JP2005050559A - Manufacturing method of display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of forming a partition of a minute shape with good precision by preventing peeling of a mask at forming of the partition for a display device. <P>SOLUTION: The manufacturing method of the display device having partitions for forming pixels includes a first process of forming a partition material film on a first main face of a base plate, a second process of forming a resist film 201 patterned on the partition material film, and a third process of forming the partitions by etching the partition material film by masking the resist film 201. The resist film 201 comprises a linear part 201C formed almost on a line and an adhesion sustaining part 201E for sustaining adhesion between the resist film and the partition material film. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a display device, and more particularly to a method for manufacturing a display device having a partition wall for forming pixels.
[0002]
[Prior art]
Plasma display panels (hereinafter referred to as “PDP”) have features such as easy large screens, good display quality, and a wider viewing angle compared to liquid crystal displays. For this reason, it has come to be used as a large display device such as a wall-mounted display.
[0003]
An outline of the operation principle of the PDP is an ultraviolet ray generated by optical transition caused by exciting particles (atoms) of a rare gas by causing a discharge in a discharge space filled with a gas filled with a rare gas, for example, called a display cell. The phosphor is excited by the above, and the visible light from the phosphor is used for display light emission.
[0004]
FIG. 1 is a cross-sectional perspective view schematically showing a part of the structure of a PDP 100, which is an example of a conventional alternating current (AC) drive type PDP.
[0005]
Referring to FIG. 1, in the PDP 100, a front plate 107 made of a glass substrate and a back plate 101 are arranged to face each other with a discharge space 106 in between. A display electrode 108 is arranged on the front plate 107 on the side facing the back plate 101, the display electrode 108 is covered with a dielectric film 109, and the dielectric film 109 is further a protective film 110. The structure is covered with. The display electrode 108 is configured by arranging a pair of band-like scanning electrodes and sustaining electrodes in parallel with each other.
[0006]
On the other hand, a plurality of strip-like data electrodes 102 orthogonal to the display electrodes 108 are provided on the back plate 101 on the side facing the front plate 107, and the plurality of data electrodes 102 are parallel to each other. The data electrodes 102 are arranged and covered with a dielectric film 103.
[0007]
Further, a partition wall 104 is provided on the dielectric film 103 to separate the plurality of data electrodes 102 and form a discharge space 106 to separate pixels (display cells). A phosphor film 105 is formed from the dielectric film 103 on the data electrode 102 to the side surface of the partition wall 104. The PDP 100 shown in FIG. 1 has a structure in which, for example, red, green, and blue phosphor films 105 are sequentially arranged with the partition wall 104 interposed therebetween in order to enable color display.
[0008]
The discharge space 106 is filled with a filling gas made of an inert gas, and the filling gas is made of a mixed gas of, for example, at least one of He, Ne, and Ar and Xe.
[0009]
In the PDP 100 having such a structure, the dielectric films 103 and 109 are provided for accumulating charges generated by applying a voltage to the data electrode 102 and the display electrode 108.
[0010]
In addition, the number of display cells is arbitrary, and actually, a PDP which is a large display device is formed by combining a large number of display cells.
[0011]
The PDP 100 has a structure in which a discharge is generated in the discharge space 106 by applying a voltage to the display electrode 108 or the data electrode 102.
[0012]
By causing a discharge in the discharge space 106, the noble gas particles (molecules, atoms) of the sealed gas are excited, the phosphor is excited by ultraviolet rays generated by the optical transition, and visible light from the phosphor is changed. The structure is used for display light emission.
[0013]
For example, a method of forming the barrier rib 104 by separating the discharge space in which discharge occurs to form a display cell has been used, for example, by a screen printing method. In order to cope with this, a method of forming partition walls by a sandblast method has become mainstream. (For example, refer nonpatent literature 1.)
FIG. 2 is a perspective view of the partition 104 formed on the back substrate 101 by the sandblast method. However, in the drawing, only the back substrate 101 and the partition 104 are shown, and other structures such as a data electrode and a dielectric film are not shown.
[0014]
The partition wall is formed by the sandblasting method as follows. First, after forming a partition material film as a material for forming the partition on the substrate, a resist film of a photosensitive agent is formed on the partition material film. Next, patterning of the resist film is performed by photolithography, and then, using the patterned resist film as a mask, sand blasting treatment is performed by spraying a powdery abrasive on the partition wall material film, and the resist film is covered with the resist film. The part of the partition wall material film that is not cut is removed by cutting with the abrasive.
