JP2001118512A - Method for forming plasma display panel and partition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma display and a partition which have a partition shape capable of increasing luminance in the case of emitting fluorescence side, and also have a low limitation in forming the partition and increases evacuation efficiency when of evacuation an discharge space of PDP. SOLUTION: A process for preparing a plasma display panel and a partition thereof are provided, in which a plasma display panel and a partition thereof have a partition of two-layer structure, consisting of a partition lower layer portion formed on a substrate surface and a partition upper layer portion formed on the lower layer portion, the lower-layer portion comprises a lower-layer portion of a lengthwise partition of a direction parallel to an address electrode and the entire body of a crosswise partition of a direction parallel to a bus electrode, and the upper-layer portion comprises a upper-layer portion of crosswise partition in a direction parallel to the address electrode.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention belongs to the technical field of a plasma display panel. In particular, the present invention relates to a method for forming a partition formed on a back plate of a plasma display panel.

[0002]

2. Description of the Related Art In a plasma display panel for performing color display (hereinafter, abbreviated as "PDP"), a plurality of partitions are formed on a back plate in parallel lines. A fluorescent screen is provided on the address electrode between the partitions. The phosphor screen between the partition walls is filled with one of phosphor materials that emit light of each of RGB colors,
A structure in which a large number of sets of three stripe-shaped fluorescent screens of each of the GB colors are arranged.

FIG. 7 shows an example of the configuration of an AC type PDP in which a front plate and a back plate are separated from each other. Two glass substrates 801 and 802 are arranged in parallel and opposed to each other. And a glass substrate 80 serving as a back plate.
2 are held at regular intervals by partition walls 803 provided in parallel with each other. Glass substrate 801 serving as front plate
A transparent electrode 804 is formed on the back plate side as a sustaining electrode.
And a metal electrode 805 as a bus electrode are formed in parallel with each other, and the
06 is formed thereon, and a protective layer (MgO
Layer) is formed. On the front plate side of the glass substrate 802 serving as a back plate, address electrodes 808 are formed between the partition walls 803 so as to be orthogonal to the composite electrode and parallel to each other. A fluorescent screen 809 is provided so as to cover the bottom surface. As shown in FIG. 8, a glass substrate 802 serving as a back plate is provided.
After forming a base layer 810 made of a dielectric material, an address electrode 808 is provided, a dielectric layer 806 ′ is further laminated thereon, and then a partition 803 and a fluorescent screen 809 are provided. A rare gas containing mainly neon and containing xenon is sealed between the front plate and the back plate.

The AC type PDP is a surface discharge type, and has a structure in which, after writing is performed by an address electrode, an AC voltage is applied to a composite electrode on the front panel to discharge by an electric field generated in a space. In this case, since the alternating current is applied, the direction of the electric field changes according to the frequency. It should be noted that the DC type PDP is different in that the electrodes have a structure not covered with a dielectric layer, but the discharge phenomenon is the same. Then, the fluorescent screen 809 is caused to emit light by the ultraviolet light generated by the discharge, and the light transmitted through the front plate can be visually recognized by an observer.

[0005]

In such a PDP, it is one of the important problems to increase the brightness when the phosphor screen is illuminated. Various methods have been proposed to increase the luminance, but there is no definitive solution, and the luminance is gradually increased by the accumulation of these methods. Increasing the light emitting area of the phosphor screen generally improves the luminous efficiency due to, for example, efficient operation of ultraviolet light on the phosphor screen, leading to an increase in luminance.
However, as shown in FIGS. 7 and 8, the fluorescent screen 809 is provided so as to cover the wall surface of the partition 803 and the cell bottom, and the fluorescent screen 809 is restricted by the shape of the wall surface of the partition 803 and the cell bottom. That is, the surface of the fluorescent screen 809 is
3 has a simple shape determined by the shape of the wall surface and the bottom surface of the cell, thereby restricting the light emitting area.

Accordingly, there has been proposed an invention relating to a partition wall shape of a plasma display panel capable of increasing luminance when a phosphor screen emits light. For example, JP
0-32148 describes a plasma display panel provided with auxiliary partitions together with partitions. However, the method for forming the partition walls is limited to the description,
Not always good options.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to have a partition shape capable of increasing the luminance when a fluorescent screen is illuminated.
It is an object of the present invention to provide a plasma display panel and a method of forming a partition wall, in which the restrictions on forming the partition wall are small and the exhaust efficiency in exhausting the discharge space of the PDP is improved.

