JP4760615B2 - Electronic component thermocompression bonding equipment - Google Patents

Description

  The present invention relates to an electronic component thermocompression bonding apparatus that crimps an electronic component to a substrate with a crimping tool, and in particular, there is no gap between the crimping tool and a heater block disposed on the side surface, and temperature unevenness occurs at the tip of the crimping tool. The present invention relates to a thermocompression bonding apparatus for electronic parts that prevents the occurrence of the above.

  2. Description of the Related Art Conventionally, in an electronic component thermocompression bonding apparatus that presses the tip of a heated crimping tool against an electronic component and crimps the electronic component to a substrate, a plurality of height adjusting means arranged in a longitudinal direction on a fixed block are provided. The crimping tool is supported via the heater block, and the crimping tool is brought into contact with the side of the heater block fixedly supported by the fixed block to heat the crimping tool. At that time, the heater block is deformed up and down by the heat of the heater. However, it is known that the crimping tool is pressed against the side of the heater block by a spring so that the crimping tool does not slide and receive a deformation load (see, for example, Patent Document 1).

  In addition, in a thermocompression bonding equipment that heats the crimping tool by placing a heater block in contact with the side of the crimping tool, it is attached to one side of the crimping tool so that the warp deformation of the tip of the crimping tool can be corrected efficiently. A heater block that controls the tip temperature and a heater block that corrects vertical warpage are arranged in two stages, and a heater block that corrects horizontal warpage is arranged on the other side surface (for example, Patent Document 2).

In addition, the heater block is brought into contact with the side surface of the crimping tool, a plurality of heaters are arranged in the longitudinal direction and the vertical direction on the heater block, and the temperature of each heater is adjusted independently, thereby the flatness of the tip of the crimping tool. There is also known one that adjusts (see, for example, Patent Document 3).
JP 2002-26494 A JP 2002-158425 A JP-A-9-186201

  By the way, in the configuration described in Patent Document 1, the crimping tool can be slid elastically against the side of the heater block with a spring so that the heater block is thermally deformed in the vertical direction. Although it is not received, only the crimping tool and the heater block are pressed against each other with a spring, so that it is possible to prevent a small gap from being partially generated between the crimping tool and the heater block. There is a problem that heat transfer from the heater block to the crimping tool is deteriorated at that portion, and temperature unevenness occurs at the tip of the crimping tool, and the thermocompression performance is deteriorated. In addition, it is difficult to obtain a spring that can stably maintain a predetermined spring characteristic over a long period of time under a temperature condition where the tip of the crimping tool is as high as 400 ° C. There is a problem that cannot be realized.

  In addition, even in the configurations described in Patent Document 2 and Patent Document 3, there is no disclosure of a mechanism or a configuration for bringing the crimping tool into close contact with the heater block so as not to cause a gap, and the crimping tool and the heater when used at high temperatures. It is impossible to solve the problem that the blocks are thermally changed and a gap is generated between them, resulting in poor heat conduction and uneven temperature at the tip of the crimping tool.

  In any of the above patent documents, the heater block has a structure in which a hole is formed in the block body, and the heater is inserted and arranged in the hole. There was a problem that it was necessary to remove it and maintenance was troublesome.

  The present invention solves the above-described conventional problems, and does not create a gap between the crimping tool and the heater block disposed on the side surface thereof, and prevents thermal unevenness from occurring at the tip of the crimping tool. It is an object of the present invention to provide an electronic component thermocompression bonding apparatus that can be improved.

The electronic component thermocompression bonding apparatus of the present invention is an electronic component thermocompression bonding device that presses the tip of a heated crimping tool against the electronic component and crimps the electronic component to a substrate, and holds the crimping tool and the heater. And a heater block mounting means for pressing and fixing the heater block against the side surface of the crimping tool. The heater block mounting means has a horizontal inclination angle along the longitudinal direction of the crimping tool of the heater block and the crimping tool. An angle adjusting means for adjusting the vertical inclination angle along the perspective direction with respect to the tip is provided , and the angle adjusting means is provided on the both sides of the lower part of the fulcrum pressing bolt and the fulcrum pressing bolt that presses the upper center portion of the heater block against the side of the crimping tool. It consists of a pair of adjustment pressing bolts that press the heater block against the side surface of the crimping tool at positions spaced apart from each other.