[0015]
Thereafter, the partition wall 104 shown in FIG. 2 can be formed by removing the resist film.
[0016]
[Non-Patent Document 1]
"Large-screen wall-mounted TV" Murakami et al., IPSJ
[0017]
[Patent Document 1]
JP-A-8-290361
[0018]
[Patent Document 2]
Japanese Patent Laid-Open No. 10-172424
[0019]
[Patent Document 3]
JP-A-11-90827
[0020]
[Problems to be solved by the invention]
However, when the partition walls are formed by the sandblasting method, there may be a problem that the resist film is peeled off during the sandblasting process.
[0021]
For example, in recent PDPs with higher performance, it is necessary to increase the number of pixels in order to improve the resolution, and therefore, it is necessary to reduce the width W0 of the partition wall shown in FIG. Further, since it is necessary to increase the light emission luminance by increasing the width P0 between the barrier ribs and increasing the width of the discharge space shown in FIG. 2, it is necessary to reduce the width W0 of the barrier ribs.
[0022]
Therefore, the resist film, which is a mask for sandblasting the partition wall material film, also needs to have a small width corresponding to the width W0.
[0023]
As a result, the contact area between the resist film and the partition wall material film is reduced and the adhesive force is reduced, so that the resist film is easily peeled off from the partition wall material film. For example, the resist film is formed on the end 104A of the partition wall 104. In addition, the resist film has a problem that peeling easily occurs. Such a phenomenon is caused by, for example, the fact that the end portion is easily affected by the spray pressure of the abrasive during the sandblasting process, or the stress effect of the resist film is easily concentrated. It is guessed.
[0024]
In addition, for example, when the resist film is peeled off at the end portion, a region where the resist film is peeled may be gradually expanded and may progress to peeling of the entire resist film. As a result, the partition wall that should be originally formed is deleted, causing problems such as missing or non-partition of the partition wall, which may cause the panel to malfunction when performing image display.
[0025]
Accordingly, an object of the present invention is to provide a method for manufacturing a useful display device that solves the above problems.
[0026]
A specific problem of the present invention is to prevent a mask from being peeled off when a partition wall of a display device is formed, and to form a fine partition wall with high accuracy.
[0027]
[Means for Solving the Problems]
In the present invention, in order to solve the above-described problem, a method for manufacturing a display device having a partition wall for forming a pixel, the first step of forming a partition wall material film on the first main surface of the substrate, A second step of forming a patterned resist film on the partition wall material film; and a third step of etching the partition wall material film using the resist film as a mask to form the partition wall. The film includes a strip-shaped straight portion and an adhesion maintaining portion formed at an end portion of the linear portion for maintaining adhesion between the resist film and the partition wall material film. Solve by manufacturing method.
[0028]
According to the present invention, for maintaining the adhesion between the resist film and the partition wall material film at the end of the linear portion of the resist film used when the partition wall film is formed by etching the partition wall material film. The adhesion maintaining part is provided. Therefore, when the partition wall material film is etched, the resist film is prevented from being peeled off from the partition wall material film, so that the partition wall having a fine shape can be formed with high accuracy.
[0029]
In the above case, the etching is preferably a sandblasting method. In this case, the adhesion maintaining portion of the resist film prevents the resist film from being peeled off from the partition wall forming material film by the spray pressure by the sandblast method.
[0030]
In the above case, it is preferable that the lateral width of the adhesion maintaining portion is larger than the lateral width of the linear portion.
[0031]
In this case, since the area of the adhesion maintaining portion is large, the adhesion between the resist film and the partition wall material film is increased.
[0032]
In the above case, a plurality of the resist films are formed, the first resist film has a first straight portion and a first adhesion maintaining portion, and the second resist film adjacent to the first resist film is It is preferable that a second linear part and a second adhesion maintaining part are provided, and the first adhesion maintaining part and the second adhesion maintaining part are the same. In this case, the area of the adhesion maintaining portion is increased, and the adhesion force between the resist film and the partition wall material film is increased.
In the above case, the third resist film adjacent to the second resist film has a third linear portion and a third adhesion maintaining portion, and the second adhesion maintaining portion and the third adhesion It is preferable that the maintenance unit is the same. In this case, in this case, the area of the adhesion maintaining portion is further increased, and the adhesion between the resist film and the partition wall material film is further increased.
