JP5297980B2 - Component crimping apparatus and component crimping method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component compression bonding device that carries out thermocompression bonding, suppressing the effect of thermal expansion or the like, where a plurality of sections to be compression bonded is equipped, even if the section is a component located in a comparatively distant position. <P>SOLUTION: The component compression bonding device which carries out thermocompression bonding of a substrate side compression bonding part 210 of a substrate 200 and a component side compression bonding part 211 of a flexible component 201 with an anisotropic conductive sheet includes a supporting rod 101 which gives a compressing force to the substrate 200, while having a heating means 110 in its front end and being arranged in a plurality of places, a compressing device 102 having a compressing body 121 which gives the compressing force simultaneously to the plurality of component side compression bonding parts 211, a rotating device which arranges the flexible component 201 in a working position by rotating the compressing device 102, a component supply device which supplies the flexible component 201, and a substrate arrangement device which arranges the substrate 200. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a component crimping apparatus for crimping a component to a plate-like substrate, and in particular, both ends of a relatively long flexible component called a flexible substrate are connected to one end of the substrate. And a component crimping apparatus that performs thermocompression bonding to the other end.

  Conventionally, it is necessary to attach components such as a driver IC for controlling image display to the peripheral portion of a glass substrate constituting a thin display device such as a liquid crystal display or a plasma display. This work is automatically performed industrially by a device called a component crimping device. The steps performed by this component crimping apparatus are generally as described in Patent Document 1. That is, the edge part of a glass substrate is mounted in the support part called a backup stage. On the other hand, the driver IC is arranged at a predetermined position by a so-called head that can hold, convey and press the driver IC against the glass substrate. An anisotropic conductive sheet (ACF) is attached to either the driver IC or the glass substrate in advance (in the invention described in Patent Document 1, the anisotropic conductive sheet is attached to the driver IC). . In the above state, the driver IC is heated by the heating means attached to the head, and the anisotropic conductive sheet is heated by pressing the heated driver IC against the glass substrate through the anisotropic conductive sheet. Then, the driver IC and the glass substrate are thermocompression bonded. This series of steps may be collectively referred to as “mounting”.

Japanese Patent No. 3104598

  However, with the progress of thin display devices and touch panels in recent years, there have been cases where parts for crimping are provided on both end sides of an elongated flexible substrate, and these parts and glass substrates such as thin display devices and touch panels have been crimped. ing. In this case, when the flexible substrate and the glass substrate are thermocompression bonded via the anisotropic conductive sheet, if the flexible substrate held by one crimping head is heated by the heating means provided in the crimping head, the entire flexible substrate is obtained. Is stretched or twisted by heat, and there is a disadvantage that the portion where the flexible substrate is crimped does not match the portion of the glass substrate.

  In order to eliminate this inconvenience, multiple parts used for crimping the flexible board are simultaneously held by different crimping heads, and the parts of the flexible board not used for crimping are thermocompression bonded to the board as much as possible. However, there are many difficulties in designing the device, such as the mechanism of the component crimping device becoming too complicated.

  The present invention has been made in view of the above-described problems, and includes a plurality of parts to be subjected to pressure bonding, even if the part is located at a relatively distant place, without complicating the mechanism of the apparatus. An object is to provide a component crimping apparatus and a component crimping method capable of thermocompression bonding to a substrate.