[0008]

The above objects are achieved by the present invention described below. That is, the plasma display panel according to claim 1 of the present invention is a partition having an upper and lower two-layer structure including a lower layer of a partition formed on a surface of a substrate and an upper layer of a partition formed on the lower layer. Wherein the lower layer portion comprises a lower layer portion of a vertical partition parallel to the address electrode and the entirety of a horizontal partition parallel to the bus electrode, and the upper layer portion comprises an upper layer portion of the vertical partition parallel to the address electrode. It is like that. ADVANTAGE OF THE INVENTION According to this invention, since it has a partition shape consisting of a vertical partition and a horizontal partition, it is possible to raise the brightness | luminance at the time of making a fluorescent screen emit light. In addition, since the partition is formed separately in the lower layer portion and the upper layer portion, restrictions on forming the partition are small. Also,
Since the height of the horizontal barrier ribs is made lower than that of the vertical barrier ribs, the exhaust efficiency when exhausting the discharge space of the PDP is improved.

According to a second aspect of the present invention, in the plasma display panel according to the first aspect, a width of a lower layer of the vertical partition is wider than a width of an upper layer of the vertical partition. It was made. According to the present invention, the allowable range for alignment when forming the upper layer portion of the partition on the lower layer portion of the partition is widened, so that the partition can be easily formed and the yield is improved.

According to a third aspect of the present invention, there is provided a method of forming a partition wall, wherein a partition wall material is coated on the entire surface of the substrate to form a first partition wall material layer; A first pattern having a matrix pattern for forming
A first resist mask forming step of forming a resist mask on the surface of the first partition wall material layer, and a first step of performing a sandblasting process on the first partition wall material layer formed on the substrate via the first resist mask. A sand blasting process, a first stripping process of stripping a first resist mask formed on the surface of the first partition wall material layer, and firing of the sand blasted first partition wall material layer to form the entire horizontal partition and vertical partition walls A first baking process of forming a lower layer portion on the substrate, a second coating process of applying a partition material to the entire surface of the substrate to form a second partition material layer, and forming an upper layer portion of the vertical partition. Forming a second resist mask having a stripe pattern on the surface of the first partition wall material layer, and forming the second resist mask on the substrate via the second resist mask. A second sandblasting process of performing a sandblasting process on the second wall material layer, a second separating process of removing a second resist mask formed on a surface of the second wall material layer, and the sandblasting process. And baking the second wall material layer to form an upper layer portion of the vertical partition on a lower layer portion of the vertical partition. ADVANTAGE OF THE INVENTION According to this invention, it has the partition shape which can raise the brightness | luminance at the time of making a fluorescent screen emit light, Moreover, the restriction | limiting in forming the partition is small and the discharge space of PDP is exhausted. Provided is a method for forming a partition of a plasma display panel, which improves the evacuation efficiency.

According to a fourth aspect of the present invention, there is provided a method of forming a partition wall, the first coating step of coating a partition wall material on the entire surface of the substrate to form a first partition wall material layer; A first pattern having a matrix pattern for forming
A first resist mask forming step of forming a resist mask on the surface of the first partition wall material layer, and a sandblasting process by performing a sandblast process on the first partition wall material layer formed on the substrate via the first resist mask. A first sand blasting process for forming the entirety of the completed horizontal partition and a lower layer portion of the vertical partition, a first stripping process for separating the first resist mask formed on the surface of the first partition material layer, A screen printing process of printing a partition material on a lower layer portion of the vertical partition using a screen printing plate having a stripe pattern for forming an upper layer portion to form an upper layer portion of the vertical partition; The entire partition, the lower layer of the vertical partition, and the upper layer of the vertical partition are fired to form the entire fired horizontal partition, the lower layer of the vertical partition, and the upper layer of the vertical partition. A firing step of, in which to have a. ADVANTAGE OF THE INVENTION According to this invention, it has the partition shape which can raise the brightness | luminance at the time of making a fluorescent screen emit light, Moreover, the restriction | limiting in forming the partition is small and the discharge space of PDP is exhausted. Provided is a method for forming a partition of a plasma display panel, which improves the evacuation efficiency.