[0033]
DETAILED DESCRIPTION OF THE INVENTION
[First embodiment]
FIG. 3 is a cross-sectional perspective view schematically showing a part of the structure of an alternating current (AC) drive type PDP 10 which is an example of a display device formed by using the method for manufacturing a display device according to the present invention.
[0034]
Referring to FIG. 3, in the PDP 10, a front plate 17 made of a glass substrate and a back plate 11 are arranged to face each other with a discharge space 16 interposed therebetween. A display electrode 18 is disposed on the front plate 17 on the side facing the back plate 11, the display electrode 18 is covered with a dielectric film 19, and the dielectric film 19 is further protected by a protective film 20. The structure is covered with. The display electrode 18 is configured by arranging a pair of strip-like scan electrodes and sustain electrodes in parallel with each other.
[0035]
On the other hand, a plurality of strip-shaped data electrodes 12 orthogonal to the display electrode 18 are provided on the back plate 11 on the side facing the front plate 17, and the plurality of data electrodes 12 are parallel to each other. The data electrodes 12 are arranged and covered with a dielectric film 13.
[0036]
Further, a partition wall 14 is provided on the dielectric film 13 for separating the plurality of data electrodes 12 and forming discharge spaces 16 to separate pixels (display cells). Further, a phosphor film 15 is formed from the dielectric film 13 on the data electrode 12 to the side surface of the partition wall 14. The PDP 10 shown in FIG. 3 has a structure in which, for example, red, green, and blue phosphor films 15 are sequentially arranged with the partition wall 14 interposed therebetween in order to enable color display.
[0037]
The discharge space 16 is filled with a filling gas made of an inert gas, and the filling gas is made of, for example, a mixed gas of at least one of He, Ne, and Ar and Xe.
[0038]
In the PDP 10 having such a structure, the dielectric films 13 and 19 are provided for accumulating charges generated by applying a voltage to the data electrode 12 and the display electrode 18.
[0039]
In addition, the number of display cells is arbitrary, and actually, a PDP which is a large display device is formed by combining a large number of display cells.
[0040]
In the figure, the direction parallel to the display electrode 18 is the x-axis direction, the direction parallel to the data electrode is the y-axis direction, and is perpendicular to the x-axis direction and the y-axis direction. A direction toward the front substrate 17 is a z-axis direction.
[0041]
The operation principle of the PDP 10 is as follows. First, the reset discharge of the display electrode 18 (between the scan electrode and the sustain electrode) is performed in the discharge space 16 of all the cells, the wall charge state is made the same, and then the scan electrode of the display electrode 18 is scanned. At the same time, a voltage is selectively applied to the data electrode 12 to cause an address discharge in the discharge space 16.
[0042]
As a result, wall charges are selectively formed on the display electrode 18. Therefore, when a discharge sustain voltage is next applied to the display electrode 18, it is possible to control whether or not a discharge occurs in the discharge space 16, and depending on the number of sustain discharges in the discharge space 16, An image can be displayed by controlling display gradation.
[0043]
Thus, in the PDP 10, image display is performed by controlling the discharge in the discharge space 16 separated by the barrier ribs 14.
[0044]
FIG. 4 is a perspective view schematically showing a state in which the partition 14 forming the display cells (pixels) is formed by separating the discharge space in which discharge occurs in this manner, and is formed on the back substrate 11. However, in the figure, only the back substrate 11 and the partition 14 are shown, and other structures such as a data electrode and a dielectric film are not shown. In the figure, the x-axis, y-axis, and z-axis are the same as those in FIG.
[0045]
Referring to FIG. 4, on the back substrate 11, from the first end of the back substrate 11 toward the second end facing the first end, that is, in the y-axis direction. A plurality of partition walls 14 are formed, each of which includes a partition straight line portion 14C formed linearly in parallel with the partition wall end 14E formed at the end of the straight partition wall portion.
[0046]
The partition wall 14 is formed as follows by an etching process such as a sandblast method. First, after forming a partition material film as a material for forming a partition on the back substrate 11, a resist film of a photosensitive agent is formed on the partition material film. Next, patterning of the resist film is performed by photolithography, and then, using the patterned resist film as a mask, sand blasting treatment is performed by spraying a powdery abrasive onto the partition wall material film, and the resist film is covered with the resist film. The part of the partition wall material film that is not cut is removed by cutting with the abrasive. Thereafter, the partition 14 shown in FIG. 4 is formed by peeling the resist film.
