left side to the right side in the drawing, and the peeling liquid 6. A stripping solution tank 10a (storage tank), a rinsing water tank 10b for storing rinsing water 7, and a nitrogen tank 13 for supplying nitrogen gas are provided.

  The first peeling chamber 15a, the second peeling chamber 15b, and the rinsing chamber 16 have openings on their side walls that serve as substrate carry-in portions and substrate discharge portions, respectively, and between each substrate carry-in portion and the substrate carry-out portion. The transport roller 2 is provided, and the processing substrate 5 is transported on the transport roller 2 from the substrate carry-in portion of the first peeling chamber 15 a to the substrate discharge portion of the rinse chamber 16.

  In each treatment chamber of the first stripping chamber 15a and the second stripping chamber 15b, a stripping tank 8a (8b) for temporarily storing the stripping solution 6 and a stripping solution shower for supplying the stripping solution 6 in a shower form. A nozzle 1a (peeling liquid supply means), a rotating brush 3 that contacts and cleans the surface of the processing substrate 5, and a sensor 19 that detects the presence or absence of the processing substrate 5 at a predetermined position are provided.

  An air knife 4a is provided at the substrate discharge port inside the second peeling chamber 15b as liquid draining means for spraying nitrogen gas to the stripping liquid 6 adhering to the surface of the processing substrate 5 to drain the liquid. .

  With this configuration, after the polyimide thin film adhering to the surface of the processing substrate 5 is peeled off from the raw glass substrate, the stripping liquid 6 adhering (remaining) on the surface of the raw glass substrate is injected from the air knife 4b. Therefore, contact between the inorganic alkali component contained in the stripping solution 6 and carbon dioxide in the air can be suppressed.

  The stripping tank 8a (8b) and the stripping solution tank 10a are connected by a stripping solution pipe 14a.

  The stripping solution tank 10a and the stripping solution shower nozzle 1a are connected by a stripping solution pipe 14b, and a pump 11a and a filter 12a are provided on the stripping solution tank 14a side of the stripping solution pipe 14b.

  The stripping solution tank 10a and the nitrogen tank 13 are connected by a nitrogen gas pipe 17a (first gas supply means). The nitrogen gas pipe 17a has a bubbling portion 17a 'extending so as to protrude into the stripping solution tank 10a, and the bubbling portion 17a' has a plurality of discharge holes for discharging gas. The nitrogen gas supplied from the nitrogen tank 13 is bubbled into the stripping solution 6.

  With this configuration, nitrogen gas can be efficiently contained in the stripping solution 6 by bubbling nitrogen gas through the bubbling portion 17a ′ to the stripping solution 6 stored in the stripping solution tank 10a. The stripping solution 6 can be inactivated.

  The first peeling chamber 15a, the second peeling chamber 15b, the air knife 4a, and the nitrogen tank 13 are connected by a nitrogen gas pipe 17b (second gas supply means).

  Inside the rinsing chamber 16, a rinsing tank 9 for temporarily storing the rinsing water 7, a rinsing water shower nozzle 1 b for supplying the rinsing water 7 in a shower form, and the presence / absence of the processing substrate 5 at a predetermined position are detected. Sensor 19 is provided.

  An air knife 4b is provided at the substrate discharge port inside the rinsing chamber 16 as a liquid draining means for spraying air to the rinse water 7 attached on the processing substrate 5 (raw glass substrate) to drain the water. . In addition, this air knife 4b may be comprised so that nitrogen gas may be injected like the air knife 4b provided in the 2nd peeling chamber 15b.

  The rinsing tank 9 and the rinsing water tank 10b are connected by a rinsing water pipe 18a.

  The rinse water tank 10b and the rinse water shower nozzle 1b are connected by a rinse water pipe 18b, and a pump 11b and a filter 12b are provided on the rinse water tank 10b side of the rinse water pipe 18b.

  In the peeling device 20 as described above, the stripping solution 6 is between the stripping solution tank 10a, the stripping solution pipe 14b, the stripping solution shower nozzle 1a, the stripping tank 8a (8b), and the stripping solution pipe 14a by the pump 11a. The rinse water 7 is circulated in order between the rinse water tank 10b, the rinse water pipe 18b, the rinse water shower nozzle 1b, the rinse tank 9 and the rinse water pipe 18a by the pump 11b. It is configured.

  Next, an example of a method for peeling a polyimide thin film from a raw glass substrate using the peeling apparatus 20 will be described in the order of steps.