  In order to achieve the above object, a component crimping apparatus according to the present invention is located at a plurality of board-side crimping portions located at a plurality of locations on a substrate and at a plurality of locations of a flexible component having flexibility. A plurality of component-side crimping portions of the flexible component located at locations corresponding to the substrate-side crimping portions are pressed with an anisotropic conductive sheet sandwiched therebetween, and a plurality of substrate-side crimping portions and a plurality of component-side crimping portions are Are each a component crimping device for thermocompression bonding, having heating means that are arranged at a plurality of locations corresponding to the substrate-side crimping portion and can heat the anisotropic conductive sheet to a temperature required for thermocompression bonding. A plurality of support portions for supporting the lower surface portion of the substrate corresponding to the substrate-side crimping portion from below, and holding the flexible component, and simultaneously applying a pressing force to the plurality of component-side crimping portions of the flexible component A pressing device having a pressing body and a plurality of the pressing A rotating device that holds the device on the same circumference, and rotates the pressing device along the circumference to place the flexible component at a work position for thermocompression bonding to the substrate supported by the plurality of supporting portions; A component supply device that is arranged at a component supply position that is distant from a work position for thermocompression bonding to a substrate on the same circumference with respect to the rotating device, and that supplies a flexible component to the pressing device; and the support portion And a substrate placement device for placing the substrate.

  According to this, since the substrate side crimping portions located at a plurality of locations are individually heated from the lower surface of the substrate, there is less energy loss compared to the case where the entire large block-shaped member is heated and crimped, and it is efficiently different. It becomes possible to carry out pressure bonding by transferring heat to the isotropic conductive sheet. In addition, since the entire long flexible component is not heated, it is possible to effectively suppress elongation and distortion generated in the flexible component. In addition, since the pressing device that holds the flexible component does not heat the flexible component in advance, it is possible to further suppress the elongation and distortion of the flexible component. Moreover, since it is not necessary to provide a heating means in the rotating pressing device, a component crimping device having a simple structure can be provided. Moreover, since it presses simultaneously on the component side crimping | compression-bonding part of multiple places with one press body, the component crimping apparatus of a simple structure can be provided.

  It is preferable that the pressing body further includes a heat insulating portion that suppresses heat conduction from the anisotropic conductive sheet on a side that contacts the component-side crimping portion of the flexible component.

  Thereby, it can suppress that a press body heats up with the heat transmitted from the heating means with which a support part is equipped, and it can avoid that a flexible component is extended by the heated press body. Moreover, since the heat radiation by the pressing body can be suppressed, the anisotropic conductive sheet can be efficiently heated, which can contribute to energy saving.

  The pressing body may further include an auxiliary holding portion that holds a portion other than the component-side crimping portion of the flexible component so that the form of the entire flexible component falls within a predetermined range.

  Thereby, it is possible to hold the flexible component in a state in which the bending is suppressed, and it is possible to avoid a problem that occurs due to contact between the bent portion and the substrate.

  Furthermore, you may provide the camera which is arrange | positioned in the area | region between the said some support parts, and images the mark attached to a board | substrate.

  Thereby, since a board | substrate can be confirmed in the vicinity of a board | substrate side crimping | compression-bonding part, it becomes possible to grasp | ascertain correctly the position at the time of arrange | positioning a board | substrate. In addition, when the substrate is transparent, it is possible to grasp the state of the flexible component immediately before or during the crimping process.

  In order to achieve the above object, a component crimping method according to the present invention includes a substrate-side crimping portion located at a plurality of locations on a substrate and a plurality of flexible components having flexibility. A component crimping method for thermocompression bonding a plurality of component-side crimping portions of a flexible component located at a location corresponding to a substrate-side crimping portion via an anisotropic conductive sheet, and a plurality of supports disposed at a plurality of locations The substrate placement device arranges the substrate so that the substrate-side crimping portion is located in each of the portions, supports the arranged substrate by a plurality of support portions, and makes anisotropy by the heating means provided in the support portion that contacts the substrate The conductive sheet is heated to a temperature required for thermocompression bonding, and the flexible parts respectively held by a plurality of pressing devices arranged along the same circumference are rotated by the rotating device together with the pressing device, so that the plurality of the support members are rotated. Heat to the substrate supported by It is arranged at the work position to be worn, the flexible component is pressed against the substrate via the anisotropic conductive sheet by the pressing device, and the plurality of substrate side crimping portions and the plurality of component side crimping portions are respectively thermocompression bonded. Features.