[0047]
In the conventional case, the resist film may be peeled off at the end portion in the y-axis direction of the resist film particularly during the sandblasting process. However, in this embodiment, the resist film is prevented from being peeled by providing an adhesion maintaining portion between the partition wall material film and the resist film at the end in the y-axis direction of the patterned resist film. As a result, the formed partition has a shape as shown in FIG. Next, FIG. 5 shows a plan view showing the shape of the resist film after patterning, which is formed on the partition wall material film, used when forming the partition wall 14 shown in FIG. However, in the figure, the x-axis direction and the y-axis direction are the same as those in FIGS.
[0048]
Referring to FIG. 5, the resist film 201 for forming the partition wall 14 includes a linear portion 201C formed linearly in parallel with the y-axis direction, and an end portion of the linear portion 201C in the y-axis direction. For example, a substantially elliptical adhesion maintaining portion 201E. Further, the straight portion 201C does not necessarily have to be a geometrically accurate straight line, and may be substantially straight. Further, for example, it can be modified or changed according to the shape of the partition wall 14.
[0049]
The adhesion maintaining part 201E is formed such that the width AW in the x-axis direction of the adhesion maintaining part 201E is larger than the width L1 of the linear part 201C in the x-axis direction. For this reason, the adhesion force between the partition wall material film and the resist film at the adhesion maintaining portion 201E is increased, and the resist film 201 at the end in the y-axis direction of the resist film 201, which has been a starting point of peeling of the resist film in the related art. Prevents peeling.
[0050]
Further, in that case, it is preferable that the length AL in the y-axis direction perpendicular to the x-axis direction of the adhesion maintaining portion 201E is 1.5 times or more the width AW because the adhesion force is increased.
[0051]
Further, in the case of forming a fine pattern, as shown in FIG. 5, when the adhesion maintaining portion 201E is formed, the adhesion maintaining portion 201E is connected to the adhesion maintaining portion 201E adjacent to the adhesion maintaining portion 201E. , It is preferable to displace in the y-axis direction.
[0052]
As described above, by using the resist film provided with the adhesion maintaining portion at the end in the y-axis direction, it is possible to prevent the resist film from being peeled off when the partition wall material portion is etched. For this reason, fine processing with a reduced resist width is possible, and for example, the width W1 of the partition wall 14 shown in FIG. 4 can be reduced, so that a fine partition wall can be formed with high accuracy. For this reason, it is possible to increase the number of pixels and improve the resolution in response to recent high performance PDPs. Similarly, the width P1 shown in FIG. 4 can be increased, the discharge space can be increased to improve the light emission luminance, and the light emission efficiency can be increased.
[0053]
In addition, since defects caused by resist stripping during barrier rib formation are reduced, the yield of panel manufacturing is improved, and variation in discharge space is reduced, so that the drive voltage for image display can be made uniform. Thus, the drive voltage margin can be increased. In addition, the power consumption can be suppressed by reducing the drive voltage.
[Second Embodiment]
Further, in the resist film 201 shown in FIG. 5, the adhesion maintaining portion 201E can be used in various shapes. For example, the shape can be changed like the resist film 202 shown in FIG. In this case, the same effect as that obtained when the resist film 201 is used can be obtained.
[0054]
FIG. 6 is a plan view showing a resist film 202 which is a modification of the resist film 201. However, in the figure, the same reference numerals are given to the parts described above, and the description will be omitted.
[0055]
Referring to FIG. 6, the resist film 202 includes a linear portion 201C formed linearly in parallel with the y-axis direction, and an adhesion maintaining portion formed at an end portion of the linear portion 201C in the y-axis direction. 202E.
[0056]
The adhesion maintaining portion 202E is formed such that the width AW ′ of the adhesion maintaining portion 201 in the x-axis direction is larger than the width L1 of the linear portion 201C in the x-axis direction. For this reason, the adhesion force between the partition wall material film and the resist film at the adhesion maintaining portion 201E is increased, and the resist film 201 at the end in the y-axis direction of the resist film 201, which has been a starting point of peeling of the resist film in the related art. Prevents peeling.
[0057]
In this case, it is preferable that the length AL in the y-axis direction perpendicular to the x-axis direction of the adhesion maintaining portion 202E is 1.5 times or more the width AW because the adhesion force is increased. Is the same as in the case of the resist film 201.