According to a fifth aspect of the present invention, in the method for forming a partition according to the fourth aspect, the sandblasting is performed after the first peeling step and before the screen printing step. The method includes a firing step of firing the first partition wall material layer and forming the entire fired horizontal partition and the lower layer portion of the vertical partition on the substrate. According to the present invention, since the shapes of the entire horizontal partition and the lower layer of the vertical partition are determined, dimensional accuracy can be obtained, and processing in a subsequent step is facilitated.

According to a sixth aspect of the present invention, there is provided a partition wall forming method, wherein a partition wall material is overprinted using a screen printing plate having a matrix pattern for forming the entire horizontal partition and the lower layer portion of the vertical partition. A first screen printing step of forming the entire horizontal partition and the lower layer of the vertical partition, and using a screen printing plate having a stripe pattern for forming the upper layer of the vertical partition, on the lower layer of the vertical partition. The second screen printing process of printing the partition material over and forming the upper layer portion of the vertical partition, and firing the entire horizontal partition formed on the substrate, the lower layer portion of the vertical partition, and the upper layer portion of the vertical partition, A firing step for forming the entire horizontal partition, the lower layer of the vertical partition, and the upper layer of the vertical partition is provided. ADVANTAGE OF THE INVENTION According to this invention, it has the partition shape which can raise the brightness | luminance at the time of making a fluorescent screen emit light, Moreover, the restriction | limiting in forming the partition is small and the discharge space of PDP is exhausted. Provided is a method for forming a partition of a plasma display panel, which improves the evacuation efficiency.

According to a seventh aspect of the present invention, in the method of forming a partition according to the sixth aspect, the substrate is formed after the first screen printing step and before the second screen printing step. A firing step is provided in which the entire formed horizontal partition and the lower layer portion of the vertical partition are fired, and the entire fired horizontal partition and the lower layer portion of the vertical partition are formed on the substrate. According to the present invention, since the shapes of the entire horizontal partition and the lower layer of the vertical partition are determined, dimensional accuracy can be obtained, and processing in a subsequent step is facilitated.

[0015]

Next, the present invention will be described with reference to embodiments. First, the partition shape of the plasma display panel of the present invention will be described. The method of forming the partition will be described later. FIG. 1 shows a partition shape of the plasma display panel of the present invention. 1A is a perspective view, FIG. 1B is a top view, and FIG.
(C) is a side view. In FIG. 1, 11a, 11
b and 11c are lower layer portions of vertical partition walls, 12a, 12b and 12
c is the upper part of the vertical partition, 21a, 21b, 22a, 22
b is a horizontal partition. Actually, there are a large number of vertical partitions and horizontal partitions formed on the back plate, but only a part is shown in FIG. For example, in the perspective view of FIG. 1A, the lower layer portions 11a, 11b, 1
1c and upper layers 12a, 12b, 12c of three vertical partitions
And only the four horizontal partition walls 21a, 21b, 22a, 22b are shown as representatives.

As shown in FIG. 1, in the plasma display panel according to the present invention, the vertical partitions are formed of lower portions 11a and 11a.
b, 11c and upper layers 12a, 12b, 12c. In addition, lower portions 11a, 11
The width of b, 11c is the upper layer portion 12a, 12b,
It is wider than the width of 12c. Therefore, the allowable range in positioning when forming the upper layer portion of the partition over the lower layer portion of the partition is widened, and the partition can be easily formed, and the yield is improved.

Lower layers 11a, 11b, 11c of the vertical partition
The upper layers 12a, 12b, and 12c of the vertical barrier ribs are barrier ribs formed on the back plate in a direction parallel to the address electrodes. The horizontal partitions 21a, 21b, 22a, 22b are electrodes formed on the back plate in a direction parallel to the bus electrodes. FIG.
As shown in the cross-sectional view of FIG.
a, 11b, 11c and upper layer portions 12a, 12
The cross-sectional shapes of b and 12c are rectangular or trapezoidal with a large base. Although not shown in FIG.
a, 21b, 22a and 22b are also lower layer portions 11 of the vertical partition walls.
a, 11b, 11c and upper layer portions 12a, 12
Similar to b and 12c, the cross-sectional shape is a rectangle or trapezoid having a large base.