  According to this, in order to individually heat the substrate side crimping portion located at a plurality of locations from the lower surface of the side edge portion of the substrate, there is less energy loss than when heating and crimping the entire large block-shaped member, It is possible to efficiently conduct heat and pressure bonding to the anisotropic conductive sheet. In addition, since the entire long flexible component is not heated, the elongation generated in the flexible component can be effectively suppressed. In addition, since the pressing device that holds the flexible component does not heat the flexible component in advance, it is possible to further suppress the elongation of the flexible component.

  According to the component crimping device and the component crimping method according to the present invention, even if the device configuration is simple, the flexible component and the substrate are suppressed as much as possible by suppressing the expansion and twisting of the flexible component caused by heat. Can be crimped in an accurate positional relationship.

It is a side view which shows typically embodiment of a component crimping | compression-bonding apparatus. It is a top view which shows typically embodiment of a component crimping | compression-bonding apparatus. It is a perspective view which shows a support part and a press apparatus with a flexible component and a board | substrate. It is a perspective view which shows the press body provided with the auxiliary | assistant holding | maintenance part with a flexible part, (a) is a perspective view showing the state before holding a flexible part, (b) shows the holding state. A perspective view and (c) are side views showing a holding state.

  Next, an embodiment of a component crimping apparatus according to the present invention will be described with reference to the drawings.

  FIG. 1 is a side view schematically showing an embodiment of a component crimping apparatus.

  FIG. 2 is a plan view schematically showing an embodiment of the component crimping apparatus.

  As shown in these drawings, a component crimping apparatus 100 according to the present invention is a device that presses a substrate 200 and a flexible component 201 in a state of sandwiching an anisotropic conductive sheet 212 and performs thermocompression bonding. A unit 101, a pressing device 102, a rotating device 103, a component supply device 104, and a board placement device 105 are provided. In addition, the component crimping apparatus 100 includes a base 106 that holds the constituent devices and constituent members, and a transfer device 107 that loads and unloads the substrate 200 with respect to the substrate placement device 105.

  The substrate placement device 105 heats the anisotropic conductive sheet 212 affixed to the surface of the substrate 200 from the lower surface side of the substrate 200 to a temperature necessary for thermocompression bonding to the support portions 101 that support the substrate 200. On the other hand, it is an apparatus for arranging the substrate 200. In the case of the present embodiment, the substrate placement apparatus 105 includes a table 151 on which the substrate 200 is placed and also holds the substrate 200 by suction, and the table 151 is arbitrarily moved in the x, y, z, and θ directions. By doing so, the position of the substrate 200 with respect to the plurality of support portions 101 can be determined. The substrate placement device 105 also includes a drive device 152 that generates power for moving the table 151.

  The component supply device 104 is a device that is arranged at a predetermined position with respect to the rotation device 103 and supplies the flexible component 201 to the pressing device 102. The component supply device 104 holds a plurality of flexible components 201 side by side, and includes a mechanism that can supply the flexible components 201 to the pressing device 102 in order.

  The rotating device 103 holds the plurality of pressing devices 102 on the same circumference, and rotates the pressing devices 102 along the circumference so that the flexible component 201 is supported on the substrate 200 supported by the plurality of supporting portions 101. It is an apparatus that is placed at a work position for thermocompression bonding. In the case of the present embodiment, the rotating device 103 holds four pressing devices 102 on the same circumference, and the flexible component received from the component supplying device 104 by rotating the index by 90 degrees in the θ direction. 201 can be transferred to the upper part of the support part 101 in order.

  FIG. 3 is a perspective view showing the support portion and the pressing device together with the flexible component and the substrate.

  The substrate 200 is a component to be crimped by the component crimping apparatus 100, and substrate-side crimping portions 210 are arranged at a plurality of locations. In the present embodiment, the substrate 200 is a touch panel and is a rectangular plate-shaped transparent member. Moreover, the board | substrate side crimping | compression-bonding part 210 is an end edge of the board | substrate 200, and is located in the both ends of this edge. An anisotropic conductive sheet 212 is attached to the upper surface of the substrate side crimping part 210.