[0058]
In the case of the present embodiment, the adhesion maintaining portion 202E has a polygonal shape, for example, an octagonal shape. Also in the case of the present embodiment, the same effect as in the case of the substantially elliptical adhesion maintaining portion 201E is achieved. In this case, the angle α formed by the outer edge portion of the linear portion 201C and one side connected to the polygonal linear portion 201C of the adhesion maintaining portion 202E is 90 ° ≦ α ≦ 180 ° C. When formed in this manner, it is suitable for preventing the resist film from peeling off.
[0059]
As described above, the shape of the adhesion maintaining portion of the resist film can be variously modified and used, and the same effect as that obtained when the resist film 201 is used can be obtained.
[Third embodiment]
Next, as an example of a method for forming a display device using a resist film having an adhesion maintaining portion such as the resist film 201 shown in FIG. 5 or the resist film 202 shown in FIG. An example of a method for forming the PDP 10 is shown in FIG. However, in the figure or in the text, the same reference numerals are assigned to the parts described above, and the description is omitted.
[0060]
FIG. 7 shows a procedure for forming electrodes, a dielectric film, etc. on the front substrate 17 as a front panel and on the rear substrate 11 as a rear panel, and further, the front panel and the rear panel are overlapped to form a panel. The procedure for completing (PDP) is shown.
[0061]
First, regarding the front panel, first, in step 101 (denoted as S101 in the figure, the same applies hereinafter), on the front substrate 17 made of, for example, a glass substrate, for example, ITO or SnO ₂ A transparent conductive film made of, for example, and a laminated film made of chromium (Cr) / copper (Cu) / Cr (chromium) are formed by a sputtering method, and further formed into a belt-like pattern to form the display electrode 18. .
[0062]
Next, in step 102, the dielectric film 19 is formed by printing and drying a low-melting glass paste on the front plate 17 on which the display electrodes 18 are formed, followed by firing.
[0063]
Next, after forming a panel sealing film in step 103, the protective film 20 made of MgO is formed by using, for example, sputtering so as to cover the dielectric film 19 in step 104, and the front panel is formed. Finalize.
[0064]
On the other hand, regarding the rear panel, first, in step 201, a photosensitive silver paste is formed in a strip pattern at a desired position on the rear substrate 11 made of, for example, a glass substrate, thereby forming the data electrode 12 made of silver. In step 202, the dielectric film 13 is formed so as to cover the data electrode 12.
[0065]
Next, in step 203, a partition material film 14 ′ (described later) is formed on the dielectric film 13 by etching to form the partition 14.
[0066]
Next, in step 204, a resist film 201 ′ (described later) is formed on the partition wall material film 14 ′. In step 205, the resist film 201 ′ is patterned by photolithography, for example, as shown in FIG. Such a resist film 201 or a name resist film 202 as shown in FIG. 6 is formed.
[0067]
Next, in step 206, for example, the patterned resist film 201 is used as a mask to perform an etching process such as a sand blast process, so that the partition wall material film 201 ′ not covered with the resist film 201 is powdered. The partition 14 is formed by cutting and removing with an abrasive.
[0068]
Next, in step 207, the resist film 201 is removed, and in step 208, the partition wall 14 is baked to make the partition wall 14 sufficiently strong.
[0069]
Next, the phosphor film 15 is applied to the side walls of the dielectric film 13 and the barrier ribs 14. The phosphor film 15 completes a rear panel by separately coating, for example, a red light emitter, a green light emitter, and a blue light emitter.
[0070]
Next, in step 301, the front panel and the rear panel are bonded together so that the display electrode 18 and the data electrode 12 are orthogonal to each other, and the peripheral portion is sealed with glass frit.
[0071]
Next, firing is performed in step 302 and the discharge space 16 is evacuated. Then, a sealed gas in which, for example, Ne is mixed with Xe is sealed in the discharge space 16, and aging is performed in step 303. PDP is completed.
[0072]
In the partition wall forming process L in steps 203 to 208, details will be described with reference to FIGS. 8 (A) to (D) and FIGS. 9 (E) to (F). However, in the figure, the same reference numerals are given to the parts described above, and the description will be omitted.
[0073]
First, as shown in FIG. 8A, in step 203, the back substrate 11 is baked by, for example, a thick film coating method such as screen printing, gravure coating, doctor blade, or slot coating. For example, the partition wall material film 14 ′ is formed to have a thickness of about 120 μm in terms of heat shrinkage. In the figure, the data electrode 12 and the dielectric film 13 formed on the back substrate 11 are not shown.