Depending on its shape, the horizontal partition walls 21a, 21b,
Of the light rays emitted and emitted from the fluorescent screens 22a and 22b, the proportion of the light rays directed toward the front plate increases, and the apparent brightness improves. Also, the horizontal partition walls 21a, 21b, 22a, 22
b and the back plate can be obtained with a large coupling area, so that not only the horizontal partitions 21a, 21b, 22a and 22b but also the lower layers 11a, 11b and 11c of the vertical partitions and the upper layer 12 of the vertical partitions
The overall strength including a, 12b, and 12c is obtained. As a result, the lower layers 11a, 11b and 11c of the vertical partition and the upper layers 12a, 12b and 12c of the vertical
The width of a, 21b, 22a, 22b can be reduced, the discharge volume in the display cell portion can be increased, and the discharge efficiency can be further improved. Further, since the pixel pitch can be reduced, high definition can be achieved.

FIG. 1A is a perspective view and FIG.
As shown in the cross-sectional view of (C), the horizontal partition walls 21a, 21b,
The height of 22a, 22b is the lower layer portion 11a, 11 of the vertical partition.
It has the same height as b and 11c. For example, the height of the horizontal partitions 21a, 21b, 22a, 22b is determined by the lower layer portions 11a, 11b, 11c of the vertical partition and the upper layer portion 12 of the vertical partition.
1/2 of the total height of the combination of a, 12b and 12c
The height should be 5/6. This horizontal partition 21a, 2
The same operation as described above can be obtained with the heights of 1b, 22a, and 22b. That is, the emission area of the fluorescent screen increases, and the ultraviolet light efficiently acts on the fluorescent screen, thereby increasing the luminance. In addition, the height of the horizontal partition walls 21a, 21b, 22a, 22b is set to be the same as the lower layer portions 11a, 11b, 11c of the vertical partition walls, so that the phosphor screen can be easily formed in the manufacturing process.

The horizontal partitions 21a, 21b, 22a, 2
2b can prevent discharge and ultraviolet rays generated by the discharge from leaking to the display cell portion adjacent in the address electrode direction. That is, the vertical partition walls 1a, 1
b, 1c and the horizontal partitions 21a, 21b, 22a, 22b separate a discharge space specified by the address electrode and the bus electrode from other discharge spaces. Therefore, the image quality of the plasma display panel is improved.

Next, a method (part 1) of forming a partition of a plasma display panel according to the present invention will be described.
FIG. 2 is a diagram illustrating a method for forming a partition of a plasma display panel according to the present invention (first partition forming method: claim 3). In FIG. 2, the figure on the left is a sectional view in the direction parallel to the address electrodes, and the figure on the right is a sectional view in the direction parallel to the bus electrodes. As shown in FIG.
The first partition material layer 102 is formed by applying a partition material on the entire surface (first coating process S11). Next, a first resist mask 103 having a matrix pattern for forming the entire horizontal partition and the lower layer portion of the vertical partition is formed on the surface of the first partition material layer (first resist mask forming step S1).
2).

Next, the first partition wall material layer 102 formed on the substrate 101 is subjected to sandblasting via the first resist mask 103 (first sandblasting process S13). Next, the first resist mask 103 formed on the surface of the first partition wall material layer 102 is stripped (first stripping step S14). Next, the first partition wall material layer 102 that has been subjected to the sand blasting is fired to form the entire horizontal partition 122 and the lower layer portion 111 of the vertical partition on the substrate (first firing step S1).
5).

Next, the partition wall material is applied on the entire surface of the substrate 101 on which the entire horizontal partition walls 122 and the lower layer portions 111 of the vertical partition walls are formed, thereby forming a second partition wall material layer 104.
16). Next, a second resist mask 105 having a stripe pattern for forming an upper layer portion of the vertical partition is formed on the surface of the second partition material layer 104 (second resist mask forming step S17). Next, the second resist mask 10
Then, a sand blasting process is performed on the second wall material layer 105 through the step 5 (second sand blasting process step S18). Next, the second resist mask 105 formed on the surface of the second wall material layer 104 is stripped (second separation step S19). next,
The sandblasted second wall material layer 104 is fired to form the upper layer portion 112 of the vertical partition on the lower layer portion 111 of the vertical partition (second firing step S20).

