JP2007149376A - Plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel with high luminous efficiency. <P>SOLUTION: An X electrode 6 and a Y electrode 7 are alternately installed on the upper face of a glass substrate 5 in the rear substrate 2 of a PDP. Then, a bridge part which mutually connects the X electrode 6 and the Y electrode 7 is installed, and a parallel cross-like barrier rib is formed by the X electrode 6, the Y electrode 7, and bridge part. A white dielectric layer 11 is formed on the inner face of this barrier rib, and a phosphor layer 12 is formed on the upper face of the glass substrate 5 and on the side face of the bridge part on the dielectric layer 11. The phosphor layer 12 is not formed on the side face of the X electrode 6 and the Y electrode 7. Thereby, a discharge passage having no phosphor layer interposed is formed between the X electrode 6 and the Y electrode 7. On the other hand, an address electrode is installed on the lower face of the glass substrate 15 in the front substrate 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a plasma display panel, and more particularly to a counter electrode type AC (alternating current) type plasma display panel in which sustain electrodes are opposed to each other.

  In a plasma display panel (hereinafter also referred to as PDP), a front substrate arranged on the display surface side (viewer side) and a rear substrate arranged to face the front substrate are provided. A discharge gas such as a rare gas is sealed between the two substrates. In the front substrate, for example, an X electrode and a Y electrode extending in the horizontal direction of the screen are provided on a transparent substrate such as a glass substrate. The X electrode and the Y electrode are also collectively referred to as “sustain electrode”. On the other hand, in the rear substrate, an address electrode extending in the vertical direction of the screen, for example, is extended on an insulating substrate such as a glass substrate, and a white dielectric layer is formed so as to cover the address electrode. Moreover, a grid-like or striped barrier rib is formed on the white dielectric layer, and discharge cells are partitioned by the barrier rib. Furthermore, a phosphor layer is applied to the side surfaces of the barrier ribs and the surface of the white dielectric layer. When a discharge is generated between the X electrode and the Y electrode, the phosphor layer is irradiated with ultraviolet rays generated by the discharge, and the phosphor layer emits visible light.

Conventionally, the sustain electrode is formed in a planar shape on a transparent substrate, and a transparent dielectric layer is formed so as to cover the sustain electrode. On the other hand, recently, in order to improve the light emission efficiency, a counter electrode type PDP in which sustain electrodes are arranged to face each other has been proposed (for example, see Patent Document 1).
FIG. 14 is a partial cross-sectional view showing a counter electrode type PDP described in Patent Document 1. As shown in FIG.
In this conventional PDP 101, a front substrate 102 and a rear substrate 103 are arranged so as to face each other, and a discharge gas is sealed in a space between them.

  The front substrate 102 is provided with a glass substrate 105, and X electrodes 106 and Y electrodes 107 are alternately provided in parallel with each other on the surface of the glass substrate 105 facing the rear substrate 103. ing. In the X electrode 106, a bus electrode 106a made of a conductor is provided so as to be in contact with the glass substrate 105, and a dielectric layer 106b is provided so as to cover a surface of the bus electrode 106a that is not in contact with the glass substrate 105. It has been. Similarly, the Y electrode 107 is provided with a bus electrode 107a made of a conductor and a dielectric layer 107b covering the bus electrode 107a.

  In addition, a bridge portion (not shown) is provided between the X electrode 106 and the Y electrode 107 so as to connect the two electrodes to each other. A partition wall is formed. A plurality of discharge cells 110 are partitioned by the barrier ribs. A protective film 108 made of magnesium oxide (MgO) is provided so as to cover the glass substrate 105 and the partition walls. In each discharge cell 110, no components other than the protective film 108 are disposed between the X electrode 106 and the Y electrode 107, so that a discharge path via the discharge gas is formed in the discharge cell 110. It has become.

  On the other hand, the rear substrate 103 is provided with a glass substrate 111, and address electrodes 112 are provided on the surface of the glass substrate 111 on the side facing the front substrate 102. The address electrode 112 extends in a direction orthogonal to the direction in which the X electrode 106 and the Y electrode 107 extend. A white dielectric layer 113 is provided on the glass substrate 111 so as to cover the address electrodes 112. A grid-like partition wall 114 is provided on the white dielectric layer 113. The partition 114 is disposed at a position corresponding to the partition formed on the front substrate 102. Further, a phosphor layer 115 is applied to the side surfaces of the barrier ribs 114 and the surface of the white dielectric layer 113.

  In the conventional PDP 101 configured as described above, a voltage is applied between the bus electrode 106 a of the X electrode 106 and the bus electrode 107 a of the Y electrode 107, whereby the X electrode 106 and the Y electrode 107 are interposed. Discharge occurs through the discharge gas. Ultraviolet rays are generated by this discharge, and when the ultraviolet rays are irradiated onto the phosphor layer 115, the phosphor layer 115 emits visible light. This visible light passes through the glass substrate 105 of the front substrate 102 and is emitted from the display surface of the PDP 101. An image can be displayed on the entire PDP 101 by controlling the number of discharges in each discharge cell 110 within one field for displaying one screen.

JP2003-151449A (FIGS. 6 and 7)

  However, the conventional PDP 101 shown in FIG. 14 has the following problems. That is, even in this PDP 101, the light emission efficiency is still insufficient.

  The present invention has been made based on the recognition of such a problem, and an object thereof is to provide a plasma display panel having high luminous efficiency.

  A plasma display panel according to the present invention includes a rear substrate, a front substrate disposed to face the rear substrate, and a discharge gas sealed between the rear substrate and the front substrate, The substrate includes an insulating substrate, a plurality of X electrodes and Y electrodes that are alternately arranged on the surface of the insulating substrate that faces the front substrate and that are alternately disposed and extend in the first direction, and the X electrode and the Y electrode. A bridge portion that forms a grid-like partition wall that connects electrodes and partitions discharge cells together with the X electrode and the Y electrode, and is formed on the surface of the insulating substrate and on the side surface of the bridge portion, and receives ultraviolet rays. A phosphor layer that emits visible light when the front substrate is formed on a transparent substrate and a surface of the transparent substrate that faces the back substrate, and intersects the first direction. 2 Has address electrodes extending direction, and between the X electrode and the Y electrode, the phosphor layer, characterized in that the discharge pathway without intervention is formed.