[0074]
Next, as shown in FIG. 8B, in step 204, a resist film 201 ′ made of, for example, a dry film resist (DFR) is laminated on the partition wall material film 14 ′ by a hot roll laminator. . In this case, the resist film 201 ′ may be formed by coating.
[0075]
Next, as shown in FIG. 8C, in the step 205, the resist film 201 ′ is patterned by a photolithography method so that, for example, the resist film 201 as shown in FIG. 5 or as shown in FIG. A resist film 202 is formed.
[0076]
Next, as shown in FIG. 8D to FIG. 9E, in step 206, for example, an etching process such as a sand blast process is performed, and a portion not covered with the resist film 201 is etched and removed. To do. In this case, as shown in FIG. 9D, for example, a powdery alumina powder (average powder particle size of 15 μm) is used as the abrasive 302 by a sandblasting apparatus 300 having a jet nozzle 301 having a diameter of 5 mm. By performing the processing with an injection amount of 1000 g / min, the line width W1 shown in FIG. 9E is 40 μm, and the aspect ratio (the width of the partition wall 14 is higher than the line width W1 shown in FIG. 9E). It is possible to form the partition wall 14 having a ratio T1 of 3).
[0077]
Next, as shown in FIG. 9F, in step 207, the resist film 201 is removed, and in step 208, the partition walls are baked to improve the strength of the partition walls, thereby completing the partition walls 14. .
[0078]
In this embodiment, the line width W1 shown in FIG. 9E is small and the aspect ratio is a technique effective for microfabrication. According to this embodiment, the line width W1 is 50 μm or less and the aspect ratio is However, it is possible to form one or more fine pattern partition walls.
[0079]
In addition, since the resist film used as a mask during the blasting process is provided with the adhesion maintaining portion at the end portion as described above, the resist film is prevented from peeling off from the end portion, and in the case of a fine pattern partition wall. Can be formed with high accuracy.
[Fourth embodiment]
Further, the resist film 201 can be used after being modified like the resist film 203 or 204 shown in FIG. 10, and in this case, the same effect as that obtained when the resist film 201 is used can be obtained.
[0080]
FIG. 10 is a plan view showing the resist films 203 and 204. However, in the figure, the x-axis direction and the y-axis direction are the same as those in FIGS.
[0081]
Referring to FIG. 10, the resist film 203 includes a linear portion 203C formed linearly in parallel with the y-axis direction, and first and second ends of the linear portion 201C in the y-axis direction. It consists of an adhesion maintaining part 203E formed in the part. In the case of the resist film 203 according to the present embodiment, a plurality of adjacent linear portions 203C share a plurality of contact portions 203E.
[0082]
For example, the first straight line portion 203C and the second straight line portion 203C adjacent to the first straight line portion 203C share the same adhesion maintaining portion 203E at the first end. .
[0083]
Further, the first straight line portion 203C is further adjacent to a third straight line portion 203C different from the second straight line portion 203C. The third straight line portion 203C is formed at a position facing the second straight line portion 203C across the first straight line portion 203C. Therefore, the first straight line portion 203C and the third straight line portion 203C have a structure in which the second end portion shares the adhesion maintaining portion 203E.
[0084]
Therefore, in this embodiment, the same effect as in the case of the resist film 201 can be obtained, and the adhesion force can be increased by increasing the area where the partition wall material film and the resist film are adhered in the adhesion maintaining portion. Therefore, it is possible to increase the effect of preventing the resist film from peeling and to reduce the area where the adhesion maintaining portion is formed.
[0085]
As shown in Step 302 of FIG. 7, the discharge space separated by the formation of the barrier ribs is exhausted at the time of creating the PDP, and further, there is a process of filling the discharge space with a sealed gas. It is necessary to secure an exhaust path for gas filling.
[0086]
In the present embodiment, the portion of the end portion 205 that is cut and removed in the sand blasting process becomes an exhaust path, so that the discharge space can be exhausted and gas can be filled.
[0087]
Further, for example, the resist film 204 located at the end in the x-axis direction includes a straight portion 204C formed linearly in parallel with the y-axis direction, and a first side in the y-axis direction of the straight portion 204C. It consists of the adhesion maintenance part 204E formed in this. The adhesion maintaining portion 204E is connected to an adhesion maintaining portion 203E formed on the first side in the y-axis direction of the adjacent linear portion 203C.