The first resist mask forming step S12
And the first resist mask forming step S17 are formed on the surface of the partition material layer by printing using a printing paste having a film forming property on the partition material layer (the first partition material layer 102 and the second partition material layer 104). Process. Further, the first resist mask forming step S12 and the first resist mask forming step S17 include a DFR attaching step of attaching a dry film resist (DFR) to the surface of the partition wall material layer, and a dry film attaching through a photomask. The process may include an exposure process of exposing the resist, and a development process of performing development to leave a portion serving as a partition in the dry film resist.

Next, a method (part 2) of forming a partition wall of a plasma display panel according to the present invention will be described.
FIG. 3 is a diagram illustrating a method for forming a partition of a plasma display panel according to the present invention (second partition forming method: claims 4 and 5). In FIG. 3, the diagram on the left is a sectional view in the direction parallel to the address electrodes, and the diagram on the right is a sectional view in the direction parallel to the bus electrodes. As shown in FIG. 3, first, a partition wall material is applied to the entire surface of the substrate 201 to form a first partition wall material layer 202 (first coating step S21). Next, a first resist mask 203 having a matrix pattern for forming the entire horizontal partition and the lower layer of the vertical partition is formed on the surface of the first partition material layer 202 (first resist mask forming step S22).

Next, the first partition wall material layer 202 formed on the substrate 201 is subjected to sandblasting through the first resist mask 203, and the whole of the sandblasted horizontal partition 222 and the lower layer portion 211 of the vertical partition are separated. It is formed (first sandblasting process S23). Next, the first resist mask 2 formed on the surface of the first partition wall material layer 202 is formed.
03 is stripped (first stripping step S24).

Next, using a screen printing plate 204 having a stripe pattern for forming an upper layer portion of the vertical partition, a partition material is printed on the lower layer portion 211 of the vertical partition to form an upper layer portion 212 of the vertical partition. (Screen printing process S25). Next, the entire horizontal partition 222 formed on the substrate 201, the lower layer portion 211 of the vertical partition, and the upper layer portion 212 of the vertical partition are fired, and the fired entire horizontal partition 222, the lower layer portion 211 of the vertical partition, and the vertical partition are formed. The upper layer part 212 is formed (firing step S25).

In the above description, the first peeling step S24
After and before the screen printing step S25, the first partition wall material layer subjected to the sand blasting process is baked, and the entire baked horizontal partition wall 222 and the lower layer portion 211 of the vertical partition wall are baked.
Can be provided on the substrate 201. By doing so, the shapes of the entire horizontal partition and the lower layer portion of the vertical partition are determined, so that dimensional accuracy can be obtained, and processing in a subsequent step becomes easy.

Also, a first resist mask forming step S22
Is printed on the first partition material layer 202 by using a printing paste having a film forming property.
Process on the surface of the substrate. Also, the first
The resist mask forming step S22 is performed in the first partition material layer 20.
2 on the surface of dry film resist (DFR; dry film
resist), an exposure process of exposing the dry film resist through a photomask, and a development process of developing and leaving a portion of the dry film resist to be a partition.

Next, a method (part 3) of forming a partition of a plasma display panel according to the present invention will be described.
FIG. 4 is an explanatory view illustrating a method for forming a partition of a plasma display panel according to the present invention (third partition forming method: claims 6 and 7). In FIG. 4, the diagram on the left is a sectional view in a direction parallel to the address electrodes, and the diagram on the right is a sectional view in a direction parallel to the bus electrodes. As shown in FIG. 4, first, a screen printing plate 30 having a matrix pattern for forming the entire horizontal partition and the lower layer portion of the vertical partition.
2 is used to overprint the partition wall material to form the entire horizontal partition 322 and the lower layer portion 311 of the vertical partition on the substrate 301 (first screen printing step S31).

Next, using a screen printing plate 303 having a stripe pattern for forming an upper layer portion of the vertical partition, a partition material is printed on the lower layer portion 311 of the vertical partition to form an upper layer portion 312 of the vertical partition. (Second screen printing step S33). Next, the entire horizontal partition 322 formed on the substrate, the lower layer 311 of the vertical partition, and the upper layer 3 of the vertical partition 3
12 is fired to form the entire fired horizontal partition, the lower layer of the vertical partition, and the upper layer of the vertical partition (firing step S3).
4).

