JP4134663B2 - Method for manufacturing plasma display panel - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a plasma display panel.
[0002]
[Prior art]
For example, as shown in FIG. 4, a plasma display panel used in a thin display device includes a glass front substrate 2 and a rear substrate disposed so as to face each other so as to form a discharge space 1 therebetween. 3 is provided. A plurality of display electrode pairs including scan electrodes 4 and sustain electrodes 5 are arranged on the substrate 2 on the front side, and a dielectric layer 6 is formed to cover the scan electrodes 4 and the sustain electrodes 5. A protective layer 7 made of magnesium oxide is formed.
[0003]
On the back substrate 3, a plurality of data electrodes 8 are formed in a direction perpendicular to the scanning electrodes 4 and the sustain electrodes 5, and a partition wall 9 is formed so as to be positioned between the data electrodes 8. A phosphor layer 10 is formed on the substrate 3 between the barrier ribs 9 so as to cover the data electrodes 8. In some cases, a base dielectric layer is formed on the rear substrate 3 so as to cover the data electrodes 8, and the barrier ribs 9 and the phosphor layer 10 are formed on the base dielectric layer.
[0004]
In the discharge space 1, for example, a discharge gas made of a mixed gas of neon and xenon is sealed at a pressure of 400 to 600 Torr. A color image is displayed by causing the phosphor layer 10 to emit light by ultraviolet rays generated when a display discharge is caused between the scan electrode 4 and the sustain electrode 5 constituting the display electrode pair (for example, Patent Documents). 1).
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-164145
[Problems to be solved by the invention]
In such a plasma display panel, as one method for forming the dielectric layer 6 on the front substrate 2, a dielectric paste is applied to the substrate 2 held on the stage by a die coater, and then fired. Although the method is used, when the dielectric layer 6 is formed on the substrate 2 by this method, there is a problem that the depression 11 may be formed on the surface of the dielectric layer 6 as shown in FIG. . If the plasma display panel is configured with such a depression 11 formed on the surface of the dielectric layer 6, the emission luminance increases at the depression 11 and the breakdown voltage becomes poor, resulting in poor quality. .
[0007]
As a result of intensive studies on such problems through experiments, analyzes, etc., the cause of the formation of the depression 11 on the surface of the dielectric layer 6 is to apply a dielectric paste on the substrate 2 as shown in FIG. It was found that the dust 13 was sandwiched between the stage 12 holding the substrate 2 by suction and the substrate 2 during the process. That is, since such dust 13 exists, the dielectric paste is applied onto the substrate 2 in a state where the substrate 2 is convex upward, and as a result, the depression 11 is formed on the surface of the dielectric layer 6. Was formed. In particular, when the substrate 2 constituting the panel becomes large, such as a plasma display panel capable of obtaining a large screen, there is a high possibility that dust 13 will adhere to the substrate 2 in the manufacturing process. Therefore, the surface of the dielectric layer 6 is depressed. 11 is easily formed, and quality defects due to the influence of the dust 13 are likely to occur.
[0008]
The present invention has been made in view of such a current situation, and an object of the present invention is to provide a method of manufacturing a plasma display panel capable of suppressing the occurrence of quality defects.
[0009]
[Means for Solving the Problems]
In order to achieve this object, the present invention has, on a surface on which a substrate is placed, a substrate holding portion that holds the substrate and a plurality of space forming portions that form spaces between the placed substrates. The space forming portions are dispersedly arranged, and a stage configured so that the substrate holding portion is present all around the space forming portion is used, and a substrate for the plasma display panel is held on the stage to be mounted on the substrate. It is a manufacturing method of the plasma display panel characterized by performing processing.
[0010]
Further, the present invention is characterized in that the shape of the space forming portion is a circle or a rectangle .
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a method for manufacturing a plasma display panel according to an embodiment of the present invention will be described with reference to FIGS.
[0012]
FIG. 1 is a cross-sectional view for explaining a method of manufacturing a plasma display panel according to an embodiment of the present invention, which is a step of forming a dielectric layer 6 on a substrate 2 on the front surface side. The state where the dielectric paste 15 is applied on the substrate 2 held on the stage 14 is shown. The plasma display panel has the same configuration as that described with reference to FIG. The dielectric paste 15 is applied on the substrate 2 so as to cover the scan electrode 4 and the sustain electrode 5 after the scan electrode 4 and the sustain electrode 5 are formed on the substrate 2, but in FIG. It is omitted.
