JP4131427B2 - Electronic component crimping equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus for manufacturing a flat panel display represented by a liquid crystal panel, and more particularly to an electronic component crimping apparatus that crimps an electronic component on a substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, component mounting apparatuses for mounting electronic components such as tape carrier components on a substrate such as a glass substrate or a printed substrate are known. In such a component mounting apparatus, for example, a tape carrier component (TCP) is pressure-bonded onto a glass substrate via an anisotropic conductive film tape (ACF).
[0003]
FIGS. 3A, 3B, and 3C are diagrams for explaining such a crimping process. As shown in FIGS. 3 (a), (b), and (c), first, an anisotropic conductive film tape 22 was applied onto the glass substrate 21 (see FIG. 3 (a)), and then punched from the tape 24. The tape carrier component 23 is temporarily pressure-bonded onto the glass substrate 21 via the anisotropic conductive film tape 22 (see FIG. 3B). Thereafter, the glass substrate 21 on which the tape carrier component 23 has been temporarily pressure-bonded is placed on the backup 25, and then the tape carrier component 23 is finally pressure-bonded onto the glass substrate 21 by applying a predetermined pressure and heat with the pressure-bonding tool 26. (See FIG. 3 (c)).
[0004]
By the way, when the tape carrier component 23 is finally crimped onto the glass substrate 21 by the crimping tool 26, it is necessary to apply a uniform pressure to the tape carrier component 23. Accordingly, the parallelism between the crimping surface 26a of the crimping tool 26 and the tape carrier component 23 is important, and if the crimping surface 26a of the crimping tool 26 is distorted or tilted, the tape carrier component 23 is crimped. A defect will occur.
[0005]
Therefore, in the past, an electronic component crimping apparatus 30 as shown in FIGS. 4A and 4B has been proposed, and a large number of adjusting screws 6 are disposed between the crimping tool 26 and the supporting rigid body 5. The crimping tool 26 itself is tilted or deformed by pushing and pulling the adjusting screw 6 so as to remove the distortion or inclination of the crimping surface 26a of the crimping tool 26.
[0006]
[Problems to be solved by the invention]
Here, in the electronic component crimping apparatus 30 shown in FIGS. 4A and 4B, a crimping head attached to the lower surface of the heater holding block 2 by a plurality of heaters 3 embedded in the heater holding block 2 of the crimping tool 26. 4, when viewed in the longitudinal direction of the crimping tool 26, a region located below the heater 3 in the heater holding block 2 and the crimping head 4 is not located in another region (not located below the heater 3). The temperature is particularly high compared to the region. And deformation | transformation (thermal expansion) arises by such heat, and the part located in the lower part of the heater 3 among the crimping | compression-bonding surfaces 26a of the crimping | compression-bonding tool 26 becomes convex (refer the code | symbol P and FIG. 5 of FIG.4 (c)). .
[0007]
Such distortion and inclination of the crimping surface 26a of the crimping tool 26 can be removed by pushing and pulling the adjusting screw 6. However, depending on the degree of thermal expansion, it is necessary to push and pull the adjusting screw 6 to a considerable extent. There is a problem that adjustment takes a lot of labor and time.
[0008]
The present invention has been made in consideration of such points, and provides an electronic component crimping apparatus capable of suppressing distortion and inclination of the crimping surface due to thermal expansion of the heater holding block and the crimping head due to the heat of the heater. The purpose is to do.
[0009]
[Means for Solving the Problems]
The present invention relates to an electronic component crimping apparatus for crimping an electronic component on a substrate, and is provided between a support, a crimping tool supported by the support, and the support and the crimping tool. An adjustment mechanism that adjusts the surface parallelism of the pressure-bonding surfaces, and the pressure-bonding tool is mounted along a heater holding block in which a plurality of heaters are embedded at predetermined intervals in the longitudinal direction, and along the longitudinal direction of the heater holding block. A crimping head for heating and pressurizing the electronic component to be crimped onto the substrate, and a gap is formed between the heater holding block and the crimping head corresponding to each heater. There is provided an electronic component crimping apparatus characterized in that a plurality of spacers are provided .
[0011]
In the present invention, it is preferable that each of the dropout portions is located between each of the heaters and the pressure-bonding head in the heater holding block. Moreover, it is preferable that each said removal part is formed as a through-hole extended in the direction substantially orthogonal to the longitudinal direction of the said heater holding block.
[0013]
According to the present invention, the thermal expansion (deformation) of the heater holding block caused by the heating by each heater is absorbed by the missing part, and the heat transfer from the heater holding block to the crimping head is absorbed by the missing part. Since it suppresses, it can suppress that the part of the crimping surface located in the lower part of a heater becomes convex as much as possible, and can keep the crimping surface of a crimping tool as flat as possible. Therefore, distortion and inclination of the crimping surface of the crimping tool can be minimized.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0015]
1A and 1B are a front view and a side view, respectively, showing a reference form of an electronic component crimping apparatus according to the present invention. As shown in FIGS. 1A and 1B, an electronic component crimping apparatus 10 is for crimping an electronic component such as a tape carrier component onto a substrate such as a glass substrate or a printed circuit board. Body) 5 and a crimping tool 1 supported by the supporting rigid body 5. The crimping tool 1 is connected to the supporting rigid body 5 via a plurality of adjustment screws (adjustment mechanisms) 6, and the surface parallelism of the crimping surface 1 a of the crimping tool 1 is adjusted by pushing and pulling these adjustment screws 6. Can be done.