[0088]
However, on the second side in the y-axis direction of the straight line portion 204C, it is necessary to secure the exhaust passage, and therefore the adhesion maintaining portion cannot be formed. Therefore, the width W2 of the straight portion 204C needs to be 1.2 times or more the width W1 of the straight portion 203C. Alternatively, the adhesion maintaining unit 201E or 202E may be provided.
[Fifth embodiment]
Further, the resist film 203 or 204 shown in FIG. 10 may be modified as shown in FIG.
[0089]
Referring to FIG. 11, the resist film 206 according to the present embodiment is formed on the straight portion 206C and the second side of the straight portion 206C opposite to the first side and the first side in the y-axis direction. The adhesion maintaining unit 206E.
[0090]
In the case of the present embodiment, all the close contact maintaining portions 206E are connected on the first side of the adjacent straight portions 206C, and all the close contact maintaining portions are similarly connected on the second side. 206E is connected.
[0091]
For this reason, in addition to the effects described in the fourth embodiment, it is possible to increase the adhesion area between the partition wall material film and the resist film in the adhesion maintaining portion, thereby increasing the adhesion force. It is possible to increase the effect of preventing peeling and further reduce the area where the adhesion maintaining portion is formed.
[0092]
However, in the case of the present embodiment, if the resist 206 is used as it is as a mask layer, the discharge space as described in the description of the fourth embodiment is exhausted, or the exhaust path for filling the filled gas is secured. It is difficult to form a partition wall.
[0093]
Therefore, for example, it is necessary to delete the partition wall end portion formed using the dense maintaining portion 206E as a mask by the method described next with reference to FIG.
[Sixth embodiment]
FIG. 12 is a perspective view schematically showing a state in which the resist film 206 is formed on the partition wall material film 14 ′ formed on the back substrate 11. The data electrodes and dielectric films formed on the back substrate 11 are not shown.
[0094]
In this embodiment, a removal film 400 made of the same resist material as the resist film 206 is formed between the back substrate 11 and the partition wall material film 14 ′.
[0095]
The removal film 400 is formed on the back substrate 11 (not shown in the figure, but in actuality, so as to cover the portion of the adhesion maintaining unit 206E projected onto the back substrate 11 in the z-axis direction. Formed on the dielectric film 13).
[0096]
From the state shown in FIG. 12, after completion of the sandblasting process, the resist film 206 is peeled off by a wet etching process such as a chemical solution. At this time, the removal film 400 is also peeled off at the same time, and the partition wall end formed on the removal film 400 under the adhesion maintaining portion 206E of the partition wall 14 ′ is also removed at the same time. In this case, since the resist film is removed before the partition walls are baked, the end portions of the partition walls are easily removed by removing the removal film 400. For this reason, it is possible to secure an exhaust path for exhausting the discharge space or filling the discharge space with the filled gas in the discharge space separated by the formed partition wall.
[Seventh embodiment]
An example of a manufacturing method for manufacturing a PDP using the resist film 206 using the method shown in FIG. 12 is shown in FIG. However, in the figure, the same reference numerals are given to the parts described above, and the description will be omitted.
[0097]
In this embodiment, the change from the case shown in FIG. 7 is that the resist film that becomes the removal film 400 is formed on the dielectric layer 13 formed on the back substrate 11 after the step 202. Step 202a, which is a process of forming the resist film, is added, and further, after Step 202a, a process of Step 202b for patterning the resist film is added to configure the partition wall formation process L ′.
[0098]
In the patterning of the resist film in step 202, for example, the resist film is patterned by a photolithography method, and as shown in FIG. 12, the adhesion maintaining portion 206E formed in a subsequent process is the dielectric film The dielectric film 13 is formed so as to cover a portion projected onto the dielectric film 13.
[0099]
The subsequent steps are the same as those shown in FIG. Further, since the removal film 400 is made of the same material as the resist film 206, the removal film 400 and the resist film 206 can be peeled off simultaneously in step 207, and the manufacturing process can be simplified. There is.
[0100]
Further, the method of removing the end portion of the partition wall by forming the removal film on the back substrate 11 as described above is similarly applied to the case where the resist layers 201, 202, 203, and 204 are used, for example. Is possible. In that case, by removing the end portion of the partition wall having a large installation area, the installation area of the partition wall can be reduced, and the region of the end portion of the substrate can be effectively used.