<Preparation process>
For example, the stripping solution 6 is prepared by mixing with pure water such that 17.5 wt% of potassium hydroxide as an inorganic alkali and 17.5 wt% of dimethyl sulfoxide (DMSO) as an organic solvent. .

  Here, when potassium hydroxide reacts with carbon dioxide in the air, potassium carbonate is generated as a salt. For example, when sodium hydroxide, which is a general inorganic alkali, reacts with carbon dioxide in the air, sodium carbonate is generated as a salt. And since the solubility with respect to water is higher than potassium carbonate, potassium carbonate is hard to produce | generate as a powder rather than sodium carbonate. In this case, since the aqueous inorganic alkali solution is an aqueous potassium hydroxide solution, the production of powder due to the reaction with carbon dioxide can be reduced as compared with the case where the aqueous inorganic alkali solution is an aqueous sodium hydroxide solution.

<Containment process>
First, the processing substrate 5 is placed on the transport roller 2 in the substrate carry-in portion of the first peeling chamber 15a.

  Next, the transport roller 2 is operated, and the processing substrate 5 is accommodated in the first peeling chamber 15a.

<Gas supply process>
First, the stripping solution 6 is stored in the stripping solution tank 10a, and the rinse water (pure water or the like) is stored in the rinsing water tank 10b.

  Next, nitrogen gas from the nitrogen tank 13 is bubbled (supplied) to the stripping solution 6 in the stripping solution tank 10a through the bubbling portion 17a ′ at the tip of the nitrogen gas pipe 17a at, for example, 50 liters / minute. .

  By this bubbling, nitrogen gas is contained in the stripping solution 6, and the carbon dioxide concentration in the stripping solution 6 is about 50 ppm.

<Peeling process>
First, nitrogen gas from the nitrogen tank 13 is supplied to the first peeling chamber 15a and the second peeling chamber 15b. Here, the flow rate of the nitrogen gas is, for example, 500 liters / minute (the volume of the first peeling chamber 15a and the second peeling chamber: 2.37 m ³ each). In the substrate carry-in portion of the first peeling chamber 15a, The gas flow rate is, for example, 5 m / sec from the inside of the first peeling chamber 15a to the outside.

  Next, while the rotating brush 3 is operated and the processing substrate 5 is transported on the transporting roller 2, the stripping solution 6 containing nitrogen gas in the gas supply step from the stripping solution shower nozzle 1 a is applied to the surface of the processing substrate 5. To the polyimide thin film.

  Further, even when the processing substrate 5 is transported inside the second peeling chamber 15b, the stripping solution containing the nitrogen gas from the stripping solution shower nozzle 1a while operating the rotating brush 3 in the same manner as described above. Is supplied to the polyimide thin film on the surface of the processing substrate 5 in a shower shape.

  Thereby, a polyimide thin film peels from the raw glass substrate which comprises the process board | substrate 5, and is collect | recovered by the peeling tank 8a (8b) with the peeling liquid 6. FIG.

  Then, in the substrate discharge portion of the second peeling chamber 15b, the compressed nitrogen gas is sprayed onto the surface of the processing substrate 5 by the air knife 4a, and the peeling liquid 6 adhered (residual) to the surface of the processing substrate 5 is liquid. It is cut.

<Rinse process>
The rinsing water 7 is supplied to the surface of the processing substrate 5 in a shower form while the processing substrate 5 from which the polyimide thin film has been peeled is conveyed into the rinsing chamber 16.

  In the substrate discharge portion of the rinse chamber 16, the compressed air is blown onto the surface of the processing substrate 5 by the air knife 4 b, and the rinsing water 7 adhering (residual) on the processing substrate 5 is drained.

  By these steps, the polyimide thin film formed on the raw glass substrate is peeled off from the raw glass substrate, and the raw glass substrate is recycled.

  According to the polyimide thin film peeling method and the peeling apparatus 20 of the present invention described above, first, the processing substrate 5 is accommodated in the first peeling chamber 15a in the accommodating step, and then, in the gas supply step, for the stripping solution. Nitrogen gas is included in the stripping solution 6 in the tank 10a through the bubbling portion 17a ′, and then the stripping solution 6 containing the nitrogen gas is used as the first stripping chamber 15a and the second stripping chamber 15b in the stripping step. The polyimide thin film on the surface of the processing substrate 5 is peeled off from the raw glass substrate by supplying the polyimide thin film attached to the surface of the processing substrate 5 through the shower nozzle 1a for the peeling liquid inside.

