JP4163932B2 - 発光素子収納用パッケージおよび発光装置 - Google Patents

発光素子収納用パッケージおよび発光装置 Download PDF

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Publication number
JP4163932B2
JP4163932B2 JP2002341445A JP2002341445A JP4163932B2 JP 4163932 B2 JP4163932 B2 JP 4163932B2 JP 2002341445 A JP2002341445 A JP 2002341445A JP 2002341445 A JP2002341445 A JP 2002341445A JP 4163932 B2 JP4163932 B2 JP 4163932B2
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JP
Japan
Prior art keywords
light emitting
emitting element
hole
plating layer
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002341445A
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English (en)
Japanese (ja)
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JP2004207258A5 (enExample
JP2004207258A (ja
Inventor
義紀 前川
執蔵 中島
孝雄 厚地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2002341445A priority Critical patent/JP4163932B2/ja
Publication of JP2004207258A publication Critical patent/JP2004207258A/ja
Publication of JP2004207258A5 publication Critical patent/JP2004207258A5/ja
Application granted granted Critical
Publication of JP4163932B2 publication Critical patent/JP4163932B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
JP2002341445A 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置 Expired - Fee Related JP4163932B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002341445A JP4163932B2 (ja) 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002312878 2002-10-28
JP2002341445A JP4163932B2 (ja) 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置

Publications (3)

Publication Number Publication Date
JP2004207258A JP2004207258A (ja) 2004-07-22
JP2004207258A5 JP2004207258A5 (enExample) 2005-10-20
JP4163932B2 true JP4163932B2 (ja) 2008-10-08

Family

ID=32828189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002341445A Expired - Fee Related JP4163932B2 (ja) 2002-10-28 2002-11-25 発光素子収納用パッケージおよび発光装置

Country Status (1)

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JP (1) JP4163932B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101080097B1 (ko) 2004-08-16 2011-11-07 서울반도체 주식회사 세라믹 본체를 채택하는 발광 다이오드 패키지
KR101154801B1 (ko) 2004-12-03 2012-07-03 엔지케이 스파크 플러그 캄파니 리미티드 세라믹 기판 및 발광 소자 수납용 세라믹 패키지
US7683393B2 (en) * 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
DE112006000694B4 (de) * 2005-03-24 2013-10-17 Kyocera Corp. Gehäuse für Lichtemissionsvorrichtung, lichtemittierende Vorrichtung und Beleuchtungsvorrichtung
JP4671748B2 (ja) * 2005-04-25 2011-04-20 京セラ株式会社 発光装置用配線基板および発光装置
JP4452216B2 (ja) * 2005-06-29 2010-04-21 日本特殊陶業株式会社 発光素子用セラミックパッケージ及びその製造方法
EP2099068A4 (en) 2006-12-28 2011-01-26 Tokuyama Corp PROCESS FOR PRODUCING METALLIC ALUMINUM NITRIDE SUBSTRATE
KR100877881B1 (ko) 2007-09-06 2009-01-08 엘지이노텍 주식회사 발광다이오드 패키지 및 그 제조방법
JP2009230060A (ja) * 2008-03-25 2009-10-08 Seiko Epson Corp 電気泳動装置、電子機器
JP2010199547A (ja) 2009-01-30 2010-09-09 Nichia Corp 発光装置及びその製造方法
JP5549428B2 (ja) * 2010-06-30 2014-07-16 東芝ライテック株式会社 発光モジュール及びこれを備えた照明器具
CN105870288B (zh) * 2016-04-27 2018-08-14 天津三安光电有限公司 发光二极管及其制作方法

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Publication number Publication date
JP2004207258A (ja) 2004-07-22

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