  Here, the touch panel is a sensor that is arranged on the surface of the display and can output position data of a location where a finger or the like touches the surface of the touch panel. Therefore, transparent conductive wires are stretched around the surface of the touch panel like a mesh, and these end portions are aggregated and arranged on the substrate side crimping portion 210. For example, one board-side crimping part 210 is integrated with the ends of the conductors arranged along the x-coordinate, and the other board-side crimping part 210 is integrated with the conductors arranged along the y-coordinate. The ends are aggregated.

  Further, the anisotropic conductive sheet 212 is pressed in the thickness direction in a heated state, and the portion where the force is applied is only in the thickness direction, and the conductive particles included in the anisotropic conductive sheet 212 are in contact with each other. This is a functional member that exhibits electrical conductivity due to the pressure contact, and is otherwise maintained in an insulated state.

  The substrate 200 is not limited to a touch panel, and may be a glass substrate for a thin display device provided in a liquid crystal display or a plasma display. In addition, the substrate 200 includes all components to be crimped by those skilled in the art.

  The flexible component 201 is a flexible component to be subjected to crimping by the component crimping apparatus 100, and the component-side crimping portions 211 are located at a plurality of locations. In the case of the present embodiment, the flexible component 201 is a so-called flexible substrate, and a plurality of conductive wires are wired on a thin resin (for example, polyimide) film, so that the substrate-side crimping portion 210 of the substrate 200 is provided. The signals transmitted from the touch panel are collected in one place by being electrically connected to the ends of the electric wires that are collected on the touch panel.

  The flexible component 201 is not limited to a flexible substrate, and is a component that extends between the component-side crimping portions 211 due to heating necessary for thermocompression bonding or that the entire flexible component 201 is distorted. Thus, it includes all parts to be crimped that a person skilled in the art can conceive.

  The pressing device 102 is a device that holds the flexible component 201 and simultaneously applies a pressing force to the plurality of component-side crimping portions 211, and includes a pressing body 121, a shaft 122, and a pressing force generating device 123. ing. In the case of the present embodiment, the pressing device 102 is connected to a vacuum suction device (not shown). In addition, the pressing device 102 includes a tubular vacuum path (not shown) in which an opening is disposed in a portion of the pressing body 121 that comes into contact with the flexible component 201, and the vacuum path is evacuated by a vacuum suction device. By doing so, the flexible component 201 is attracted to the pressing body 121. As described above, the pressing device 102 can hold the flexible component 201.

  Further, the pressing device 102 can cause the shaft 122 to appear and disappear by the pressing force generating device 123 as shown by an arrow in FIG. The pressing force generator 123 is attached to the rotating device 103, and the shaft 122 has a pressing body 121 attached to the tip. From the above, the pressing device 102 lowers the pressing body 121 to attract and hold the flexible component 201 arranged in the component supply device 104 to the pressing body 121 and holds the flexible component 201 above the substrate 200. By lowering the pressed body 121 with a predetermined force, the flexible component 201 can be pressed against the substrate 200 for pressure bonding.

  The pressing body 121 is a rigid member that can hold the flexible component 201 and can apply a pressing force to a plurality of component-side crimping portions 211 that are separated by a predetermined distance. In the case of the present embodiment, the pressing body 121 is a rectangular bar-like member, and a vacuum path is provided inside. In addition, a heat insulating portion 124 that suppresses heat conduction is provided in a portion that comes into contact with the component side crimping portion 211. The heat insulating part 124 is made of a heat insulating material having rigidity sufficient to apply a pressing force necessary for thermocompression bonding. By this heat insulating part 124, the anisotropic conductive sheet 212 at the time of thermocompression bonding can be efficiently heated. Further, heat is transmitted from the anisotropic conductive sheet 212 to the pressing body 121, the pressing body 121 is heated, and the heat-insulating portion 124 indicates that the flexible component 201 held by the heated pressing body 121 is stretched or distorted. Can be suppressed.

