JP4163932B2 - 発光素子収納用パッケージおよび発光装置 - Google Patents

発光素子収納用パッケージおよび発光装置 Download PDF

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Publication number
JP4163932B2
JP4163932B2 JP2002341445A JP2002341445A JP4163932B2 JP 4163932 B2 JP4163932 B2 JP 4163932B2 JP 2002341445 A JP2002341445 A JP 2002341445A JP 2002341445 A JP2002341445 A JP 2002341445A JP 4163932 B2 JP4163932 B2 JP 4163932B2
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Japan
Prior art keywords
light emitting
emitting element
hole
plating layer
metal layer
Prior art date
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Expired - Fee Related
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JP2002341445A
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English (en)
Japanese (ja)
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JP2004207258A (ja
JP2004207258A5 (https=
Inventor
義紀 前川
執蔵 中島
孝雄 厚地
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Kyocera Corp
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Kyocera Corp
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Priority to JP2002341445A priority Critical patent/JP4163932B2/ja
Publication of JP2004207258A publication Critical patent/JP2004207258A/ja
Publication of JP2004207258A5 publication Critical patent/JP2004207258A5/ja
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Publication of JP4163932B2 publication Critical patent/JP4163932B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
JP2002341445A 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置 Expired - Fee Related JP4163932B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002341445A JP4163932B2 (ja) 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002312878 2002-10-28
JP2002341445A JP4163932B2 (ja) 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置

Publications (3)

Publication Number Publication Date
JP2004207258A JP2004207258A (ja) 2004-07-22
JP2004207258A5 JP2004207258A5 (https=) 2005-10-20
JP4163932B2 true JP4163932B2 (ja) 2008-10-08

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JP2002341445A Expired - Fee Related JP4163932B2 (ja) 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置

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JP (1) JP4163932B2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080097B1 (ko) 2004-08-16 2011-11-07 서울반도체 주식회사 세라믹 본체를 채택하는 발광 다이오드 패키지
KR101154801B1 (ko) * 2004-12-03 2012-07-03 엔지케이 스파크 플러그 캄파니 리미티드 세라믹 기판 및 발광 소자 수납용 세라믹 패키지
US7683393B2 (en) * 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
KR100924474B1 (ko) 2005-03-24 2009-11-03 쿄세라 코포레이션 발광장치
JP4671748B2 (ja) * 2005-04-25 2011-04-20 京セラ株式会社 発光装置用配線基板および発光装置
JP4452216B2 (ja) * 2005-06-29 2010-04-21 日本特殊陶業株式会社 発光素子用セラミックパッケージ及びその製造方法
US20100015468A1 (en) 2006-12-28 2010-01-21 Yasuyuki Yamamoto Method for manufacturing metallized aluminum nitride substrate
KR100877881B1 (ko) 2007-09-06 2009-01-08 엘지이노텍 주식회사 발광다이오드 패키지 및 그 제조방법
JP2009230060A (ja) * 2008-03-25 2009-10-08 Seiko Epson Corp 電気泳動装置、電子機器
JP2010199547A (ja) 2009-01-30 2010-09-09 Nichia Corp 発光装置及びその製造方法
JP5549428B2 (ja) * 2010-06-30 2014-07-16 東芝ライテック株式会社 発光モジュール及びこれを備えた照明器具
CN105870288B (zh) * 2016-04-27 2018-08-14 天津三安光电有限公司 发光二极管及其制作方法

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JP2004207258A (ja) 2004-07-22

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