JP4174274B2 - ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 - Google Patents

ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 Download PDF

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Publication number
JP4174274B2
JP4174274B2 JP2002257934A JP2002257934A JP4174274B2 JP 4174274 B2 JP4174274 B2 JP 4174274B2 JP 2002257934 A JP2002257934 A JP 2002257934A JP 2002257934 A JP2002257934 A JP 2002257934A JP 4174274 B2 JP4174274 B2 JP 4174274B2
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resin
resin composition
group
component
general formula
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JP2004091734A5 (enExample
JP2004091734A (ja
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武志 對比地
倫康 山崎
伸仁 青木
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Gun Ei Chemical Industry Co Ltd
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Gun Ei Chemical Industry Co Ltd
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  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2002257934A 2002-09-03 2002-09-03 ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤 Expired - Fee Related JP4174274B2 (ja)

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JP2002257934A JP4174274B2 (ja) 2002-09-03 2002-09-03 ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤

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JP2002257934A JP4174274B2 (ja) 2002-09-03 2002-09-03 ポリアミドイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤

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JP2004091734A JP2004091734A (ja) 2004-03-25
JP2004091734A5 JP2004091734A5 (enExample) 2006-08-31
JP4174274B2 true JP4174274B2 (ja) 2008-10-29

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10640614B2 (en) 2016-07-28 2020-05-05 3M Innovative Properties Company Segmented silicone polyamide block copolymers and articles containing the same
US10865330B2 (en) 2016-07-28 2020-12-15 3M Innovative Properties Company Segmented silicone polyamide block copolymers and articles containing the same

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4084597B2 (ja) * 2002-05-07 2008-04-30 群栄化学工業株式会社 アミノ基含有フェノール誘導体
JP4609645B2 (ja) * 2005-03-07 2011-01-12 信越化学工業株式会社 半導体封止用エポキシ樹脂成形材料接着用プライマー組成物及び半導体装置
JP4704082B2 (ja) * 2005-03-22 2011-06-15 住友電工プリントサーキット株式会社 接着剤組成物およびそれを用いたフレキシブル印刷配線板
WO2007046405A1 (ja) * 2005-10-21 2007-04-26 Nippon Kayaku Kabushiki Kaisha 熱硬化性樹脂組成物並びにその用途
JP2007211182A (ja) * 2006-02-10 2007-08-23 Kyocera Chemical Corp 樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板
KR101441990B1 (ko) * 2006-10-04 2014-09-18 히타치가세이가부시끼가이샤 폴리아미드이미드 수지, 접착제, 플렉시블 기판 재료, 플렉시블 적층판 및 플렉시블 인쇄배선판
JP2008227398A (ja) * 2007-03-15 2008-09-25 Sanken Electric Co Ltd 半導体装置の製法
JP5470704B2 (ja) * 2007-04-11 2014-04-16 日立化成株式会社 ポリアミド樹脂及び樹脂組成物
US8410620B2 (en) 2007-09-20 2013-04-02 Nippon Kayaku Kabushiki Kaisha Primer resin for semiconductor device and semiconductor device
JP5245526B2 (ja) * 2008-05-09 2013-07-24 日立化成株式会社 絶縁樹脂組成物、及び支持体付絶縁フィルム
JP2010037489A (ja) * 2008-08-07 2010-02-18 Hitachi Chem Co Ltd 接着フィルム及び樹脂付き金属箔
JP5509460B2 (ja) * 2008-09-22 2014-06-04 住鉱潤滑剤株式会社 耐擦傷性に優れた高硬度被膜形成用塗料組成物
JP6467784B2 (ja) * 2014-05-07 2019-02-13 凸版印刷株式会社 転写フィルムおよび加飾成形品
JP6724620B2 (ja) * 2016-07-19 2020-07-15 Jsr株式会社 接着剤、積層体、積層体の製造方法および電子部品
CN116200035A (zh) * 2022-12-27 2023-06-02 镇江东艺机械有限公司 一种用于阀体密封的pai复合材料及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10640614B2 (en) 2016-07-28 2020-05-05 3M Innovative Properties Company Segmented silicone polyamide block copolymers and articles containing the same
US10865330B2 (en) 2016-07-28 2020-12-15 3M Innovative Properties Company Segmented silicone polyamide block copolymers and articles containing the same

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JP2004091734A (ja) 2004-03-25

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