In the above description, after the first screen printing step S31 and before the second screen printing step S33, the entire horizontal partition 322 formed on the substrate 301 is formed.
And the lower part 311 of the vertical partition are fired, and the entire fired horizontal partition 322 and the lower part 311 of the vertical partition are bonded to the substrate 30.
1 can be provided. By doing so, the shapes of the entire horizontal partition and the lower layer portion of the vertical partition are determined, so that dimensional accuracy can be obtained, and processing in a subsequent step becomes easy.

Next, a method (part 4) of forming a partition wall of a plasma display panel according to the present invention will be described.
FIG. 5 is an explanatory view illustrating a method for forming a partition of a plasma display panel (fourth partition forming method) according to the present invention. In FIG. 5, the drawing on the left is a sectional view in a direction parallel to the address electrodes, and the drawing on the right is a sectional view in a direction parallel to the bus electrodes. As shown in FIG. 5, first, a dry film resist (DFR; dry film resist)
(t) Attach 402 (first DFR attaching step S4)
1).

Next, the dry film resist 402 is exposed through a photomask having a matrix pattern for forming the entire horizontal partition and the lower layer of the vertical partition via a photomask (first exposure step S42). . Next, development is performed to remove a portion 403 serving as a partition in the dry film resist 402 (first development step S4).
3). Next, the developed dry film resist 4
Part (space) 4 to be a partition removed by development of No. 02
03 is filled with a partition material (paste) 404 (first filling step S44).

Next, a dry film resist 405 is attached to the surface of the dry film resist 402 filled with the partition material 404 (second DFR attaching step S45). Next, the dry film resist 405 is exposed through a photomask having a stripe pattern for forming an upper layer portion of the vertical partition via a photomask (second exposure step S46). Next, development is performed, and a portion serving as a partition in the dry film resist 405 (the upper layer portion of the vertical partition)
Is removed (second developing step S47).

Next, a partition wall material (paste) 406 is filled in a portion (space) serving as a partition wall removed by the development of the developed dry film resist 405 (second filling step S48). Next, dry film resist 402
Then, the dry film resist 405 is peeled off and further baked to form the entire baked horizontal partition, the lower layer portion of the vertical partition, and the upper layer portion of the vertical partition on the substrate 401 (firing step S49).

Next, a method (part 5) of forming a partition of a plasma display panel according to the present invention will be described.
FIG. 6 is an explanatory diagram illustrating a method for forming a partition of a plasma display panel (fifth partition forming method) according to the present invention. In FIG. 6, the diagram on the left is a sectional view in the direction parallel to the address electrodes, and the diagram on the right is a sectional view in the direction parallel to the bus electrodes. As shown in FIG. 6, first, a partition wall material is applied to the entire surface of a substrate 501 to form a first partition wall material layer 502 (first partition wall layer 502).
Coating process S51). Next, a first resist mask 503 having a matrix pattern for forming the entire horizontal partition and the lower layer of the vertical partition is formed on the surface of the first partition material layer 502 (first resist mask forming step S52).

Next, the first partition wall material layer 502 formed on the substrate 501 is subjected to sandblasting through the first resist mask 503, and the whole of the sandblasted horizontal partition 522 and the lower layer portion 511 of the vertical partition are separated. It is formed (first sandblasting process S53). Next, the first resist mask 5 formed on the surface of the first partition wall material layer 502 is formed.
03 is peeled (first peeling step S54). Next, this is fired to form the entire fired horizontal partition 522 and the lower layer portion 511 of the vertical partition on the substrate 501 (first firing step S).
55).

Next, a dry film resist 505 is attached to the entire surface 522 of the fired horizontal partition formed on the substrate 501 and the lower layer portion 511 of the vertical partition (DFR attaching step S56). Next, the dry film resist 405 is exposed and developed through a photomask having a stripe pattern for forming an upper layer portion of the vertical partition via a photomask, and is developed to form a portion (vertical partition) of the dry film resist 505 serving as a partition. Is removed (exposure and development step S57).