[0013]
As shown in FIG. 1, the stage 14 has a substrate holding portion 16 and a concave portion 17 on the surface on which the substrate 2 is placed. When the substrate 2 is placed on the stage 14, the substrate 2 is held by the substrate holding part 16, and the recess 17 is a space forming part that forms a space between the substrate 2 and the stage 14. The substrate 2 and the stage 14 are not in contact with each other. Further, a part of the substrate holding part 16 is provided with a through hole 18 that is a suction means for vacuum sucking the substrate 2, and the through hole 18 is connected to a vacuum pump. By being sucked, it is sucked and held on the stage 14.
[0014]
When the dielectric layer 6 is formed on the substrate 2, first, the substrate 2 is attracted and held on the stage 14, and the dielectric paste 15 is supplied to the paste application unit 19 while the paste application unit 19 is moved in the direction of the arrow 20. The dielectric paste 15 is applied on the substrate 2 by running. The dielectric paste 15 is supplied to the paste applying means 19 by a paste supply pump (not shown), and is applied from the tip of the paste applying means 19. As described above, the dielectric layer 15 is formed on the substrate 2 by applying the dielectric paste 15 on the substrate 2 and then baking it.
[0015]
FIG. 2 is a perspective view of the stage 14 shown in FIG. 1, and a broken line 21 represents the position of the substrate 2 that is sucked and held on the stage 14. As shown in FIG. 2, a plurality of stripe-shaped recesses 17 are formed between the through holes 18 on the surface of the stage 14 (the surface holding the substrate 2). As the material of the stage 14, stainless steel, aluminum alloy, stone, or the like is used.
[0016]
As described above, when the substrate 2 is placed on the stage 14, the back surface of the substrate 2 and the stage 14 are not in contact with each other in the recess 17. Accordingly, even if dust adheres to the back surface of the substrate 2 as compared with a stage not provided with such a recess 17, the probability that the dust will enter the recess 17 is increased, and the stage 14 and the substrate 2 are in contact with each other. It is possible to reduce the probability that dust is present in the substrate holding part 16 that performs the process. Therefore, it is possible to suppress the occurrence of poor quality such that a depression is formed in the dielectric layer 6 due to the presence of dust between the stage 14 and the substrate 2. The shape of the recess 17 is not limited to a stripe shape, and may be a lattice shape, for example. That is, when the substrate 2 is held on the stage 14, a recess may be provided on the surface of the stage 14 so that a non-contact portion between the stage 14 and the substrate 2 exists.
[0017]
In the stage 14 shown in FIG. 2, for example, when the stripe-shaped recesses 17 having a width of 10 mm are arranged and formed at a pitch of 20 mm, the substrate 2 and the stage 14 are compared with the stage in which the recesses 17 are not formed. The area of the substrate holding part 16 that is in contact can be reduced to almost half. For this reason, generation | occurrence | production of the quality defect that a hollow is formed in the dielectric material layer 6 by the influence of dust can be reduced.
[0018]
Next, another example of the stage according to the embodiment of the present invention is shown in FIG. The stage 22 has a substrate holding part 16 and a recess 23 on the surface on which the substrate 2 is placed, and a through hole 18 that is a suction means for vacuum-sucking the substrate 2 is formed in a part of the substrate holding part 16. Has been. As the material of the stage 22, stainless steel, aluminum alloy, stone, or the like is used. A broken line 21 represents the position of the substrate 2 to be sucked and held on the stage 22. The recesses 23 have a circular shape and are arranged and formed at equal intervals in the X direction and the Y direction on the surface of the stage 22. When the substrate 2 is placed on the stage 22, the substrate 2 is held by the substrate holding part 16, and the recess 23 is a space forming part that forms a space between the substrate 2 and the stage 22. The substrate 2 and the stage 22 are not in contact with each other. For this reason, compared with the stage which does not provide the recessed part 23, even if dust has adhered to the back surface of the board | substrate 2, the probability that this dust will enter into the recessed part 23 becomes high, and the stage 22 and the board | substrate 2 contact. The probability that dust exists in the substrate holding part 16 can be reduced. Therefore, it is possible to suppress the occurrence of a quality defect such that a depression is formed in the dielectric layer 6 due to the presence of dust between the stage 22 and the substrate 2.
[0019]
In the case of the stage 22 shown in FIG. 3, a plurality of recesses 23 are formed so as to be evenly arranged in the X and Y directions on the surface. As described above, the plurality of recesses 23 are scattered and arranged in the surface of the stage 22, and the substrate holding part 16 is formed between the recesses 23. When the substrate 2 is sucked and held on the stage 22 having such a configuration, the substrate 2 is held on the entire surface of the substrate 2 by the substrate holding portions 16 arranged at a certain interval. For this reason, when the substrate 2 is held by the substrate holding portion 16, desired flatness can be obtained over the entire surface of the substrate 2. In particular, when the substrate 2 becomes large, desired flatness can be effectively obtained over the entire surface of the substrate 2 by using the stage 22 in which the concave portions 23 are arranged in a scattered manner.