  In the present invention, the X electrode and the Y electrode face each other, and a discharge is generated between the two electrodes, so that the discharge start voltage is low and the light emission efficiency is high. Since both the X electrode and the Y electrode and the phosphor layer are provided on the back substrate, the distance between the discharge path generated between the X electrode and the Y electrode and the phosphor layer is short. . Therefore, the distance between the generation position of the ultraviolet rays generated by this discharge and the phosphor layer is short. For this reason, the efficiency which converts an ultraviolet-ray into visible light is high. In addition, since a discharge path in which no phosphor layer is interposed is formed between the X electrode and the Y electrode, the phosphor layer is not deteriorated by discharge.

  According to the present invention, a plasma display panel with high luminous efficiency can be obtained.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
First, a first embodiment of the present invention will be described.
FIG. 1 is a partial plan view showing the PDP according to the present embodiment, FIG. 2 is a partial cross-sectional view taken along line AA ′ shown in FIG. 1, and FIG. 3 is BB ′ shown in FIG. It is a fragmentary sectional view by a line. In order to simplify the drawing, only the rear substrate and the address electrodes are shown in FIG. The plasma display panel according to the present embodiment is an AC type PDP.

  As shown in FIGS. 1 to 3, in the PDP 1 according to the present embodiment, the back substrate 2 and the front substrate 3 are disposed so as to face each other and in parallel to each other, and a discharge gas is disposed in the space therebetween. Is enclosed. The discharge gas is, for example, a rare gas, for example, a Ne—Xe mixed gas containing 7 to 15% by volume of xenon (Xe) and the balance being neon (Ne).

  In the rear substrate 2, a glass substrate 5 is provided as an insulating substrate. On the surface of the glass substrate 5 facing the front substrate 3 (hereinafter referred to as the upper surface of the glass substrate 5), the X electrode 6 and Y electrodes 7 are provided alternately and in parallel with each other. The X electrode 6 and the Y electrode 7 are also collectively referred to as “sustain electrodes”. Further, the X electrode 6 and the Y electrode 7 face each other. The direction in which the sustain electrodes extend is, for example, the horizontal direction of the screen.

  The X electrode 6 is provided with a bus electrode 6a made of a conductor and extending in the horizontal direction of the screen, for example, and a dielectric layer 6b is provided so as to cover the periphery of the bus electrode 6a. Similarly, the Y electrode 7 is provided with a bus electrode 7a made of a conductor and a dielectric layer 7b covering the bus electrode 7a. Therefore, the bus electrodes 6a and 7a are not in contact with the glass substrate 5, and a part of the dielectric layer 6b and a part of the dielectric layer 7b are provided between the glass substrate 5 and the bus electrodes 6a and 7a. Are arranged respectively. The bus electrodes 6a and 7a are formed, for example, by sintering a silver paste, and are formed of a material containing silver (Ag) and an inorganic binder. The dielectric layers 6b and 7b are made of low melting point glass such as lead glass, for example.

  Between the X electrode 6 and the Y electrode 7, there is provided a bridge portion 8 that extends in a direction orthogonal to the direction in which both electrodes extend, for example, in the vertical direction of the screen and connects the two electrodes to each other. The section 8, the X electrode 6 and the Y electrode 7 form a grid-like (lattice-like) partition 4. The bridge portion 8 is made of, for example, the same material as the dielectric layers 6b and 7b, and is made of, for example, low melting point glass such as lead glass. With the partition walls 4, the space between the back substrate 2 and the front substrate 3 is partitioned into a plurality of discharge cells 10.

  A white dielectric layer 11 is provided on the upper surface of the glass substrate 5 and the side surfaces of the partition walls 4. That is, the white dielectric layer 11 is formed on the five inner surfaces of the discharge cell 10 on the back substrate 2 side. A phosphor layer 12 is provided on portions corresponding to the upper surface of the glass substrate 5 and the side surface of the bridge portion 8 on the white dielectric layer 11. That is, the phosphor layer 12 includes a bottom portion 12 a formed on the upper surface of the glass substrate 5 and a side portion 12 b formed on the side surface of the bridge portion 8. As described above, the phosphor layer 12 is formed on the three inner surfaces of the discharge cell 10 and is not formed on the side surfaces of the X electrode 6 and the Y electrode 7.

  The phosphor layer 12 emits visible light, for example, red (R), green (G), or blue (B) light when ultraviolet rays are incident. The plurality of discharge cells 10 arranged in the direction orthogonal to the direction in which the sustain electrodes extend are formed with the same color phosphor layer 12, and the plurality of discharge cells 10 arranged in the direction in which the sustain electrodes extend are arranged in the plurality of discharge cells 10. The red, green and blue phosphor layers 12 are repeatedly arranged. Thereby, the discharge cells 10 of the respective colors are arranged in a stripe shape. The white dielectric layer 11 functions as a reflective layer that reflects the light emitted from the phosphor layer 12 toward the front substrate 3.

  As described above, the phosphor layer 12 is formed on the upper surface of the glass substrate 5 and the side surface of the bridge portion 8, and is not formed on the side surface of the X electrode 6 and the side surface of the Y electrode 7. Further, the thickness of the portion disposed between the glass substrate 5 and the bus electrode 6a in the dielectric layer 6b and the thickness of the portion disposed between the glass substrate 5 and the bus electrode 7a in the dielectric layer 7b. Is thicker than the thickness of the portion of the phosphor layer 12 formed on the glass substrate 5. For this reason, the upper surface of the part formed on the glass substrate 5 in the phosphor layer 12 is positioned lower than the lower surfaces of the bus electrodes 6a and 7a. Therefore, the phosphor layer 12 has a part of a region on the side surface of the X electrode 6 that is higher than the lower surface of the bus electrode 6a and a region on the side surface of the Y electrode 7 that is higher than the lower surface of the bus electrode 7a. Some are not formed. Thus, when a predetermined voltage is applied between the bus electrode 6a and the bus electrode 7a, a discharge path in which the phosphor layer 12 is not interposed is formed between the X electrode 6 and the Y electrode 7. It has become.

  A protective film (not shown) made of magnesium oxide (MgO) is provided so as to cover the partition walls 4, the white dielectric layer 11, and the phosphor layer 12. The protective film prevents the white dielectric layer 11 and the like from being sputtered by discharge and supplies secondary electrons into the discharge cell 10.