  The pressing body 121 may further include an auxiliary holding portion 125 that holds a portion other than the component-side crimping portion 211 of the flexible component 201 so that the entire shape of the flexible component 201 is in a posture within a predetermined range.

  FIG. 4 is a perspective view showing a pressing body having an auxiliary holding portion together with a flexible part, (a) is a perspective view showing a state before holding the flexible part, and (b) is a holding state. (C) is a side view showing the holding state.

  In the pressing body 121 shown in the figure, the auxiliary holding portion 125 is extended from the intermediate portion of the main body portion 126 in a state of protruding in the orthogonal direction. Moreover, the auxiliary | assistant holding | maintenance part 125 equips the front-end | tip with the tubular bellows tube 127 (bellows) which can expand-contract and open both ends. The auxiliary holding part 125 includes a vacuum path inside, and one end of the vacuum path is connected to a vacuum path provided inside the main body part 126. The other end is connected to the bellows tube 127.

  The flexible part 201 is soft, and the shape where the other part hangs down only by holding two places, for example, as shown in FIGS. If the protrusion 213 of the flexible component 201 is bent downward and the tip hangs down simply by holding at both ends, the auxiliary holding part 125 is used as shown in FIGS. By holding the tip of the protruding portion 213 of the flexible component 201, the entire shape of the flexible component 201 is in a predetermined range, for example, substantially in a plane as shown in FIGS. It becomes possible to pay. Accordingly, the flexible component 201 is not transported in a state where the flexible component 201 bends or hangs down and a part of the flexible component 201 protrudes outside the predetermined range. And any part of the component crimping device 100 come into contact with each other and the flexible component 201 falls off, or when the flexible component 201 is crimped, the sagging portion comes into contact with the substrate 200 first. It is possible to avoid problems such as the position of 201 being shifted.

  The plurality of support portions 101 are respectively disposed at a plurality of locations corresponding to the plurality of substrate-side crimping portions 210, support the substrate from below, and resist the force received from the pressing device 102 with the substrate 200 and the flexible component 201. It is a member which has the rigidity which can crimp | crimp.

  Moreover, the support part 101 is equipped with the heating means 110 which can heat the anisotropic conductive sheet 212 to the temperature (for example, 60-80 degreeC) required for thermocompression bonding via the board | substrate 200 at the front-end | tip part. The heating means 110 is a heater made of a metal that generates heat when an electric current flows.

  In the case of the present embodiment, the support portion 101 is a prismatic member, and the two support portions 101 are fixed to the base 106 corresponding to the substrate-side crimping portions 210 located at both ends of one side of the substrate 200. Has been. In addition, a contact body 111 having high thermal conductivity and rigidity is attached to the tip of the support portion 101 than the heating means 110, and a heat insulating material 112 is provided on the opposite side of the heating means 110 from the contact body 111. Is provided. By adopting such a configuration, the support portion 101 can easily conduct heat generated by the heating means 110 only in the direction of the abutment body 111, and the opposite side of the substrate 200 (of the substrate 200) with respect to the support portion 101. It becomes possible to efficiently heat the anisotropic conductive sheet 212 disposed on the front surface side.

  Moreover, since the structure which the some support part 101 supports the board | substrate side crimping | compression-bonding part 210 of the board | substrate 200 from the back surface side is each employ | adopted, by adjusting the height which contact | abuts to the board | substrate 200 of the support part 101, respectively. It is possible to easily support the substrate 200 horizontally. The height adjustment may be performed by a screw or a wedge. Furthermore, by changing the mounting position of the support portion 101, it is possible to cope with the case where a flexible component is mounted on a substrate having a different size.