[0016]
Here, the crimping tool 1 has a heater holding block 2 in which a plurality of heaters 3 are embedded at predetermined intervals in the longitudinal direction, and a crimping head 4 attached along the longitudinal direction on the lower surface of the heater holding block 2. Then, a predetermined pressure and heat are applied to the substrate and the electronic component to be subjected to pressure bonding via the pressure bonding head 4. In addition, between the heaters 3 and the pressure-bonding head 4 in the heater holding block 2, corresponding to the heaters 3, there are formed recesses 2 a at positions immediately below the heaters 3. In addition, each removal part 2a is formed as a through-hole extended in the horizontal direction (direction substantially orthogonal to a longitudinal direction) of the heater holding block 2. As shown in FIG.
[0017]
Next, the operation of the reference embodiment having such a configuration will be described.
[0018]
In the electronic component crimping apparatus 10 shown in FIGS. 1A and 1B, a plurality of heaters 3 embedded in the heater holding block 2 of the crimping tool 1 heats the crimping head 4 attached to the lower surface of the heater holding block 2. Is done. At this time, a region located below each heater 3 in the heater holding block 2 is particularly hot compared to other regions (regions not located below each heater 3), but at a position directly below each heater 3. Since the escape portion 2a is formed, the thermal expansion (deformation) of the heater holding block 2 caused by heating in each heater 3 is absorbed by the escape portion 2a, and from the heater holding block 2 to the crimping head 4. The heat transfer is also suppressed at the missing portion 2a.
[0019]
As described above, according to the reference embodiment , the thermal expansion (deformation) of the heater holding block 2 caused by the heating of each heater 3 is absorbed by the escape portion 2a, and from the heater holding block 2 to the crimping head 4. Since the heat transfer is suppressed by the escape portion 2a, the pressure-bonding surface 1a of the pressure-bonding tool 1 can be made as much as possible by suppressing the portion of the pressure-bonding surface 1a located at the lower portion of the heater 3 from becoming convex. Can be kept flat. Therefore, it is possible to minimize the pushing and pulling of the adjusting screw 6 for adjusting the distortion and inclination of the crimping surface 1a of the crimping tool 1, and therefore, the parallelism of the crimping surface 1a of the crimping tool 1 can be easily performed. And it can be adjusted in a short time.
[0020]
In the above-described reference mode , the heater holding block 2 itself has the recess 2a. However, the present invention is not limited to this, and as shown in FIG. In addition, a plurality of shims (spacers) 7 may be provided so as to form a recess corresponding to each heater 3 (this embodiment) , and at a position corresponding to each heater 3 in the upper part of the pressure bonding head 4. You may make it provide a missing part.
[0021]
Moreover, in embodiment mentioned above, although the adjusting screw 6 is used as an adjustment mechanism which adjusts the surface parallelism of the crimping | compression-bonding surface 1a of the crimping | compression-bonding tool 1, it is not restricted to this, The change of the emitted-heat amount and applied voltage You may make it use the expansion-contraction block etc. which expand-contract according to a change.
[0022]
Further, in the above-described reference embodiment , the missing portion 2a is formed as a through-hole extending in the lateral direction of the heater holding block 2 (a direction substantially orthogonal to the longitudinal direction). You may form as a cavity-shaped hole opened toward the lower surface of this.
[0023]
【The invention's effect】
As described above, according to the present invention, it is possible to suppress distortion and inclination of the pressure-bonding surface due to thermal expansion of the heater holding block and the pressure-bonding head due to the heat of the heater.
[Brief description of the drawings]
FIG. 1 is a diagram showing a reference form of an electronic component crimping apparatus according to the present invention.
FIG. 2 is a view showing an embodiment of an electronic component crimping apparatus according to the present invention.
FIG. 3 is a view for explaining a step of crimping an electronic component on a substrate.
FIG. 4 is a view showing a conventional electronic component crimping apparatus.
FIG. 5 is an enlarged view of a V portion shown in FIG. 4;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Crimping tool 1a Crimping surface 2 Heater holding block 2a Outgoing part 3 Heater 4 Crimping head 5 Support rigid body (support)
6 Adjustment screw 7 Shim (Spacer)
10 Electronic component crimping equipment

Claims (3)

In an electronic component crimping apparatus that crimps an electronic component on a substrate,
A support;
A crimping tool supported by the support;
An adjustment mechanism that is provided between the support and the crimping tool and adjusts the surface parallelism of the crimping surface of the crimping tool;
The crimping tool includes a heater holding block in which a plurality of heaters are embedded at predetermined intervals in the longitudinal direction, and the electronic component that is attached along the longitudinal direction of the heater holding block and is crimped on the substrate. An electronic component comprising: a pressure-bonding head for pressing, and a plurality of spacers provided between the heater holding block and the pressure-bonding head so as to form a recess corresponding to each heater. Crimping device . 2. The electronic component crimping apparatus according to claim 1, wherein each of the removal portions is located between each of the heaters and the crimping head in the heater holding block. 3. The electronic component crimping device according to claim 1, wherein each of the dropout portions extends in a direction substantially orthogonal to a longitudinal direction of the heater holding block.

Images