JP4178890B2 - 固体撮像装置 - Google Patents

固体撮像装置 Download PDF

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Publication number
JP4178890B2
JP4178890B2 JP2002260417A JP2002260417A JP4178890B2 JP 4178890 B2 JP4178890 B2 JP 4178890B2 JP 2002260417 A JP2002260417 A JP 2002260417A JP 2002260417 A JP2002260417 A JP 2002260417A JP 4178890 B2 JP4178890 B2 JP 4178890B2
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JP
Japan
Prior art keywords
solid
imaging device
state imaging
electrode pad
curved
Prior art date
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Expired - Fee Related
Application number
JP2002260417A
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English (en)
Japanese (ja)
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JP2004104259A (ja
JP2004104259A5 (https=
Inventor
幸一 上栗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
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Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2002260417A priority Critical patent/JP4178890B2/ja
Publication of JP2004104259A publication Critical patent/JP2004104259A/ja
Publication of JP2004104259A5 publication Critical patent/JP2004104259A5/ja
Application granted granted Critical
Publication of JP4178890B2 publication Critical patent/JP4178890B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
JP2002260417A 2002-09-05 2002-09-05 固体撮像装置 Expired - Fee Related JP4178890B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002260417A JP4178890B2 (ja) 2002-09-05 2002-09-05 固体撮像装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002260417A JP4178890B2 (ja) 2002-09-05 2002-09-05 固体撮像装置

Publications (3)

Publication Number Publication Date
JP2004104259A JP2004104259A (ja) 2004-04-02
JP2004104259A5 JP2004104259A5 (https=) 2005-11-04
JP4178890B2 true JP4178890B2 (ja) 2008-11-12

Family

ID=32261145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002260417A Expired - Fee Related JP4178890B2 (ja) 2002-09-05 2002-09-05 固体撮像装置

Country Status (1)

Country Link
JP (1) JP4178890B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007189108A (ja) * 2006-01-13 2007-07-26 Sony Corp 固体撮像装置と鏡筒への固体撮像装置の組立方法
JP4977378B2 (ja) * 2006-02-23 2012-07-18 山梨日本電気株式会社 磁気センサ、回転検出装置及び位置検出装置
JP5724322B2 (ja) 2010-11-24 2015-05-27 ソニー株式会社 固体撮像装置の製造方法
JP5585663B2 (ja) 2010-12-28 2014-09-10 コニカミノルタ株式会社 広角レンズ，撮像光学装置及びデジタル機器
JP5720305B2 (ja) * 2011-02-28 2015-05-20 ソニー株式会社 固体撮像素子の製造方法、固体撮像素子、および電子機器
JP5720304B2 (ja) * 2011-02-28 2015-05-20 ソニー株式会社 固体撮像装置及び電子機器
JP5720306B2 (ja) * 2011-02-28 2015-05-20 ソニー株式会社 固体撮像素子の製造方法
US8742325B1 (en) * 2013-07-31 2014-06-03 Google Inc. Photodetector array on curved substrate
WO2015087599A1 (ja) * 2013-12-09 2015-06-18 ソニー株式会社 撮像ユニット、レンズ鏡筒および携帯端末
JP2016103520A (ja) * 2014-11-27 2016-06-02 京セラ株式会社 電子部品実装用パッケージおよび電子装置
WO2016098455A1 (ja) * 2014-12-17 2016-06-23 京セラ株式会社 電子部品実装用パッケージおよび電子装置
EP3301477A1 (en) * 2016-10-03 2018-04-04 Xenomatix NV System for determining a distance to an object
EP3343246A1 (en) 2016-12-30 2018-07-04 Xenomatix NV System for characterizing surroundings of a vehicle

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997010672A1 (en) * 1995-09-11 1997-03-20 Gatan, Inc. Optically coupled large-format solid state imaging device
JP2809215B2 (ja) * 1996-09-26 1998-10-08 日本電気株式会社 固体撮像カメラ
JP4156154B2 (ja) * 1999-11-26 2008-09-24 富士フイルム株式会社 固体撮像装置
DE10004891C2 (de) * 2000-02-04 2002-10-31 Astrium Gmbh Fokalfläche und Detektor für optoelektronische Bildaufnahmesysteme, Herstellungsverfahren und optoelektronisches Bildaufnahmesystem
JP2001309244A (ja) * 2000-04-19 2001-11-02 Canon Inc 固体撮像装置及び固体撮像装置の取り付け方法
JP2002218293A (ja) * 2001-01-17 2002-08-02 Canon Inc 撮像装置
JP3896586B2 (ja) * 2001-12-20 2007-03-22 ソニー株式会社 固体撮像装置及び固体撮像カメラ
JP3959711B2 (ja) * 2002-02-20 2007-08-15 ソニー株式会社 固体撮像装置及びその製造方法

Also Published As

Publication number Publication date
JP2004104259A (ja) 2004-04-02

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