  In addition, since the peeling process is performed while supplying nitrogen gas into the first peeling chamber 15a and the second peeling chamber 15b, the peeling solution 6 is supplied to the polyimide thin film on the surface of the processing substrate 5 in an atmosphere of nitrogen gas. Will be.

  Therefore, the contact between the potassium hydroxide component contained in the stripping solution 6 and carbon dioxide in the air is suppressed, and the production of powder due to the reaction between the potassium hydroxide component and carbon dioxide can be reduced.

  Accordingly, since the generation of powder is reduced, it is possible to suppress the powder from adhering to the transport roller 2, the bearing, the light receiving portion of the sensor 19, and the like in the first peeling chamber 15a and the second peeling chamber 15b. Troubles in conveyance of the processing substrate 5 can be suppressed.

  Further, since the generation of powder is reduced, clogging of the filter 12a provided in the stripping solution pipe 14b is reduced, and the replacement frequency of the filter 12a can be reduced.

  In the above-described embodiment, the peeling step is performed in two connected processing chambers of the first peeling chamber 15a and the second peeling chamber 15b, but may be performed in three or more connected processing chambers, or 1 It may be performed in two processing chambers.

  Moreover, in the said embodiment, although nitrogen gas was bubbled in the stripping solution 6 in the stripping solution tank 10a, you may bubble in stripping tank 8a and 8b.

  Furthermore, the stripping solution pipe 17a is a double pipe. For example, the stripping solution 6 is caused to contain nitrogen gas by flowing nitrogen gas into the inner porous tube and the stripping solution 6 into the outer piping. May be.

  Moreover, in the said embodiment, although nitrogen gas was used as an inert gas, you may use noble gases, such as helium.

  In addition, this invention is not limited to the following embodiment, The thing of another structure may be sufficient.

  As described above, the present invention can reduce the generation of powder due to the stripping solution and peel the polyimide thin film on the substrate surface from the substrate, which is useful for peeling the alignment film of the liquid crystal display device. It is.

It is a composition schematic diagram of exfoliation device 20 concerning the embodiment of the present invention. 1 is a schematic configuration diagram of a general flexographic printing apparatus 30. FIG. It is the structure schematic of the conventional peeling apparatus 40. FIG.

Explanation of symbols

1a Shower nozzle for stripping solution 1b Shower nozzle for rinsing water 2 Conveying roller 3 Rotating brushes 4a and 4b Air knife 5 Processing substrate 5a Electrode substrate 5b Polyimide thin film 6 Stripping solution 7 Rinsing water 8a and 8b Stripping bath 9 Rinsing bath 10a For stripping solution Tank 10b Rinsing water tanks 11a, 11b Pumps 12a, 12b Filter 13 Nitrogen tanks 14a, 14b Stripping solution piping 15a First stripping chamber 15b Second stripping chamber 16 Rinsing chambers 17a, 17b Nitrogen gas piping 17a 'Bubbling portion 18a, 18b Piping for rinsing water 19 Sensor 20, 40 Peeling device 30 Flexo printing device

Claims (4)

A stripping device that strips a polyimide thin film adhering to the surface of a substrate from the substrate using a stripping solution containing an inorganic alkaline aqueous solution,
A processing chamber for storing the substrate and processing the substrate while transporting the substrate ;
First gas supply means for supplying nitrogen gas to the stripping solution and containing the nitrogen gas;
A stripping solution supplying means for supplying the stripping solution containing the nitrogen gas to the polyimide thin film on the surface of the substrate housed in the processing chamber;
Second gas supply means for supplying nitrogen gas into the processing chamber ;
A peeling apparatus, comprising: a sensor disposed under the substrate accommodated in the processing chamber and detecting the presence or absence of the substrate . The peeling apparatus according to claim 1,
The first gas supply means includes a storage tank that stores the stripping liquid, and a bubbling unit that bubbles nitrogen gas into the stripping liquid stored in the storage tank. apparatus. The peeling apparatus according to claim 1,
2. A peeling apparatus according to claim 1, wherein the processing chamber is provided with a liquid draining means for spraying nitrogen gas to the stripping liquid adhering to the surface of the substrate to drain the liquid. The peeling apparatus according to claim 1,
The peeling apparatus according to claim 1, wherein the inorganic alkaline aqueous solution is a potassium hydroxide aqueous solution.

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