JP2000286307A - Method and device for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately and easily adjust the flatness of a pressure-fitting tool. SOLUTION: An electronic component is placed on the electrode of a substrate, and the electronic component is pressed to the electrode by a pressure- fitting tool for mounting. Here, a heater block 13 contacts the tool, and heaters a, b, c, d, e, and f are arranged above and below the heater block 13, with each of heaters a, b, c, d, e, and f independently adjusted for temperature. Thus, thermal stress in a direction in which the flatness of a press-fitting surface improves, is produced at the press-fitting took, for correcting warping of the press-fitting surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for pressing an electronic component onto a substrate with a pressing tool.

[0002]

2. Description of the Related Art TAB (Ta) is used on a substrate such as a liquid crystal panel.
An electronic component mounting apparatus equipped with a crimping tool is used to mount an electronic component such as pe Automated Bonding) and crimp the electronic component to an electrode portion of a substrate.

A crimping tool presses an electronic component through a crimping surface formed at a lower end thereof, and a high flatness is required for the crimping surface in order to exert an even pressing force. However, when performing crimping, the crimping tool is heated to 200 ° C. or higher, and it is difficult to maintain a high flatness of the crimping surface under such a high temperature.
For this reason, in the conventional electronic component mounting apparatus, the flatness of the crimping surface is maintained by the following method.

FIG. 4 is a front view of a conventional crimping tool. In the support block 2, a through hole 2a through which a first bolt 4 penetrates and a screw portion 2b into which a second bolt 3 is screwed are arranged at a constant pitch. Are formed. The second bolt 3 is a screw portion 2
b, and the lower end thereof is in contact with the upper surface 1 b of the crimping tool 1. A nut 4a is screwed into an upper portion of the second bolt 4, and a lower end portion is screwed into a screw portion 1c formed on the upper surface of the crimping tool 1 through the through hole 2a.

If the flatness of the crimping surface 1a is not sufficient, the operator tightens a part of the large number of bolts 3 and 4 and loosens the other bolts 3 and 4, so that the crimping tool 1 is mechanically mounted. Force is applied to deform the crimping tool 1 so that the flatness is improved.

[0006]

However, such a configuration has a problem that the operator needs to turn a large number of bolts, and the adjustment is troublesome and difficult.

An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can easily and accurately adjust the flatness of a crimping tool.

[0008]

SUMMARY OF THE INVENTION An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that presses a crimping surface of a crimping tool against an electronic component preliminarily crimped on a substrate to crimp the electronic component to the substrate. The heater block is brought into contact with the crimping tool, the heaters are arranged vertically above and below the heater block, and the temperature of each heater can be adjusted independently.

The present invention also relates to an electronic component mounting method for pressing a crimping surface of a crimping tool against an electronic component preliminarily crimped to a substrate and crimping the electronic component to the substrate. The temperature difference in the thickness direction of the crimping tool in the direction is adjusted to adjust the flatness of the crimping surface in advance, and then the crimping surface of the crimping tool is pressed against an electronic component to crimp the electronic component to a substrate. Things.

[0010] With the above structure, the temperature of the heaters arranged above and below the heater block is adjusted, and a thermal stress is generated in the crimping tool so that the flatness of the crimping surface is improved, thereby correcting the warpage of the crimping surface. Here, the temperature of the heater can be electrically varied freely, and the flatness of the crimping surface can be accurately and easily maintained at a high level.

[0011]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a side view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of a heater block according to one embodiment of the present invention, and FIG. 3 is an electronic component according to one embodiment of the present invention. FIG. 4 is an operation explanatory view of the mounting apparatus. In FIG. 1, an X table 4 and a Y table 5 position the substrate 6. The electrode portion 6a of the substrate 6 is placed on a lower receiving stand 7, and an electronic component 8 is temporarily crimped on the electrode portion 6a.

Rod 1 of cylinder 9 fixed downward
A support block 11 is fixed to the lower end of the “0”.
When the cylinder 9 is operated, the support block 11 moves up and down. A crimping tool 12 having a lower end surface serving as a crimping surface 12a is attached to a lower portion of the support block 11. In addition, a heater block 13 is provided so as to contact the support block 11 and the side surface of the crimping tool 12.

Next, the heater block 13 and the like will be described with reference to FIG. Heater block 13 is upper and lower 2
Groove 13a between these two parts.
Is engraved. This is the upper and lower 2 of the heater block 13.
This is for controlling the temperatures of the two parts separately, and a heat insulating material may be inserted into the groove 13a, or the heater block 13 may be completely separated into two upper and lower parts.