On the other hand, in the front substrate 3, a glass substrate 15 is provided as a transparent substrate, and address electrodes 16 are provided on the surface of the glass substrate 15 on the side facing the back substrate 2. The address electrode 16 extends in a direction orthogonal to the direction in which the X electrode 6 and the Y electrode 7 extend, for example, in the vertical direction of the screen. When viewed from a direction perpendicular to the surface of the glass substrate 15 (hereinafter referred to as a plan view), the address electrode 16 is disposed at a position overlapping the bridge portion 8, and the center line of the address electrode 16 is the bridge portion 8. Coincides with the centerline. The address electrode 16 is formed, for example, by sintering a silver paste, and is formed of a material containing silver (Ag) and an inorganic binder. The width of the address electrode 16 is, for example, 50 μm, and the width of the bridge portion 8 is, for example, 70 μm. The color of the address electrode 16 is, for example, black.
The center line of the address electrode 16 and the center line 8 of the bridge portion 8 may be shifted from each other. If the address line 16 is arranged close to one of the left and right discharge cells, the discharge can be started more reliably in the adjacent discharge cells, and the occurrence of crosstalk in the distant discharge cells can be suppressed.

A transparent dielectric layer 17 is provided on the entire surface of the glass substrate 15 so as to cover the address electrodes 16. By design, a process margin of, for example, about 10 μm is provided between the transparent dielectric layer 17 and the partition 4, so that a gap of about 10 μm is formed between the transparent dielectric layer 17 and the partition 4. Has been. However, part of the partition 4 may be in contact with the transparent dielectric layer 17 due to variations in the height of the partition 4. A gap formed between the barrier rib 4 and the transparent dielectric layer 17 serves as a gas flow path for filling each discharge cell with a discharge gas when the PDP is manufactured.
In this specification, “X electrode” and “Y electrode” are not only the conductive bus electrodes 6a and 7a constituting the respective electrodes, but also the dielectric layer 6b provided to cover these bus electrodes, 7b is also included.

Next, a method for manufacturing the PDP 1 according to the present embodiment will be described.
First, a method for manufacturing the back substrate 2 will be described.
4A to 4C, FIGS. 5A to 5C, and FIGS. 6A to 6C are cross-sectional views showing a method of manufacturing the back substrate of the PDP according to this embodiment in the order of the steps. It is.

First, as shown in FIG. 4A, a glass substrate 5 is prepared. Then, for example, using a coating apparatus, after applying the dielectric paste on the upper surface of the glass substrate 5, the dielectric paste is dried by heating to a temperature at which the solvent in the dielectric paste evaporates, A partition wall material layer 4a is formed. For the dielectric paste, for example, a paste material containing a solvent and low-melting glass is used.
Next, as shown in FIG. 4B, a dry film resist (DFR) 9 is stuck on the partition wall material layer 4a using a laminator. Then, the DFR 9 is exposed and developed to form an opening 9a in a region where the bus electrodes 6a and 7a (see FIG. 2) are to be formed.
Next, as shown in FIG. 4C, sandblasting is performed using the DFR 9 as a mask, and the upper portion of the partition wall material layer 4a located immediately below the opening 9a is selectively removed to form the partition wall material layer 4a. A groove 4b extending in one direction is formed on the upper surface of the substrate. At this time, about 20 to 40 μm of the partition wall material layer 4a is left at the bottom of the groove 4b. Thereafter, the DFR 9 is peeled off using a DFR stripping solution, and the partition wall material layer 4a is washed with pure water and dried.

Next, as shown in FIG. 5A, the groove 4b is filled with a conductive paste such as a silver paste by a screen printing method or a dispenser method. Then, the conductive paste is dried by heating to a temperature at which the solvent in the conductive paste evaporates. Thereby, the conductive material body 13 is formed. The conductive material body 13 is fired in a later step to become a sustain electrode.
Next, as shown in FIG. 5B, after applying the dielectric paste on the entire surface by a coating method or the like, the dielectric paste is dried by heating to a temperature at which the solvent in the dielectric paste evaporates. The partition wall material layer 4c is formed. At this time, the same paste as the dielectric paste used in the step shown in FIG. 4A may be used as the dielectric paste, or a different paste may be used. Hereinafter, the partition wall material layers 4a and 4c are collectively referred to as a partition wall material layer 4d.
Next, as shown in FIG.5 (c), DFR14 is affixed on the partition material layer 4d using a laminator. Then, exposure and development are performed on the DFR 14, leaving an area where the partition 4 (see FIG. 1) is to be formed, and removing the other area to form the opening 14a.

Next, as shown in FIG. 6A, sand blasting is performed using the DFR 14 (see FIG. 5C) as a mask to remove a portion corresponding to the opening 14a in the partition wall material layer 14d. Thereby, the partition material layer 14d is processed into a partition shape. Then, the DFR 14 is peeled off using the DFR cleaning solution, and the processed partition wall material layer 4d is cleaned with pure water and dried.
Next, as shown in FIG. 6B, a white dielectric paste is filled in the space surrounded by the processed partition wall material layer 4d by a screen printing method or a dispenser method. Then, the white dielectric paste is dried by heating to a temperature at which the solvent contained in the paste evaporates. At this time, the layer thickness after drying can be reduced by increasing the solvent content in the white dielectric paste. The glass substrate 5 and the components formed thereon are heated to a temperature at which the partition wall material layer 4d, the conductive material body 13 and the white dielectric paste are sintered and the glass substrate 5 is not softened, for example, 520 to 600 ° C. It heats to the temperature of and fires. As a result, the partition wall material layer 4d is sintered to form the partition wall 4, the conductive material body 13 is sintered to the bus electrodes 6a and 7a, and the white dielectric paste is sintered to the white dielectric layer 11. At this time, the part including the bus electrodes 6a and 7a in the partition wall 4 becomes the X electrode 6 and the Y electrode 7, respectively, and the part connecting the X electrode 6 and the Y electrode 7 to each other is the bridge part 8 (see FIG. 1). Become.

  Next, as shown in FIG. 6C, a paste-like photosensitive phosphor (photophosphor) 12c is deposited in the space surrounded by the partition walls 4 by a screen printing method or the like and dried. Next, a mask 51 (see FIG. 12A) is disposed on the photosensitive phosphor 12c. This mask covers portions of the photosensitive phosphor 12c located on the side surfaces of the X electrode 6 and the Y electrode 7, and exposes portions located on the upper surface of the glass substrate 5 and the side surfaces of the bridge portion 8. Are patterned. Then, using this mask, the photosensitive phosphor 12c is exposed and developed. At this time, the exposed portion of the photosensitive phosphor 12c is cured and remains after development, and the unexposed portion is removed by development. Thereby, the back substrate 2 shown in FIG. 2 is produced.

