JP4265410B2 - Plasma display panel - Google Patents

Description

  The present invention relates to a plasma display panel known as a display device.

  In a plasma display panel (PDP), an ultraviolet ray is generated by gas discharge, and a phosphor is excited by the ultraviolet ray to emit light, thereby displaying an image.

  Such a plasma display device can display at a higher speed than a liquid crystal panel, has a wide viewing angle, is easy to enlarge, and is self-luminous so that the display quality is high. Recently, the flat panel display has attracted particular attention and is used for various purposes as a display device in a place where many people gather and a display device for enjoying a large screen image at home.

  PDPs are broadly divided into AC and DC types in terms of drive, and there are surface discharge types and counter discharge types in terms of discharge types. However, because of high definition, large screen, and simple structure, Then, a surface discharge type AC type PDP having a three-electrode structure is mainly used. The structure is such that on the front substrate, which is a glass substrate, a front plate in which a display electrode composed of a scan electrode and a sustain electrode and a first dielectric layer covering it are formed, and on a rear substrate, which is also a glass substrate. A discharge cell is formed at the intersection of the display electrode and the data electrode by arranging a plurality of data electrodes orthogonal to the display electrode and a back plate formed with a second dielectric layer covering the data electrode. In addition, a phosphor layer is provided in the discharge cell.

In the above configuration, as the first dielectric layer and / or second dielectric layer forming step, for example, a paste-like dielectric material containing powder of a low-melting glass material is screen-printed or die-coated. The method of drying after apply | coating by after, and baking after that is mentioned (for example, refer nonpatent literature 1).
2001 FPD Technology Taizen, Inc. Electronic Journal, October 25, 2000, p594-p597

  However, in the plasma display panel having the above-described configuration, when a drive voltage is applied to the electrodes, a withstand voltage failure may occur, and a good image display may not be performed. Therefore, as a result of the study by the present inventors, the cause is peeling, cracking (crack) or chipping generated in the first dielectric layer and / or the second dielectric layer. For example, when the firing is performed in the formation process, the occurrence mechanism of chipping or the like is such that the corner portion of the first dielectric layer or the second dielectric layer is angular or pointed. The stress concentration occurs at the corner due to the difference in thermal expansion between the front substrate and the first dielectric layer and the difference between the thermal expansion between the rear substrate and the second dielectric layer. Even if there is no peeling, cracking or chipping in the first dielectric layer or the second dielectric layer, and no peeling, cracking or chipping has occurred during firing, Stress is concentrated at the corner of Since there, due to vibration or impact from the outside, it has been found is that peeling or cracking or chipping, which starting from the corner portion occurs.

  The present invention has been made in view of such a situation, and a plasma display panel that can perform good image display by including a dielectric layer that is less likely to cause defects such as peeling, cracking, and chipping. It aims to be realized.

  In order to achieve the above object, a plasma display panel of the present invention includes a first dielectric layer that covers a display electrode composed of a scan electrode and a sustain electrode, and a second dielectric layer that covers a data electrode. The corner portion of the dielectric layer and / or the second dielectric layer has a rounded shape.

  ADVANTAGE OF THE INVENTION According to this invention, the plasma display panel which can perform a favorable image display is realizable by providing a dielectric material layer with few generation | occurrence | production of defects, such as peeling, a crack, and a chip.

  That is, the invention according to claim 1 of the present invention includes a first dielectric layer that covers a display electrode composed of a scan electrode and a sustain electrode, and a second dielectric layer that covers a data electrode. The plasma display panel is characterized in that a corner portion of the body layer and / or the second dielectric layer has a rounded shape.

  The invention according to claim 2 is the invention according to claim 1, wherein the first dielectric layer and / or the second dielectric layer is formed using a dielectric film transferred from a transfer film as a precursor. It is characterized by being.

  The invention according to claim 3 is the invention according to claim 1, wherein the first dielectric layer and / or the second dielectric layer is formed by using a dielectric material having photosensitivity as a precursor. It is characterized by being.

  Hereinafter, a plasma display panel according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional perspective view showing a schematic configuration of a plasma display panel according to an embodiment of the present invention.

  The front plate 2 of the PDP 1 is formed on a transparent and insulating front substrate 3 such as glass, for example, a display electrode 6 composed of scan electrodes 4 and sustain electrodes 5, and a first dielectric layer 7 covering the display electrodes 6. Furthermore, a protective layer 8 made of MgO film is provided. Here, the scanning electrode 4 and the sustain electrode 5 have, for example, a structure in which bus electrodes 4b and 5b made of a metal material are stacked on the transparent electrodes 4a and 5a in order to ensure translucency and reduce electric resistance. The first dielectric layer 7 is formed by applying a paste-like dielectric material containing a powder of a low-melting glass material by screen printing or a die coating method and drying it, or by forming a sheet-like dielectric film. It forms by the method of baking after transferring and sticking.

