JP4181149B2 - 半導体パッケージ - Google Patents
半導体パッケージ Download PDFInfo
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- JP4181149B2 JP4181149B2 JP2005185049A JP2005185049A JP4181149B2 JP 4181149 B2 JP4181149 B2 JP 4181149B2 JP 2005185049 A JP2005185049 A JP 2005185049A JP 2005185049 A JP2005185049 A JP 2005185049A JP 4181149 B2 JP4181149 B2 JP 4181149B2
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- semiconductor package
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- substrate
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- 239000004065 semiconductor Substances 0.000 title claims description 65
- 239000010410 layer Substances 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 40
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 description 28
- 239000010409 thin film Substances 0.000 description 17
- 238000007747 plating Methods 0.000 description 16
- 239000010949 copper Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229910000906 Bronze Inorganic materials 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 239000010974 bronze Substances 0.000 description 8
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229960003280 cupric chloride Drugs 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- -1 acryloxyethyl Chemical group 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
硫酸銅0.06mol/l
ホルマリン0.30mol/l
水酸化ナトリウム0.35mol/l
EDTA0.35mol/l
添加剤少々
温度70〜72℃
pH12.4
めっきレジストを塩化メチレンで剥離したのち、接着剤層5形成、粗化、めっきレジスト形成、無電解めっきを3回繰り返して、図3、図4の実装基板2に相当する構成を得た。この実施例では、接着剤層表面が粗化されており、導体層6と絶縁層5との密着に優れている。また、絶縁樹脂としてエポキシアクリレートとPES(ポリエーテルスルホン)との複合体を用いるため、靱性が高く、強度、ヒートサイクル特性に優れている。
本発明は上記実施例1,2のみに限定されることはなく、以下のような構成に変更することが可能である。例えば、
(a)ベースキャリア形成用の材料として、前記プラスティック以外の材料、例えば加工が容易で比較的安価なその他の材料を使用することもできる。
(c)実装基板に搭載するLSIチップは複数でも1個でも構わない。また、LSIチップのほかにも発熱量の多い電子部品を搭載することも勿論可能である。
1'半導体装置
2 実装基板(ビルドアップ多層配線板)
3 ベースユニット
4 基板
5 絶縁層
6 導体層
7 バイアホール
8 接続パッド(実装基板の最表層の導体層)
9 実装パッド
10 LSIチップ
11、12 はんだボール
13a 接続パッド(ベースユニットの外部端子が設けられた側とは反対側に形成された導体層)
13b 導体層
13c スルーホール
13d 高密度配線層
14 ピン
15 プラスチック基材
16 窓部
17 ビルドアップ多層配線層
18 接着剤層
19 封止樹脂
20 PGA基板
21 サブボードのスルーホール
22 サブボード
Claims (2)
- 半導体部品を実装する半導体パッケージであって、
放熱領域とする基板と、
前記基板上に配置され、導体層と絶縁層を交互に積層し、該絶縁層に形成された複数のバイアホールによって各導体層を接続して、半導体部品搭載領域とするビルドアップ層と、
前記ビルドアップ層の上方に位置し、略中央部に透設された窓部、該窓部の周囲に配列する接続パッドを設け、該接続パッドを前記ビルドアップ層の最表層に設けられた接続パッドにはんだボールを介して接合するベースユニットと、
前記ビルドアップ層と前記ベースユニットとを電気的に接続した状態で前記窓部内に収容され、前記ビルドアップ層の最表層に設けられた実装パッドにはんだボールを介して接合される半導体部品と、
を備えることを特徴とする半導体パッケージ。 - 前記窓部の周囲に位置し、前記ビルドアップ層と前記ベースユニットとを接着する接着剤層をさらに備えることを特徴とする請求項1に記載の半導体パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005185049A JP4181149B2 (ja) | 2005-06-24 | 2005-06-24 | 半導体パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005185049A JP4181149B2 (ja) | 2005-06-24 | 2005-06-24 | 半導体パッケージ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10067595A Division JP3718254B2 (ja) | 1995-04-01 | 1995-04-01 | 半導体パッケージおよび半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005303331A JP2005303331A (ja) | 2005-10-27 |
JP4181149B2 true JP4181149B2 (ja) | 2008-11-12 |
Family
ID=35334393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005185049A Expired - Lifetime JP4181149B2 (ja) | 2005-06-24 | 2005-06-24 | 半導体パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4181149B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114823548B (zh) * | 2022-06-28 | 2022-11-15 | 之江实验室 | 一种面向光电共封装的lga封装结构 |
-
2005
- 2005-06-24 JP JP2005185049A patent/JP4181149B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2005303331A (ja) | 2005-10-27 |
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