Next, a method for manufacturing the front substrate 3 will be described.
As shown in FIG. 3, first, a glass substrate 15 is prepared. Then, a photosensitive silver paste is printed on the entire surface of the glass substrate 15 by a screen printing method or the like. Then, the photosensitive silver paste is exposed and developed for patterning, leaving only the portion of the photosensitive silver paste where the address electrode 16 is to be formed, and removing the remaining portion. Next, the glass substrate 15 and the photosensitive silver paste are baked by heating to a temperature at which the photosensitive silver paste is sintered and the glass substrate 15 is not softened, for example, a temperature of 520 to 600 ° C. Thereby, the photosensitive silver paste is sintered and the address electrode 16 is formed.

  Next, a transparent dielectric is applied to the entire surface of the glass substrate 15 by a coating method or a screen printing method so as to cover the address electrodes 16. Then, the glass substrate 15, the address electrode 16, and the transparent dielectric are heated to a temperature at which the transparent dielectric sinters and the glass substrate 15 does not soften and is fired. As a result, the transparent dielectric is sintered and the transparent dielectric layer 17 is formed. In this way, the front substrate 3 is manufactured.

  Next, a sealing frit is formed on the surface of the back substrate 2 or the front substrate 3 so as to surround the region where the partition walls 4 are formed. Then, the back substrate 2 and the front substrate 3 are overlapped. At this time, the direction in which the X electrode 6 and the Y electrode 7 extend and the direction in which the address electrode 16 extends are orthogonal to each other so that the address electrode 16 and the bridge portion 8 of the partition wall 4 overlap in plan view. . Thereafter, the sealing frit is fired at a temperature of 450 ° C., for example. Next, the space surrounded by the back substrate 2, the front substrate 3, and the sealing frit is evacuated, and a discharge gas is sealed in this space. Thereby, PDP1 is manufactured.

Next, the operation of the PDP according to the present embodiment will be described.
In PDP 1, one field for displaying one screen is divided into a plurality of subfields, and an initializing period, a writing period, and a sustaining period are provided in each subfield. Then, after all the discharge cells 10 are forcibly discharged in the initialization period to initialize the charge distribution in the discharge cells 10, the X electrode 6 or the Y electrode 7 is scanned in the address period while scanning the X electrode 6 or the Y electrode 7. By selectively applying a voltage, a write discharge is generated in the discharge cell 10 to emit light in the subfield, and a wall charge is formed.
Next, when an AC voltage is applied between the bus electrode 6a of the X electrode 6 and the bus electrode 7a of the Y electrode 7 in the sustain period, the wall voltage is applied to the applied AC voltage only in the discharge cell 10 in which wall charges are formed. The charge voltage is superimposed, and a sustain discharge is generated between the X electrode 6 and the Y electrode 7 via the discharge gas. With this sustain discharge, ultraviolet light having a wavelength of, for example, 1.47 nm is generated. When this ultraviolet light is incident on the phosphor layer 12, the phosphor layer 12 emits visible light. This visible light passes through the transparent dielectric layer 17 and the glass substrate 15 of the front substrate 3 and is emitted from the display surface of the PDP 1.

  At this time, in the discharge cell 10, the bus electrode 6a and the dielectric layer 6b integrally function as the X electrode 6, and the bus electrode 7a and the dielectric layer 7b integrally function as the Y electrode 7, A discharge path is formed between the electrode 6 and the Y electrode 7. For this reason, ultraviolet rays are generated between the X electrode 6 and the Y electrode 7. In the PDP 1 according to the present embodiment, since both the sustain electrode and the phosphor layer 12 are arranged on one substrate, that is, the back substrate 2, the distance between the discharge path and the phosphor layer 12. The distance between the ultraviolet light source and the phosphor layer 12 can be shortened. For this reason, the generated ultraviolet rays can be efficiently converted into visible light.

  Further, in the PDP 1, a part of the region above the lower surface of the bus electrode 6 a on the side surface of the X electrode 6 and a part of the region above the lower surface of the bus electrode 7 a on the side surface of the Y electrode 7. The phosphor layer 12 is not formed. For this reason, the phosphor layer 12 is not interposed in the discharge path of the sustain discharge, the phosphor layer 12 is not deteriorated by the discharge, and the reliability of the PDP 1 is high. If the phosphor layer 12 is formed on the entire surface of the side surfaces of the X electrode 6 and the Y electrode 7, the phosphor layer 12 is interposed in the discharge path. It will deteriorate. As a result, the deteriorated portion does not emit light and looks dark.

  Then, the number of sustain discharges is made different among a plurality of subfields constituting one field, and a combination of subfields to emit light for each discharge cell 10 is selected, so that each discharge cell 10 generates within one field. The number of discharges to be performed can be selected, and gradation can be expressed. Thereby, an image can be displayed on the whole PDP1.

Next, the effect of this embodiment will be described.
In this embodiment, since both the sustain electrode and the phosphor layer are arranged on the back substrate, the distance between the ultraviolet light source and the phosphor layer can be shortened compared to the conventional case. Efficiency can be increased. As a result, a PDP with high luminous efficiency can be obtained.
That is, in the conventional PDP shown in FIG. 14, the sustain electrodes (X electrode 106 and Y electrode 107) are provided on the front substrate 102, and the phosphor layer 115 is provided on the back substrate 103. For this reason, the distance to the phosphor layer 115 is long when viewed from the ultraviolet rays generated by the discharge formed between the X electrode 106 and the Y electrode 107. For this reason, the utilization efficiency of ultraviolet rays generated by discharge is not always sufficiently high. On the other hand, according to the present embodiment, since both the sustain electrodes (X electrode 6 and Y electrode 7) and the phosphor layer 12 are provided on the back substrate 2, the phosphor layer 12 from the source of ultraviolet rays is provided. Can be greatly shortened.