  The back plate 9 includes a data electrode 11, a second dielectric layer 12 covering the data electrode 11, a partition wall 13 parallel to the data electrode 11, and a second dielectric material on an insulating back substrate 10 such as glass. The phosphor layers 14R, 14G, and 14B are provided on the surface of the layer 12 and the side surfaces of the partition walls 13. Here, as with the first dielectric layer 7, the second dielectric layer 12 is formed by applying a paste-like dielectric material containing a powder of a low-melting glass material by screen printing or a die coating method and then drying it. Alternatively, it is formed by a method in which a dielectric film in the form of a sheet is transferred and pasted and then fired.

  The front plate 2 and the back plate 9 are disposed to face each other with the discharge space 15 interposed therebetween so that the display electrode 6 and the data electrode 11 are orthogonal to each other, and are sealed with a sealing material formed at the peripheral edge. The discharge space 15 is filled with at least one kind of rare gas among helium, neon, argon, and xenon as a discharge gas, and is partitioned by the partition wall 13, and the intersection between the display electrode 6 and the data electrode 11. The discharge space 15 operates as a discharge cell 16.

  Here, the characteristic point of the plasma display panel according to the embodiment of the present invention described above is that the first dielectric layer 7 and / or the second dielectric layer 12 have a shape with rounded corners. That's what it means. Hereinafter, the first dielectric layer 7 will be described as an example.

  FIG. 2 is a plan view showing a schematic configuration of the front plate 2 of the PDP 1. In FIG. 2, only the front substrate 3 and the first dielectric layer 7 are shown for simplification. Here, the corner portion of the first dielectric layer 7 refers to the four corners indicated by A in the figure when the first dielectric layer 7 has a shape as shown in FIG. In the case where the shape of the layer 7 is a quadrilateral or more polygon, it indicates all corner portions. As an example, a corner portion in the case of a hexagon is shown by A in FIG.

  Since the first dielectric layer 7 has a rounded corner portion A, the front surface of the first dielectric layer 7 as shown in FIG. The stress concentration at the corner portion A caused by the difference in thermal expansion from the substrate 3 can be relaxed and suppressed. As a result, it is possible to suppress the occurrence of defects such as peeling, cracking, and chipping that occur from the corner portion as a starting point with respect to the first dielectric layer 7.

  Here, the roundness of the corner portion A of the first dielectric layer 7 is formed so as to have a roundness when the precursor layer for forming the first dielectric layer 7 is formed on the front substrate 3. Even if the precursor layer is not rounded immediately after it is formed on the front substrate 3, it is rounded by using “sag” at the time of subsequent drying or firing, for example. It does not matter if it is something like that. That is, the corner portion A of the first dielectric layer 7 may be rounded in the final shape at least during the firing and after the firing, where stress concentration occurs, and this is caused by the difference in thermal expansion. The generation of stress can be relaxed and suppressed, and the effects of the present invention can be obtained.

  Next, a method for forming the first dielectric layer 7 will be described.

  As an example of the forming method, as a precursor material of the first dielectric layer 7, a paste-like dielectric material containing a powder of a low melting point glass material, a binder resin and a solvent is used, and this is used for a pattern such as screen printing. There is a method in which a precursor layer of the first dielectric layer 7 is formed by drying after coating on the front substrate 3 by printing, and the first dielectric layer 7 is formed by firing it. . In this case, the printing pattern may be shaped so that the corner is rounded from the beginning. Even if the corner is not rounded immediately after printing, the “sagging” that occurs during drying after printing occurs. The corner portion may be rounded using "". Also, the firing is allowed to stand for several minutes to several tens of minutes above the softening point of the low melting point glass material powder contained in the dielectric material which is the precursor material constituting the precursor layer of the first dielectric layer 7 after drying. To do. By this firing, the precursor layer of the first dielectric layer 7 is changed to the first dielectric layer 7.

  As another example of the forming method, first, as a precursor material, a dielectric material having photosensitivity, that is, a low melting point glass material powder, a binder resin, a photosensitive material, and a paste containing a solvent. A precursor of the first dielectric layer 7 is formed by applying a dielectric material, for example, on the front substrate 3 using a die coating method, and then drying, and then forming a rounded corner by patterning using a photolithography method. Form a layer. And after that, the method of baking can be mentioned.

  As another method, a paste-like dielectric material is applied on a support film, and then a dried transfer film is prepared. The front substrate 3 is prepared by using the dielectric material on the support film of the transfer film as a precursor material. A method of forming the precursor layer of the first dielectric layer 7 by transferring it to the surface and forming the roundness of the corner portion by any method and then firing it can also be mentioned.