In the present embodiment, heaters a, b, and d are provided in the upper half of the heater block 13 in the lower half.
e and f are respectively arranged along the longitudinal direction of the crimping tool 12. These heaters a, b, c, d, e,
f is independently and individually temperature-controlled by the temperature control unit 14 that can handle various set temperatures.

The electronic component mounting apparatus according to the present embodiment has the above-described configuration. Next, the procedure for adjusting the flatness of the crimping surface 12a in the electronic component mounting apparatus will be described with reference to FIG.

Before adjusting the flatness, the crimping surface 12a
Make sure that is convex upwards or convex downwards. Specifically, the test piece is placed on the lower support 7 and the cylinder 9 is operated to press the crimping surface 12a against the test piece.

As a result, as shown in FIG. 3A, assuming that there is an indentation S1 only near the center of the area P to be crimped, the crimping surface 12a is as shown in FIG. 3B. It can be seen that it is convex downward. In FIG. 3, the crimping surface 12a is shown as if it is extremely warped for the sake of clarity. However, in practice, the height difference between the uppermost portion and the lowermost portion of the crimping surface 12a is shown. Is about 10 μm.

In the case shown in FIG. 3B, the temperatures of the upper heaters a, b and c are increased. For example, the heaters a and c are set to 280 ° C., and the heater b is set to 260 ° C. Also, lower the temperatures of the lower heaters d, e, f (for example, 25
0 ° C). In this way, a temperature difference occurs in the thickness direction of the crimping tool 12 in a direction perpendicular to the crimping surface 12a, and the thermal stress such that the upper side of the crimping tool 12 relatively expands and the lower side relatively shrinks. Occurs and the crimping tool 1
2 is deformed in the thickness direction, and the flatness of the crimping surface 12a is improved. Such a temperature adjustment only needs to change the set value of each heater in the temperature control unit 14, and can be adjusted much more easily than when a large number of bolts are tightened or loosened, and the reproducibility is high. Adjustments can be made. Crimping tool 12
Can be easily changed by adjusting the magnitude of the temperature difference in the thickness direction.

Conversely, as shown in FIG. 3C, when indentations S2 and S3 are found at the ends of the area P to be crimped, the crimping surface 12a is moved as shown in FIG. , That is, warping upward. Therefore, the temperature of the upper heaters a, b, and c is set to be lower (for example, 250 ° C.), and the temperature of the lower heaters d, e, and f is set to be higher (for example, the heaters d and e).
If f is 280 ° C. and heater e is 260 ° C.), the reverse thermal stress acts as described above, and the warpage of the crimping surface 12a is corrected. When the warpage of the crimping surface 12a is corrected as described above, the lead of the electronic component 8 is crimped to the electrode portion 6a of the substrate 6 by the crimping tool 12.

[0020]

According to the present invention, the crimping surface of the crimping tool can be easily and accurately corrected only by changing the set temperature of each heater of the heater block.

[Brief description of the drawings]

FIG. 1 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a heater block according to the embodiment of the present invention.

FIG. 3 is an operation explanatory view of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 4 is a front view of a conventional crimping tool.

[Explanation of symbols]

 Reference Signs List 6 substrate 6a electrode section 8 electronic component 12 crimping tool 13 heater block a, b, c, d, e, f heater

Claims (5)

[Claims] 1. An electronic component mounting apparatus for pressing an electronic component onto a substrate by pressing a pressing surface of a pressing tool against an electronic component temporarily pressed on a substrate, wherein the heater block is brought into contact with the pressing tool. Wherein the heaters are arranged vertically, and the temperature of the heaters can be adjusted independently of each other. 2. The electronic component mounting apparatus according to claim 1, wherein said heater block comprises two upper and lower portions, and said heater is disposed in said upper and lower two portions. 3. The electronic component mounting apparatus according to claim 2, wherein a groove is formed between the upper and lower portions. 4. A method for mounting an electronic component using the electronic component mounting apparatus according to claim 1, wherein a pressing surface of the pressing tool is pressed against a test piece, and the pressing tool is pressed from an indentation. Make sure that the upper and lower heaters are convexly warped downward or upward, and if they are warped downward, raise the temperature of the upper heater higher than the temperature of the lower heater. The temperature of the lower heater is higher than the temperature of the upper heater,
An electronic component mounting method, wherein the flatness of the crimping surface is adjusted. 5. A method for mounting an electronic component, wherein a crimping surface of a crimping tool is pressed against an electronic component temporarily crimped on a substrate and the electronic component is crimped on the substrate, wherein the crimping is performed in a direction perpendicular to the crimping surface. The temperature difference in the thickness direction of the tool is adjusted to adjust the flatness of the crimping surface in advance, and then the crimping surface of the crimping tool is pressed against an electronic component to crimp the electronic component to a substrate. Electronic component mounting method.