  Further, in the present embodiment, the phosphor layer is provided only on the upper surface of the glass substrate and on the side surface of the bridge portion, and a part of the dielectric layer covering the bus electrode is between the glass substrate and the bus electrode. The thickness of the phosphor layer is larger than the thickness of the portion of the phosphor layer disposed on the glass substrate. For this reason, the phosphor layer is formed on a part of the region above the lower surface of the bus electrode on the side surface of the X electrode and a part of the region above the lower surface of the bus electrode on the side surface of the Y electrode. If a voltage is applied between the X electrode and the Y electrode, a discharge can be generated along a route that does not interpose the phosphor layer. That is, a discharge path in which no phosphor layer is interposed is formed between the X electrode and the Y electrode. Thereby, a fluorescent substance layer does not deteriorate with discharge. Furthermore, in this embodiment, since the phosphor layer is formed of a photosensitive phosphor, the phosphor layer can be processed, and the phosphor layer can be arranged as described above.

  Furthermore, since the address electrode overlaps the bridge portion in plan view, the address electrode does not block the light emitted by the phosphor layer. For this reason, an aperture ratio is high and the utilization efficiency of light is high. Furthermore, since the counter electrode structure in which the X electrode and the Y electrode are opposed to each other is employed, the discharge start voltage can be reduced and the light emission efficiency can be increased as compared with the case where the surface electrode structure is employed. . Furthermore, since the color of the electrode at the address is black, the contrast of the displayed image can be improved.

  In the front substrate 3, a transparent electrode made of ITO (Indium Tin Oxide) or the like and connected to the address electrode 16 so as to extend from the address electrode 16 into the discharge cell 10 in a plan view (see FIG. (Not shown) may be provided. As a result, it is possible to reduce the discharge start voltage of the write discharge and more reliably select the discharge cell that generates the write discharge.

Next, a second embodiment of the present invention will be described.
7 and 8 are partial cross-sectional views showing the PDP according to the present embodiment. The plan view of the PDP according to the present embodiment is the same as FIG. 1, and the cross section shown in FIG. 7 corresponds to the cross section taken along line AA ′ shown in FIG. 1, and the cross section shown in FIG. Corresponds to a cross section taken along line BB ′ shown in FIG.

  As shown in FIGS. 7 and 8, in the PDP 21 according to the present embodiment, the back substrate 22 and the front substrate 3 are bonded to each other, and a discharge gas is sealed between the substrates. The configuration of the front substrate 3 is the same as that of the front substrate 3 in the first embodiment described above.

  In the rear substrate 22, a glass substrate 25 is provided. On the upper surface of the glass substrate 25, X electrodes 26 and Y electrodes 27 are provided alternately and in parallel with each other. In the X electrode 26, a bus electrode 26a is provided so as to be in contact with the glass substrate 25, and a dielectric layer 26b is provided so as to cover a surface of the bus electrode 26a that is not in contact with the glass substrate 25. Similarly, the Y electrode 27 is provided with a bus electrode 27a so as to be in contact with the glass substrate 25, and a dielectric layer 27b is provided so as to cover the surface of the bus electrode 27a that is not in contact with the glass substrate 25. ing. That is, the dielectric layers 26b and 27b are not provided between the glass substrate 25 and the bus electrodes 26a and 27a. Between the X electrode 26 and the Y electrode 27, there is provided a bridge portion 28 that extends in a direction orthogonal to the direction in which both electrodes extend, for example, in the vertical direction of the screen and connects the two electrodes to each other. The section 28, the X electrode 26, and the Y electrode 27 form a cross-shaped partition wall 24.

  One recess 25 a is formed in each of the regions surrounded by the barrier ribs 24 on the upper surface of the glass substrate 25, that is, the regions corresponding to the discharge cells 10. In plan view, the outer shape of the recess 25 a is equal to the outer shape of the discharge cell 10, and the outer edge of the recess 25 a is in contact with the root of the partition wall 24. The concave portion 25 a is continuously deeper as it is farther from the barrier rib 24, and is deepest in the central portion of the discharge cell 10. That is, the inner surface of the recess 25a has a gently continuous curved surface. A white dielectric layer 29 is provided on the inner surface of the recess 25 a and the side surface of the partition wall 24. That is, the white dielectric layer 29 is formed on the five inner surfaces of the discharge cell 10 on the back substrate 22 side. A phosphor layer 30 is provided on portions corresponding to the inner surface of the recess 25 a and the side surface of the bridge portion 28 on the white dielectric layer 29. The phosphor layer 30 is not formed on the side surfaces of the X electrode 26 and the Y electrode 27. That is, the phosphor layer 30 is formed on the three inner surfaces of the discharge cell 10.

  As described above, since the phosphor layer 30 is provided in the concave portion 25a of the glass substrate 25 except for a portion formed on the side surface of the bridge portion 28, the phosphor layer 30 of the bus electrode 26a on the side surface of the X electrode 26 is provided. It is not formed in a part of the region higher than the lower surface and a part of the region higher than the lower surface of the bus electrode 27 a on the side surface of the Y electrode 27. For this reason, when a predetermined voltage is applied between the bus electrode 26a and the bus electrode 27b, a discharge path in which the phosphor layer 30 is not interposed is formed between the X electrode 26 and the Y electrode 27.

  Further, a protective film (not shown) made of magnesium oxide is provided so as to cover the partition wall 24, the white dielectric layer 29, and the phosphor layer 30. Other configurations in the present embodiment are the same as those in the first embodiment.

Next, a method for manufacturing the PDP 21 according to the present embodiment will be described. First, a method for manufacturing the back substrate 22 will be described.
9A to 9C, FIGS. 10A to 10C, and FIGS. 11A to 11C are cross-sectional views showing a method of manufacturing the back substrate of the PDP according to this embodiment in the order of the steps. It is.

First, as shown in FIG. 9A, a glass substrate 25 is prepared. And DFR31 is stuck on the upper surface of this glass substrate 25 using a laminator. Then, the DFR 31 is exposed and developed to leave the DFR 31 only in a region where the partition wall 24 (see FIG. 7) is to be formed in a later process, and remove the DFR 31 in the other regions.
Next, as shown in FIG. 9B, a sand blast process is performed using the DFR 31 as a mask to form a recess 25 a on the upper surface of the glass substrate 25. At this time, the recess 25a is processed so as to form a curved surface whose inner surface becomes deeper as the distance from the region covered with the DFR 31 increases. Then, the DFR 31 is removed.
Next, as shown in FIG. 9C, a dielectric paste (not shown) is applied to the entire surface of the glass substrate 25. Then, the dielectric paste is dried by heating to a temperature at which the solvent in the dielectric paste evaporates. Thereby, the partition wall material layer 32 is formed.