  Here, the method of forming the precursor layer by transferring the precursor material from the transfer film to the surface of the front substrate 3 and forming the first dielectric layer 7 is the first dielectric layer on the surface of the front substrate 3. As a method for efficiently forming the precursor layer of the body layer 7, a plurality of units are formed on a large-sized glass plate, so-called multi-chamfering, and the large-sized glass plate is cut and activated. This method is very effective as a method of forming the first dielectric layer 7 in the case of obtaining individual front substrates for the table. In this case, for example, a transfer film in which a dielectric film is formed on a support film is used as the front substrate 3 continuously, and the transfer is performed one after another while cutting the glass plate serving as the front substrate 3. In such a case, the corner portion of the precursor layer of the first dielectric layer 7 formed on the front substrate 3 is inevitably angular, and the corner of the first dielectric layer 7 is inevitably formed. There may be many problems that peeling or chipping occurs from the part. However, in the case of the above-described PDP according to the embodiment of the present invention, the corner portion is rounded, so that occurrence of such a problem can be suppressed.

  In the case of formation by the above-mentioned transfer, as a method of rounding the corner portion, a method of forming a round shape by die-cutting after transfer or a precursor material formed on a support film having photosensitivity And a method of transferring the precursor material to the surface of the front substrate 3 and then forming a rounded shape by patterning using a photolithographic method.

  The transfer film is formed by applying a dielectric material as a precursor material on a support film using a roller coater, a blade coater, a curtain coater, etc., and then drying to remove a part or all of the solvent. It can be manufactured by providing (bonding) a cover film on top. Further, the process of transferring the dielectric material as the precursor material from the transfer film to the front substrate 3 is performed by peeling the cover film from the transfer film and then placing the transfer film so that the dielectric material is in contact with the surface of the front substrate 3. Overlaying, thermocompression bonding from above the transfer film with a heating roller, and then peeling and removing the support film. Such an operation can be performed by a laminator device.

  In addition, as a photolithography process for rounding the corner portion of the precursor layer when a photosensitive material is used as the precursor material, the precursor of the first dielectric layer 7 formed on the front substrate 3 is used. An example is a method in which the body layer is exposed to ultraviolet rays through a mask having a predetermined shape and then developed.

  Further, the firing of the precursor layer of the first dielectric layer 7 is performed for several minutes to several tens of times above the softening point of the low melting point glass material powder included in the dielectric material constituting the precursor layer of the first dielectric layer 7. Do this by leaving it alone. By this operation, the precursor of the first dielectric layer 7 is changed to the first dielectric layer 7.

  Note that the “round shape” at the corner portion A of the first dielectric layer 7 described above is simply one curvature as shown in FIG. 5A, or FIG. As shown in FIG. 5, any shape having no corners, such as a shape in which different curvature portions are continuous, falls within the spirit of the present invention.

  Here, when the corner portion of the first dielectric layer 7 is covered with the sealing material as shown in FIG. 6, the corner portion of the first dielectric layer 7 includes the front glass substrate 3, the sealing material, Stress concentration caused by the three thermal expansion differences of the first dielectric layer 7 acts in a complicated manner, and problems such as peeling and cracking are likely to occur. However, if the present invention is applied to such a configuration, it is possible to suppress peeling and cracking of the first dielectric layer 7.

  In the above description, the first dielectric layer 7 of the front plate 2 is taken as an example, but the same applies to the second dielectric layer 12 covering the data electrode 11 of the rear plate 9.

  As described above, according to the present invention, the dielectric layer is provided with less occurrence of defects such as peeling, cracking, and chipping, thereby realizing a plasma display panel capable of performing good image display. be able to.

1 is a cross-sectional perspective view showing a schematic configuration of a plasma display panel according to an embodiment of the present invention. The top view which shows schematic structure of the front plate of the plasma display panel by one embodiment of this invention The top view which shows schematic structure of the front plate of the plasma display panel by other embodiment of this invention. A plan view showing a schematic configuration of a front plate of a conventional plasma display panel The top view which shows the example of the state of the corner part of the 1st dielectric material layer of the plasma display panel by one embodiment of this invention Similarly, the top view which shows the example of the state of the corner part of the 1st dielectric material layer of the plasma display panel by one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plasma display panel 4 Scan electrode 5 Sustain electrode 6 Display electrode 7 1st dielectric layer 11 Data electrode 12 2nd dielectric layer

Claims (3)

A first dielectric layer covering a display electrode composed of a scan electrode and a sustain electrode; and a second dielectric layer covering a data electrode, wherein the corner portion of the first dielectric layer and / or the second dielectric layer is A plasma display panel having a rounded shape. The plasma display panel according to claim 1, wherein the first dielectric layer and / or the second dielectric layer is formed of a precursor layer made of a precursor material transferred from a transfer film. 2. The plasma display panel according to claim 1, wherein the first dielectric layer and / or the second dielectric layer uses a photosensitive dielectric material as a precursor material thereof.

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