[0101]
Moreover, although AC drive type PDP was described in the Example, this invention is not limited to this. For example, the present invention can be applied to a DC drive type PDP, an AC / DC hybrid drive type PDP, and the like, and the same effects as those described in the embodiments can be obtained. Furthermore, as another display device, the present invention can be applied to a display device having a partition wall for separating pixels, for example, an FED (Field Emission Display).
[0102]
Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the specific embodiments described above, and various modifications and changes can be made within the scope described in the claims.
[0103]
【The invention's effect】
According to the present invention, it is possible to prevent the etching mask from being peeled off when forming the partition walls of the display device, and to form the fine partition walls with high accuracy.
[Brief description of the drawings]
FIG. 1 is a cross-sectional perspective view schematically showing a part of a conventional plasma display panel (PDP).
2 is a perspective view illustrating a state in which a partition wall of the PDP in FIG. 1 is formed. FIG.
FIG. 3 is a cross-sectional perspective view schematically showing a part of a PDP according to the present invention.
4 is a perspective view illustrating a state in which a partition wall of the PDP of FIG. 3 is formed.
5 is a plan view showing the shape of a resist film for forming the partition wall shown in FIG. 3. FIG.
6 is a view (No. 1) showing a modification of the resist film of FIG. 5; FIG.
FIG. 7 is a flowchart showing an example of a method for manufacturing a display device according to the present invention.
8A to 8D are views (No. 1) showing in detail a manufacturing method of the display device shown in FIG. 7;
FIGS. 9E to 9F are views (No. 2) showing the manufacturing method of the display device shown in FIG. 7 in detail;
10 is a diagram (No. 2) showing a modification of the resist film in FIG. 5; FIG.
FIG. 11 is a diagram (No. 3) illustrating a modification of the resist film in FIG. 5;
12 is a perspective view schematically showing how to use the resist film of FIG.
13 is a diagram showing a modification of the method for manufacturing the display device of FIG.
[Explanation of symbols]
10,100 PDP
11, 101, 17, 107 substrate
12,102 Data electrode
13, 103, 19, 109 Dielectric film
14,104 Bulkhead
15,105 phosphor film
16,106 discharge space
18,108 Display electrode
14 'partition material film
14C Bulkhead straight section
14E Bulkhead end
104A, 205 end
W0, W1, W2, P0, P1, AW, AW ', L1 width
AL, AL 'length
T1 height
α angle
L, L 'partition formation process
201, 202, 203, 204, 206 Resist film
201C, 202C, 203C, 204C, 206C Straight part
201E, 202E, 203E, 204E, 206E Adhesion maintaining unit
300 Sandblasting equipment
301 Nozzle
302 abrasive
400 Removal film

Claims (8)

A method of manufacturing a display device having a partition wall for forming a pixel,
A first step of forming a partition wall material film on the first main surface of the substrate;
A second step of forming a patterned resist film on the partition wall material film;
A third step of forming the barrier rib by etching the barrier rib material film using the resist film as a mask,
The resist film is
A belt-like straight section;
A method for manufacturing a display device, comprising: an adhesion maintaining portion for maintaining adhesion between the resist film and the partition wall material film formed at an end of the linear portion. The method for manufacturing a display device according to claim 1, wherein the etching is performed by a sandblast method. 3. The method of manufacturing a display device according to claim 1, wherein the lateral width of the adhesion maintaining portion is larger than the lateral width of the linear portion. A plurality of the resist films are formed, the first resist film has a first straight portion and a first adhesion maintaining portion, and the second resist film adjacent to the first resist film is a second straight portion. 4. The display according to claim 1, wherein the first adhesion maintaining unit and the second adhesion maintaining unit are the same. Device manufacturing method. The third resist film adjacent to the second resist film has a third linear portion and a third adhesion maintaining portion, and the second adhesion maintaining portion and the third adhesion maintaining portion are the same. The method for manufacturing a display device according to claim 4, wherein: 6. The method according to claim 1, further comprising a fourth step of removing an end portion of the partition wall formed using the adhesion maintaining portion as a mask after the third step. The manufacturing method of the display apparatus of description. A removal film made of a resist material is formed between the first main surface and the partition wall material film, and removing the removal film removes an end of the partition wall formed on the removal film. A method for manufacturing a display device according to claim 6. 8. The method of manufacturing a display device according to claim 7, wherein the resist film is made of the same resist material as the removal film, and the removal of the resist film and the removal film is performed simultaneously.

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