Next, as shown in FIG. 10A, a DFR 33 is attached to the upper surface of the partition wall material layer 32 using a laminator. Then, by exposing and developing the DFR 33, only the region where the partition wall 24 (see FIG. 7) is to be formed in a later process and excluding the region where the bus electrodes 26a and 27a are to be formed is included. And DFR 33 is removed in other areas.
Next, as shown in FIG. 10B, sand blasting is performed using the DFR 33 (see FIG. 10A) as a mask to selectively remove the partition wall material layer 32. Is processed into a partition wall shape in which a groove 32a for embedding is formed. Then, the DFR stripping solution is used to remove the DFR 33, and the partition wall material layer 32 is washed with pure water and dried.
Next, as shown in FIG. 10C, a silver paste is filled in the lower part of the groove 32a of the partition wall material layer 32 by, for example, a screen printing method or the like. Then, by drying the silver paste, a conductive material body 34 is formed in the lower portion in the groove 32a.

  Next, as shown in FIG. 11A, a dielectric paste is filled in the upper portion of the groove 32a, that is, on the conductive material body 34 by a screen printing method or a dispenser method. As this dielectric paste, the same dielectric paste used in the step shown in FIG. 9C may be used, or a different one may be used. Then, the dielectric paste is dried by heating to a temperature at which the solvent in the dielectric paste evaporates. Thereby, the partition material layer 32b is formed in the upper part in the groove 32a.

  Next, as shown in FIG. 11B, the white dielectric paste is filled into the space surrounded by the partition wall material layer 32 by a screen printing method or a dispenser method. Then, the white dielectric paste is dried by heating to a temperature at which the solvent contained in the paste evaporates. At this time, the layer thickness after drying can be reduced by increasing the solvent content in the white dielectric paste. Next, the glass substrate 25 and the components formed thereon are heated to a temperature at which the partition wall material layers 32 and 32b, the conductive material body 34, and the white dielectric paste are sintered and the glass substrate 25 is not softened, for example, 520 Bake by heating to a temperature of 600 ° C. As a result, the partition wall material layers 32 and 32b are sintered to form the partition wall 24, the conductive material body 34 is sintered to the bus electrodes 26a and 27a, and the white dielectric paste is sintered to the white dielectric layer 29. . At this time, the part including the bus electrodes 26a and 27a in the partition wall 24 becomes the X electrode 26 and the Y electrode 27, respectively, and the part connecting the X electrode 26 and the Y electrode 27 to each other is a bridge part 28 (see FIG. 8). Become.

  Next, as shown in FIG. 11C, a paste-like photosensitive phosphor 30a is deposited in the space surrounded by the partition walls 24 by a screen printing method or the like and dried. Next, a mask (not shown) is disposed above the photosensitive phosphor 30a. This mask covers a portion of the photosensitive phosphor 30 a located on the side surfaces of the X electrode 26 and the Y electrode 27, and exposes portions located on the upper surface of the glass substrate 25 and the side surfaces of the bridge portion 28. The one patterned in this way is used. Then, using this mask, the photosensitive phosphor 30a is exposed and developed. As a result, the exposed portion of the photosensitive phosphor 30a is cured and remains after development, and the unexposed portion is removed by development. As a result, as shown in FIG. 7, the phosphor layer 30 is not formed on the side surface of the X electrode 26 and the side surface of the Y electrode 27, but on the side surface of the bridge portion 28 (see FIG. 8) and in the recess 25a. Only the phosphor layer 30 is formed. In this way, the back substrate 22 is manufactured.

  On the other hand, the front substrate 3 is produced separately from the production of the back substrate 22 described above. Then, the back substrate 22 and the front substrate 3 are bonded together, and a discharge gas is sealed between the substrates. The method for producing the front substrate 3 and the method for enclosing the discharge gas by bonding the two substrates are the same as in the first embodiment.

  In the present embodiment, a recess is formed on the upper surface of the glass substrate, and a phosphor layer is provided in the recess, thereby providing a dielectric layer between the X electrode and Y electrode bus electrodes and the glass substrate. The upper surface of the portion formed on the glass substrate in the phosphor layer is positioned lower than the lower surface of the bus electrode, and is higher than the lower surface of the bus electrode on the side surface of the X electrode and the side surface of the Y electrode. A region where the phosphor layer is not formed can be provided. A discharge path in which no phosphor layer is interposed can be formed between the X electrode and the Y electrode. Thus, in this embodiment, since it is not necessary to form a dielectric layer between a glass substrate and a bus electrode, manufacture of a back substrate is easy. Operations and effects other than those described above in the present embodiment are the same as those in the first embodiment described above.

Next, a third embodiment of the present invention will be described.
FIG. 12A is a cross-sectional view showing a method for processing a phosphor layer in the first embodiment, and FIG. 12B is a cross-sectional view showing a method for processing a phosphor layer in the third embodiment.
As shown in FIG. 12B, in the PDP according to the present embodiment, the shape of the cross section perpendicular to the longitudinal direction of the partition wall 44 is a trapezoid whose upper side is shorter than the lower side, and the side surface of the partition wall 44 is Tapered.

  FIG. 12A shows the process shown in FIG. 6C in the method for manufacturing the PDP in the first embodiment described above. As shown in FIG. 12A, in the first embodiment, the side surfaces of the X electrode 6 and the Y electrode 7 are perpendicular to the upper surface of the glass substrate 5. For this reason, the surface of the portion formed on the side surfaces of the X electrode 6 and the Y electrode 7 in the photosensitive phosphor 12c is also vertical. In the process shown in FIG. Must be removed. On the other hand, a portion of the photosensitive phosphor 12c formed on the upper surface of the glass substrate 25, that is, a horizontal portion 12e whose surface is parallel to the upper surface of the glass substrate 25 is shown in FIG. In the process shown in (1), it must be left without being removed.

  In order to pattern the photosensitive phosphor 12c, for example, a portion to be removed is covered with a mask 51, and only a portion to be left is exposed, and then exposed by irradiating light 53 such as a laser beam from above, and exposing, Then develop. At this time, the vertical portion 12d of the photosensitive phosphor 12c is covered by the edge portion of the mask 51, but the irradiation direction of the light 53 is parallel to the surface of the vertical portion 12d. High positional accuracy is required.