  In addition, the shape and structure of the support part 101 are not necessarily limited to the above. For example, the support part 101 may be cylindrical. Further, the plurality of support portions 101 may be configured such that a plurality of protrusions from a single member respectively support locations corresponding to the plurality of substrate-side crimping portions 210 of the substrate 200. In this case, a plurality of protrusions that support the plurality of substrate-side crimping portions 210 constitute a plurality of support portions 101. The heating means 110 may employ a ceramic heater. Since the ceramic heater can be instantly heated, the heating means 110 can be heated only for the time required for thermocompression bonding. Moreover, although the heating capability of the heating means 110 changes with objects of thermocompression bonding, for example, it is preferable to have an capability of heating the anisotropic conductive sheet 212 to about 70 to 100 degrees. Further, when heating is performed in a short time, such as a ceramic heater, it is preferable that the heating means 110 itself has an ability of about 150 degrees.

  As described above, the support portions 101 including the heating means 110 are disposed at positions on the lower surface side of the substrate 200 corresponding to the substrate-side crimping portion 210 of the substrate 200, and the anisotropic conductive sheet 212 is arranged from the lower surface of the substrate 200. Since the heating is performed individually, there is little energy loss, and the anisotropic conductive sheet 212 can be efficiently heated. On the other hand, since the pressing device 102 that holds the flexible component 201 does not include a heat source, the flexible component 201 is not heated in the process of being held and transferred by the long pressing body 121 of the pressing device 102. It can be pressed against the substrate 200. Therefore, the elongation generated in the flexible component 201 due to heat can be effectively suppressed. Further, since it is not necessary to provide the heating means 110 in the pressing device 102 that continues to rotate by the rotating device 103, there is no need to arrange an electric wire connected to the heating means 110, and the peripheral structure including the rotating device 103 and the pressing device 102 is provided. Can be simple. Further, since the pressing device 102 is not provided with a heater, the pressing device 102 can be reduced in weight, and the structure of the rotating device 103 that holds and rotates the plurality of pressing devices 102 can be simplified.

  Even when the substrate 200 is provided with the substrate-side crimping portion 210 having a different size, the support portion 101 corresponding to the size of the substrate-side crimping portion 210 can be disposed. In particular, when each is provided independently, the heat generation capability of the heating means 110 provided in each of the plurality of support portions 101 can be changed and the heat generation can be individually controlled. It is possible to heat by selecting different heating conditions. Thereby, while being able to make a thermocompression-bonding state into a suitable state, it becomes possible to save energy and to contribute to energy saving.

  Moreover, by providing the heat insulating portion 124 in the pressing body 121, it is possible to effectively suppress the pressing body 121 having a high heat capacity from being heated by heat transfer and the flexible component 201 from being stretched or distorted by the heat of the pressing body 121. . Moreover, since heat dissipation or heat transfer by the pressing body 121 during thermocompression bonding can be suppressed, it is possible to contribute to energy saving.

  The component crimping apparatus 100 further includes a camera 130 that is disposed in a region between the plurality of support portions 101 and images a mark attached to the substrate 200. In the case of the present embodiment, the camera 130 is disposed between the two support portions 101 and in the vicinity of the support portion 101.

  This structure can be realized only by arranging a plurality of independent support portions 101. Further, by adopting this structure, the mark of the substrate 200 can be confirmed in the vicinity of the substrate-side crimping portion 210, so that the position when the substrate 200 is arranged can be accurately grasped. Further, when the substrate 200 is transparent, it is possible to grasp the state of the flexible component 201 immediately before or during the crimping process.

  The component crimping apparatus 100 according to the present invention is not limited to the above-described embodiment. Another embodiment realized by arbitrarily combining the above-described components and other examples is also an embodiment of the present invention. The present invention also includes a component crimping apparatus 100 obtained by subjecting the above components to various modifications conceived by those skilled in the art without departing from the spirit of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be used for a device for thermocompression bonding a flexible component to a glass substrate constituting a display device such as a thin-screen television, a device for thermocompression bonding a flexible component to a substrate constituting a touch panel, or the like. .