[0020]
Further, when the circular recess 23 formed on the surface of the stage 22 is arranged and formed, for example, with a diameter of 10 mm and a center distance of 15 mm in the X direction and the Y direction, compared to a stage in which the recess 23 is not formed. Thus, the area of the substrate holding part 16 where the substrate 2 and the stage 22 are in contact can be reduced to about 2/3.
[0021]
In FIG. 3, the circular recesses 23 are arranged at equal intervals on the surface of the stage 22, but they may not be arranged at equal intervals, and the recesses 23 may have a shape other than a circle, for example, a quadrangle. In addition, the size, arrangement interval, arrangement pattern, and the like of the recesses 23 may be set as appropriate in consideration of the effect of reducing the influence of dust.
[0022]
In addition, since the size of the dust in question is assumed to be about 50 to 100 μm in diameter, if the depth of the recesses 17 and 23 provided on the stages 14 and 22 is about 200 μm, quality defects due to dust occur. Can be suppressed. Of course, if the depth of the recesses 17 and 23 is equal to or larger than the diameter of the dust, it is possible to suppress the occurrence of defective quality due to dust. For example, even if through holes are formed instead of the recesses 17 and 23, the quality due to dust The occurrence of defects can be suppressed. Here, when the recesses 17 and 23 are formed considerably deep, or when a through hole is formed instead of the recesses 17 and 23, the strength of the stages 14 and 22 is weakened. In particular, when the total area occupied by the recesses 17 and 23 and the through holes is increased in order to reduce the influence of dust, the strength of the stages 14 and 22 will be weakened, and depending on the material of the stages 14 and 22 It becomes difficult to form the recesses 17 and 23 and the through holes. For this reason, the depths of the recesses 17 and 23 may be set as appropriate in consideration of the strength of the stages 14 and 22 and the like, as well as the size of the assumed dust diameter.
[0023]
In this embodiment, the case where the dielectric paste 15 is applied on the front substrate 2 by the die coater has been described. However, printing is performed to form electrodes on the front substrate 2 or the rear substrate 3. When the substrate is sucked and held on the stage and processed into the substrate, such as when performing exposure, etc., the use of the stage according to this embodiment can suppress the occurrence of quality defects due to the influence of dust. it can. Even when a groove, which is a suction means for vacuum suction of the substrate, is provided on the surface of the stage, the same effect can be obtained by providing a space forming portion such as a recess in the stage. Furthermore, the same effect can be obtained by providing a space forming portion such as a recess in the stage when the substrate is processed by simply placing the substrate on the stage instead of holding the substrate by suction using a vacuum pump. Can be obtained.
[0024]
As described above, by holding a substrate on a stage provided with a space forming part such as a recess and processing the substrate, the probability that dust is present at the contact portion between the stage and the substrate can be reduced. The occurrence of poor quality due to the influence of dust can be suppressed.
[0025]
【The invention's effect】
As is apparent from the above description, according to the plasma display panel manufacturing method of the present invention, it is possible to suppress the occurrence of quality defects due to the influence of dust between the substrate and the stage.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view for explaining a manufacturing method of a plasma display panel according to an embodiment of the present invention. FIG. 2 is a perspective view of a stage used in the manufacturing method of the plasma display panel. FIG. 4 is a perspective view showing a main part of a conventional plasma display panel. FIG. 5 is a perspective view showing a surface of a dielectric layer in a conventional plasma display panel manufacturing method. FIG. 6 is a cross-sectional view illustrating a state in which a dent is formed in the conventional plasma display panel manufacturing method. FIG. 6 is a cross-sectional view for explaining the cause of the formation of a dent on the surface of the dielectric layer.
2, 3 Substrate 14, 22 Stage 16 Substrate holder 17, 23 Recess

Claims (3)

The surface on which the substrate is placed has a substrate holding portion that holds the substrate, and a plurality of space forming portions that form spaces between the placed substrates, and the plurality of space forming portions are scattered and arranged. What is claimed is: 1. A plasma display panel , comprising: a stage configured to have the substrate holding part around the space forming part; and holding the substrate for the plasma display panel on the stage and processing the substrate. Production method. The method of manufacturing a plasma display panel according to claim 1, wherein the shape of the space forming portion is a circle or a rectangle .   The method for manufacturing a plasma display panel according to claim 1, wherein the substrate holding unit is provided with suction means for vacuum suction of the substrate.

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