On the other hand, in the present embodiment, as shown in FIG. 12B, the shape of the cross section in the longitudinal direction of the partition wall 44 is a trapezoid, and the side surfaces of the X electrode 46 and the Y electrode 47 are tapered. It has become. For this reason, the surface of the part formed on the side surface of the X electrode 46 and the Y electrode 47 in the photosensitive phosphor 12 c is inclined with respect to the irradiation direction of the light 43. Therefore, when viewed from the irradiation direction of the light 53, the area of the portion formed on the side surfaces of the X electrode 46 and the Y electrode 47 in the photosensitive phosphor 12c is large, and the allowable error with respect to the light shielding position accuracy is large. For this reason, the processing of the photosensitive phosphor 12c is easy.
The same effect can be obtained when the phosphor is patterned by etching or sandblasting without using the photosensitive phosphor.

  In order to make the shape of the cross section perpendicular to the longitudinal direction of the partition wall into a trapezoidal shape, a dielectric paste having a high firing shrinkage rate as a dielectric paste applied on the glass substrate 5 in the step shown in FIG. A dielectric paste having a firing shrinkage of 80% or more may be used. 6B, when the partition wall material layer 4d formed by drying this dielectric paste is fired, the partition wall material layer 4d is restrained by the glass substrate 5 and the bus electrodes 6a and 7a. Since it shrinks, the cross-sectional shape of the partition wall 4 becomes a trapezoid whose upper side is shorter than the lower side after firing. Or what is necessary is just to set processing time short when performing the sandblasting process with respect to the partition material layer 4d in the process shown to Fig.6 (a). Thereby, since the upper part of the partition 4 is removed preferentially over the lower part, the sectional shape of the partition 4 is a trapezoid whose upper side is shorter than the lower side. Or you may use together the method of using the dielectric paste with the above-mentioned high baking shrinkage rate, and the method of shortening the processing time of a sandblasting process.

  As described above, in the present embodiment, the phosphor layer can be easily processed in manufacturing the PDP, and the manufacturing cost is low, as compared with the first embodiment described above. Other configurations, manufacturing methods, operations, and effects in the present embodiment are the same as those in the first embodiment described above.

  Note that this embodiment can be combined with the second embodiment described above. In this case, in order to make the cross-sectional shape of the partition wall trapezoidal and to taper the side surface of the partition wall, a firing shrinkage rate is used as a dielectric paste applied on the glass substrate 25 in the step shown in FIG. May be used, for example, a dielectric paste having a firing shrinkage rate of 80% or more. Thus, in the step shown in FIG. 11B, when the partition wall material layer 32 formed by drying this dielectric paste is fired, the partition wall material layer 32 is restrained by the glass substrate 25 and the bus electrodes 26a and 27a. However, after firing, the cross-sectional shape of the partition wall 24 becomes a trapezoid whose upper side is shorter than the lower side. As a result, since the surface of the phosphor layer formed on the side surfaces of the X electrode and the Y electrode is inclined with respect to the incident direction of light, the phosphor layer can be easily processed.

Next, a fourth embodiment of the present invention will be described.
FIG. 13 is a partial plan view showing the PDP according to the present embodiment. In FIG. 13, only the address electrodes and extending portions of the front substrate and the glass substrate and partition walls of the rear substrate are shown for the sake of simplicity.
In the PDP 61 according to the present embodiment, an extending portion 62 connected to the address electrode 16 is provided on the front substrate. In plan view, the extension 62 extends from the address electrode 16 along a direction orthogonal to the direction in which the address electrode 16 extends (hereinafter referred to as the extension direction), that is, a region surrounded by the barrier ribs 4, that is, the discharge cell 10. It extends into the area corresponding to.

The shape of the extending part 62 is, for example, an obtuse isosceles triangle with the base in contact with the address electrode 16 and the apex at the tip in the extending direction. However, the shape of the extended portion 62 is not limited to this specific example, and for example, a stripe pattern protruding in a direction substantially perpendicular to the address electrode 16 may be used. The extending part 62 is formed of a mesh made of a conductive material, for example, a material containing silver and an inorganic binder. The width of each wire constituting the mesh is preferably as thin as possible, for example, preferably several μm or less. Furthermore, in plan view, when the length in the extending direction of the portion extending into the discharge cell 10 in the extending portion 62 is L _A and the length of the entire discharge cell 10 in the extending direction is L _B , 1/3 less than the length _{L a} is the length _{L B, i.e., L} B> is a 3 × _{L a.} The extension 62 is formed at the same time as the address electrode 16. The configuration and manufacturing method other than those described above in the present embodiment are the same as those in the first embodiment described above.

  In the first embodiment described above, in order to increase the aperture ratio of the discharge cells, the address electrodes are arranged at positions overlapping the barrier ribs in plan view. On the other hand, in order to lower the discharge start voltage of the write discharge and more reliably select the discharge cell that generates the write discharge, the electrode may be drawn from the address electrode into a region corresponding to the discharge cell. Then, the aperture ratio is lowered by the amount of the extracted electrode. Therefore, conventionally, an extending portion that is drawn from the address electrode into a region corresponding to the discharge cell is formed of a transparent conductive material such as ITO. However, this method has the problem that the cost of the PDP increases because it is necessary to use expensive ITO.

Therefore, in the present embodiment, the extending portion 62 is formed in a mesh shape and is formed of a conductive material, for example, a material for forming the address electrode 16. Thereby, the extension part 62 can have a certain amount of translucency and high conductivity. As a result, the discharge start voltage of the write discharge can be reduced while maintaining a high aperture ratio without using expensive ITO, and a discharge cell that generates the write discharge can be selected more reliably. In the present embodiment, the length L _A of FIG. 13, by a third less than a length L _B, it is possible to maintain a high aperture ratio. As a result, the driving voltage is low, the cost is low, the discharge cells can be reliably selected, the operation is stable, and the PDP having a bright display due to the high aperture ratio can be obtained. Operations and effects other than those described above in the present embodiment are the same as those in the first embodiment described above.

  In the present embodiment, the example in which the material for forming the extension portion 62 is the same as the material for forming the address electrode has been described. However, the present invention is not limited to this, and the material for forming the address electrode is used. Different materials may be used. However, the material forming the extension 62 is preferably a material that has a low resistivity and can be formed thin. In addition, this embodiment may be combined with the second embodiment described above. Furthermore, the shape of the extending portion may be a branch shape whose longitudinal direction is a direction orthogonal to the direction in which the address electrodes extend. Furthermore, the center line of the address electrode may be shifted with respect to the center line of the bridge portion overlapping with the address electrode without providing the extension portion. As a result, the address electrode can be brought close to the corresponding discharge cell without reducing the aperture ratio at all, thereby reducing the write discharge start voltage and more reliably selecting the discharge cell that generates the sustain discharge.