100 Component Crimping Device 101 Bearing 102 Pressing Device (Crimp Head)
DESCRIPTION OF SYMBOLS 103 Rotation apparatus 104 Component supply apparatus 105 Substrate arrangement apparatus 106 Base 107 Transfer apparatus 110 Heating means 111 Contact body 121 Press body 122 Shaft 123 Pressing force generator 124 Heat insulation part 125 Auxiliary holding part 126 Main body part 127 Bellows tube 130 Camera 151 Table 152 Driving Device 200 Substrate 201 Flexible Component 210 Substrate Side Crimping Portion 211 Component Side Crimping Portion 212 Anisotropic Conductive Sheet 213 Protruding Portion

Claims (4)

A plurality of substrate-side crimping portions located at a plurality of locations on the substrate, and a plurality of flexible components located at a plurality of locations on the flexible component having flexibility, and located at locations corresponding to the plurality of substrate-side crimping portions. A component crimping device that presses the component side crimping part in a state of sandwiching the anisotropic conductive sheet, and thermocompresses each of the plurality of substrate side crimping parts and the plurality of component side crimping parts,
The lower surface portion of the substrate corresponding to the plurality of substrate-side crimping portions, having heating means arranged at a plurality of locations corresponding to the substrate-side crimping portions and capable of heating the anisotropic conductive sheet to a temperature necessary for thermocompression bonding A plurality of support parts for supporting each from below,
A pressing device having a pressing body that holds a flexible component and simultaneously applies a pressing force to a plurality of component-side crimping portions of the flexible component;
A plurality of the pressing devices are held on the same circumference, and the pressing devices are rotated along the circumference so that the flexible component is thermocompression bonded to the substrate supported by the plurality of supporting portions. A rotating device to
A component supply device that is disposed at a component supply position that is distant from a work position for thermocompression bonding to a substrate on the same circumference with respect to the rotating device, and that supplies a flexible component to the pressing device;
A substrate placement device for placing a substrate on the support portion ;
The pressing body further includes a heat insulating portion that suppresses heat conduction from the anisotropic conductive sheet on a side of the flexible component that contacts the component-side pressure bonding portion . The component pressing device according to claim 1, wherein the pressing body further includes an auxiliary holding portion that holds a portion other than the component-side crimping portion of the flexible component so that the form of the entire flexible component is within a predetermined range. . further,
The component crimping apparatus according to claim 1, further comprising a camera that is disposed in a region between the plurality of support portions and images a mark attached to the board. A plurality of substrate-side crimping portions located at a plurality of locations on the multiple substrate and a plurality of flexible components located at a plurality of locations on the flexible component having flexibility and corresponding to the plurality of substrate-side crimping portions. A component crimping method of thermocompression bonding the component side crimping part with an anisotropic conductive sheet,
Arrange the substrate by the substrate arrangement device so that the substrate-side crimping portion is located at each of the plurality of support portions arranged at multiple locations,
Support the placed board with multiple support parts,
The anisotropic conductive sheet is heated to a temperature required for thermocompression bonding by a heating means provided in a support portion that comes into contact with the substrate,
The flexible parts respectively held by the pressing bodies of the plurality of pressing devices arranged along the same circumference are rotated together with the pressing device by the rotating device to be thermocompression bonded to the substrates supported by the plurality of supporting portions. Placed in the working position,
The pressing body is anisotropic flexible component by pressing of are those comprising a heat insulating part for preventing the conduction of heat from the flexible parts anisotropic conductive sheet and the component side crimping portion to abut the side of the pressing device A component crimping method in which a plurality of substrate-side crimping portions and a plurality of component-side crimping portions are thermocompression-bonded by pressing against a substrate via a conductive conductive sheet.

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