Next, a partition wall material (paste) 506 is filled into a portion (space) serving as a partition wall removed by developing the developed dry film resist 505 (filling step S58). Next, the dry film resist 505 is peeled off and baked to form the entire baked horizontal partition 522, the lower layer portion 511 of the vertical partition, and the upper layer portion 512 of the vertical partition on the substrate 501 (peeling firing process S59). .

[0041]

As described above, according to the plasma display panel according to the first aspect of the present invention, it is possible to increase the luminance when the fluorescent screen is illuminated, and it is possible to form the partition walls. The restriction is small, and the exhaust efficiency when exhausting the discharge space of the PDP is improved. Further, according to the plasma display panel of the second aspect of the present invention, the formation of the partition walls is easy and the yield is improved.

According to the partition forming method of the third aspect of the present invention, the partition has a partition shape capable of increasing the luminance when the fluorescent screen is illuminated. Provided is a method for forming a partition wall of a plasma display panel, which has less restrictions and improves exhaust efficiency when exhausting a discharge space of a PDP.

According to the partition forming method of the fourth aspect of the present invention, the partition has a partition shape capable of increasing the luminance when the fluorescent screen is illuminated, and furthermore, the partition has a small size. Provided is a method for forming a partition wall of a plasma display panel, which has less restrictions and improves exhaust efficiency when exhausting a discharge space of a PDP. Further, according to the partition forming method according to the fifth aspect of the present invention, the shapes of the entire horizontal partition and the lower layer of the vertical partition are determined, dimensional accuracy can be obtained, and processing in a subsequent step is easy.

Further, according to the method of forming a partition according to the sixth aspect of the present invention, the partition has a partition shape capable of increasing the luminance when the fluorescent screen is illuminated, and furthermore, the partition has a small size. Provided is a method for forming a partition wall of a plasma display panel, which has less restrictions and improves exhaust efficiency when exhausting a discharge space of a PDP. Further, according to the partition forming method according to claim 7 of the present invention, the shapes of the entire horizontal partition and the lower layer of the vertical partition are determined, dimensional accuracy can be obtained, and processing in a subsequent step is easy.

[Brief description of the drawings]

FIG. 1 is a diagram showing a partition shape of a plasma display panel of the present invention.

FIG. 2 is a diagram illustrating a method for forming a partition of a plasma display panel (first partition forming method: claim 3) according to the present invention.

FIG. 3 is a diagram illustrating a method of forming a partition of a plasma display panel (second partition forming method: claims 4 and 5) according to the present invention.

FIG. 4 is a diagram illustrating a method for forming a partition of a plasma display panel (third partition forming method: claims 6 and 7) according to the present invention.

FIG. 5 is a diagram illustrating a method for forming a partition of a plasma display panel (fourth partition forming method) according to the present invention.

FIG. 6 is a diagram illustrating a method of forming a partition of a plasma display panel (fifth partition forming method) according to the present invention.

FIG. 7 is an explanatory view (1) of an AC type plasma display panel.

FIG. 8 is an explanatory view (2) of the AC type plasma display panel.

[Explanation of symbols]

11a, 11b, 11c Lower part of vertical partition 12a, 12b, 11c Upper part of vertical partition 21a, 21b, 22a, 22b Horizontal partition 101, 201, 301, 401, 501 Substrate 102, 202, 502 First partition material layer 103 , 203, 503 First resist masks 122, 222, 322, 522 Overall horizontal partitions 111, 211, 311, 511 Lower layer portions of vertical partitions 104 Second partition material layer 105 Second resist masks 112, 212, 312, 512 Vertical Upper layer portions of partition walls 204, 303 Screen printing plate (stripe pattern) 302 Screen printing plate (matrix pattern) 402, 405, 505 Dry film resist 403 Partition portions 404, 406 Partition material 801 Front plate 802 Back plate 803 Cell barrier 804 Maintenance Pole 805 bus electrodes 806 and 806 'dielectric layer 807 MgO layer 808 address electrodes 809 fluorescent screen 810 underlying layer

 ──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Norio Ota 1-1-1 Ichigaya-Kaga-cho, Shinjuku-ku, Tokyo F-term in Dai Nippon Printing Co., Ltd. (reference) 5C027 AA09 5C040 GF03 GF04 GF13 GF14 GF19 JA12 JA15 JA17 JA21 LA12 MA03 MA22 MA26