  The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to these embodiments. For example, even if the person skilled in the art has made various design changes regarding the shape of the electrode, the shape of the partition, the shape of the dielectric layer, the material used and the driving method, etc. It is included in the scope of the invention.

It is a partial top view which shows PDP which concerns on the 1st Embodiment of this invention. It is a fragmentary sectional view by the A-A 'line shown in FIG. It is a fragmentary sectional view by the B-B 'line shown in FIG. (A) thru | or (c) is sectional drawing which shows the preparation methods of the back substrate of PDP which concerns on this embodiment in the order of the process. (A) thru | or (c) are sectional drawings which show the preparation methods of the back substrate of PDP which concerns on this embodiment in the order of the process, and show the process following the process shown in FIG.4 (c). (A) thru | or (c) are sectional drawings which show the preparation methods of the back substrate of PDP which concerns on this embodiment in the order of the process, and show the process following the process shown in FIG.5 (c). It is a fragmentary sectional view showing PDP concerning a 2nd embodiment of the present invention. It is a fragmentary sectional view showing PDP concerning this embodiment. (A) thru | or (c) is sectional drawing which shows the preparation methods of the back substrate of PDP which concerns on this embodiment in the order of the process. (A) thru | or (c) are sectional drawings which show the preparation methods of the back substrate of PDP which concerns on this embodiment in the order of the process, and show the process following the process shown in FIG.9 (c). (A) thru | or (c) is sectional drawing which shows the preparation methods of the back substrate of PDP which concerns on this embodiment in the order of the process, and shows the process following the process shown in FIG.10 (c). (A) is sectional drawing which shows the processing method of the fluorescent substance layer in the 1st Embodiment of this invention, (b) is a cross section which shows the processing method of the fluorescent substance layer in the 3rd Embodiment of this invention. FIG. It is a partial top view which shows PDP which concerns on the 4th Embodiment of this invention. 10 is a partial cross-sectional view showing a counter electrode type PDP described in Patent Document 1. FIG.

Explanation of symbols

1, 21, 61 PDP
2, 22 Rear substrate 3 Front substrate 4, 24, 44 Partition walls 4a, 4c, 4d, 32, 32b Partition material layer 4b, 32a Grooves 5, 15, 25 Glass substrates 6, 26, 46 X electrodes 6a, 7a, 26a, 27a Bus electrodes 6b, 7b, 26b, 27b Dielectric layers 7, 27, 47 Y electrodes 8, 28 Bridge portions 9, 14, 31, 33 DFR
9a, 14a Opening 10 Discharge cell 11, 29 White dielectric layer 12, 30 Phosphor layer 12a Bottom 12b Side 12c, 30a Photosensitive phosphor 12d Vertical portion 12e Horizontal portion 13, 34 Conductive material body 16 Address electrode 17 Transparent Dielectric layer 25a Recessed portion 51 Mask 53 Light 62 Extending portion 101 PDP
102 Front substrate 103 Rear substrate 105, 111 Glass substrate 106 X electrode 106a, 107a Bus electrode 106b, 107b Dielectric layer 107 Y electrode 108 Protective film 110 Discharge cell 112 Address electrode 113 White dielectric layer 114 Bulkhead 115 Phosphor layer

Claims (10)

A back substrate;
A front substrate disposed opposite to the rear substrate;
A discharge gas sealed between the back substrate and the front substrate;
With
The back substrate is
An insulating substrate;
A plurality of X electrodes and Y electrodes, which are alternately arranged on the surface of the insulating substrate facing the front substrate and spaced apart from each other and extending in the first direction,
A bridge portion connecting the X electrode and the Y electrode to form a grid-like partition wall that partitions the discharge cell together with the X electrode and the Y electrode;
A phosphor layer that is formed on the surface of the insulating substrate and on the side surface of the bridge portion and emits visible light when ultraviolet rays are incident thereon;
Have
The front substrate is
A transparent substrate;
An address electrode formed on a surface of the transparent substrate facing the back substrate and extending in a second direction intersecting the first direction;
Have
A plasma display panel, wherein a discharge path in which the phosphor layer is not interposed is formed between the X electrode and the Y electrode. The X electrode and the Y electrode are respectively
A bus electrode made of a conductor;
A dielectric layer covering the periphery of the bus electrode;
Have
The phosphor layer is substantially formed in a region that is higher than the lower surface of the bus electrode on the side surface of the X electrode and a region that is higher than the lower surface of the bus electrode on the side surface of the Y electrode. The plasma display panel according to claim 1, wherein the plasma display panel is not provided.   A part of the dielectric layer is disposed between the insulating substrate and the bus electrode, and the thickness thereof is thicker than the thickness of the portion of the phosphor layer disposed on the insulating substrate. The plasma display panel according to claim 2.   A recess is formed in a region surrounded by the partition wall on the surface of the insulating substrate, and the phosphor layer is disposed in the recess and on a side surface of the bridge portion. 2. The plasma display panel according to 2.   The shape of the cross section orthogonal to the first direction in the X electrode and the Y electrode is a trapezoidal shape whose upper side is shorter than the lower side. Plasma display panel.   The plasma display panel according to claim 1, wherein the phosphor layer is formed of a photosensitive phosphor.   The plasma display according to any one of claims 1 to 6, wherein the address electrode is disposed at a position overlapping the bridge portion when viewed from a direction perpendicular to the surface of the transparent substrate. panel.   The front substrate has an extending portion connected to the address electrode, and the extending portion is formed of a mesh made of a conductor, and is seen from a direction perpendicular to the surface of the transparent substrate. 8. The plasma display panel according to claim 7, wherein the plasma display panel extends from an address electrode into a region surrounded by the partition wall.   When viewed from the direction perpendicular to the surface of the transparent substrate, the length in the first direction of the portion extending in the region surrounded by the partition wall in the extension portion is the entire region surrounded by the partition wall. 9. The plasma display panel according to claim 8, wherein the plasma display panel is less than one third of the length in the first direction.   The plasma display panel according to claim 1, wherein a color of the address electrode is black.

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