Claims (7)

[Claims] 1. A partition having an upper and lower two-layer structure comprising a lower layer of a partition formed on a surface of a substrate and an upper layer of a partition formed on the lower layer, wherein the lower layer has an address electrode. A lower portion of a vertical partition in a direction parallel to the horizontal direction and the entirety of a horizontal partition in a direction parallel to a bus electrode; and the upper layer portion includes an upper portion of a vertical partition in a direction parallel to the address electrode. . 2. The plasma display panel according to claim 1, wherein the width of the lower layer of the vertical partition is wider than the width of the upper layer of the vertical partition. 3. A first coating step of forming a first partition wall material layer by coating a partition wall material on the entire surface of the substrate, and a first coating step having a matrix pattern for forming the entire horizontal partition wall and the lower layer portion of the vertical partition wall. A first resist mask forming step of forming a first resist mask on the surface of the first partition material layer, and a step of performing a sandblasting process on the first partition material layer formed on the substrate via the first resist mask. 1 sand blasting process, a first stripping process of stripping a first resist mask formed on the surface of the first partition wall material layer, baking the sand blasted first partition wall material layer, and vertically and horizontally forming the horizontal partition walls. A first baking process of forming a lower layer portion of the partition on the substrate; a second coating process of forming a second partition material layer by applying a partition material on the entire surface of the substrate; forming an upper layer portion of the vertical partition; Was Forming a second resist mask having a stripe pattern on the surface of the first partition wall material layer; and forming the second resist mask on the substrate via the second resist mask with respect to the second wall material layer. Second to perform sandblasting
A sand blasting process, a second separating process of peeling off a second resist mask formed on a surface of the second wall material layer, and firing the sand blasted second wall material layer to form an upper layer portion of the vertical partition wall. And b. Forming a second baking process on a lower layer portion of the vertical barrier ribs. 4. A first coating step of forming a first partition wall material layer by coating a partition wall material on the entire surface of the substrate, and a first coating step having a matrix pattern for forming the entire horizontal partition wall and the lower layer portion of the vertical partition wall. A first resist mask forming step of forming a first resist mask on the surface of the first partition wall material layer; and a sand blasting process on the first partition wall material layer formed on the substrate via the first resist mask. A first sandblasting process for forming the entire processed horizontal partition and a lower layer portion of the vertical partition, a first stripping process for stripping a first resist mask formed on a surface of the first partition material layer, Using a screen printing plate having a stripe pattern for forming an upper layer portion, printing a partition material on the lower layer portion of the vertical partition to form an upper layer portion of the vertical partition. The clean printing process, the entire horizontal partition formed on the substrate, the lower layer of the vertical partition and the upper layer of the vertical partition are fired, and the entire fired horizontal partition and the lower layer of the vertical partition and the upper layer of the vertical partition are fired. A method for forming a partition of a plasma display panel, comprising: 5. The method for forming a partition wall according to claim 4, wherein after the first peeling step and before the screen printing step, the sandblasted first partition wall material layer is fired, and A method of forming a partition of a plasma display panel, comprising a firing step of forming the whole of the horizontal partition and the lower layer of the vertical partition on the substrate. 6. A partition material is overprinted using a screen printing plate having a matrix pattern for forming the entire horizontal partition and the lower layer of the vertical partition, and the entire horizontal partition and the lower layer of the vertical partition are formed on the substrate. A first screen printing step of forming a partition wall material on a lower layer portion of the vertical partition using a screen printing plate having a stripe pattern for forming an upper layer portion of the vertical partition. A second screen printing process to be formed; firing the entire horizontal partition formed on the substrate, the lower layer portion of the vertical partition, and the upper layer portion of the vertical partition, and firing the entire horizontal partition, the lower layer portion of the vertical partition, and the vertical A baking process for forming an upper layer portion of the partition wall; and a method of forming a partition wall of a plasma display panel. 7. The partition wall forming method according to claim 6, wherein after the first screen printing step and before the second screen printing step, the entire horizontal partition wall formed on the substrate and the lower layer portion of the vertical partition wall. And baking the whole of the fired horizontal barrier ribs and the lower layer portion of the vertical barrier ribs on the substrate.