  According to this configuration, even when the heater block and the crimping tool are heated to cause a thermal deformation that generates a minute gap between the side surface of the crimping tool and the contact surface of the heater block, the angle adjustment means can be used to heat the heater. By adjusting the horizontal and vertical tilt angles of the block, the heater block can be pressed against the side of the crimping tool without creating a gap, and the heat of the heater block is transferred to the crimping tool efficiently and evenly. The uniformity and flatness of the temperature distribution at the tip of the crimping tool can be improved, and the thermocompression performance can be improved.

In addition, the angle adjustment means has a fulcrum pressing bolt that presses the upper center of the heater block against the side of the crimping tool, and a pair of adjustment pressings that press the heater block against the side of the crimping tool at positions spaced on both sides of the bottom of the fulcrum pressing bolt. If the heater block is pressed against the side of the crimping tool at three points, the center of the upper part and the lower part of the heater block, the heater block can be brought into contact with the side of the crimping tool without any gaps with a simple configuration and adjustment. Can do.

  Further, the heater block mounting means supports the upper part of the heater block in a cantilever state, and when the heater block holds the heater at its lower part, the heater block can be arranged at the lower part of the side surface of the crimping tool, Since the heater is held at the bottom of the heater block, the distance between the heater and the tip of the crimping tool can be shortened, and the tip of the crimping tool can be heated efficiently and with good control responsiveness to heat it to the specified temperature. Can do.

  In addition, the heater block is attached to the side surface of the crimping tool by the heater block attachment means, and the heater is disposed between the heater arrangement plate and the heater arrangement plate opposite to the contact surface. When the heater is replaced due to damage to the heater, etc., the heater can be replaced simply by removing the clamping plate. There is no need to perform installation adjustment and the maintenance workability is greatly improved.

  Further, when the heater for correcting vertical warping of the crimping tool is disposed above the crimping tool and the heater block mounting means is disposed below the heater for correcting vertical warping, the heat of the heater block causes the mounting means to be attached. Is transmitted to the upper part of the crimping tool, but the heat transfer part is located below the vertical warp correction heater, so that the crimp tool is heated by heating the vertical warp correction heater and thermally expanding the part. When correcting the vertical warpage of the heater, the heat from the heater block is difficult to be transmitted to the vicinity of the correction heater, and the thermal expansion mainly due to the heat transferred from the heater block occurs at a lower position than that, including the warpage due to the thermal expansion. Correction can be made efficiently and with good controllability by heating the vertical warp correction heater. On the other hand, when the heater block mounting means is disposed above the vertical warp correction heater, the thermal expansion caused by the heat transferred from the heater block heats the vicinity of the vertical warp correction heater. In order to inhibit the action of correcting the vertical warping of the crimping tool by thermally expanding the portion, it is difficult to correct the vertical warping of the crimping tool by heating the heater for correcting vertical warping.

  Further, when a plurality of heater blocks and heater block mounting means are arranged in the longitudinal direction of the crimping tool, even when the crimping tool is enlarged, it is possible to easily cope by arranging the required number of heater blocks. By controlling the heating of each heater block, temperature unevenness does not occur over the entire length of the tip of the crimping tool, ensuring high uniformity of temperature distribution and flatness at the tip of the crimping tool, and high thermocompression performance Can be obtained.

  In addition, if the temperature of the heater block corresponding to the part with large heat dissipation characteristics is set high when the object to be heated has partial heat dissipation characteristics, the temperature distribution at the tip of the crimping tool is also applied to such a heating object. It is possible to maintain high thermocompression bonding performance while ensuring uniformity and flatness.

  According to the thermocompression bonding apparatus for electronic parts of the present invention, when the heater block and the crimping tool become high temperature and thermal deformation occurs causing a minute gap between the side surface of the crimping tool and the contact surface of the heater block. However, by adjusting the horizontal and vertical inclination angles of the heater block with the angle adjustment means, the heater block can be pressed against the side of the crimping tool so as to suppress the gap, and the heat of the heater block is efficiently And it can transmit to a crimping tool equally, the uniformity and flatness of the temperature distribution of the front-end | tip of a crimping tool can be improved, and thermocompression-bonding performance can be improved.

  Hereinafter, each embodiment of the thermocompression bonding apparatus for electronic parts according to the present invention will be described with reference to FIGS.

(First embodiment)
First, a first embodiment of an electronic component thermocompression bonding apparatus according to the present invention will be described with reference to FIGS. The thermocompression bonding apparatus of the present embodiment is for thermocompression bonding of a printed circuit board with electronic components such as TCP and FPC joined to a liquid crystal panel which is an example of a flat panel display (FPD).

  In FIG. 1, the thermocompression bonding apparatus 1 moves and positions in the horizontal X direction and the Y direction in a state where the liquid crystal panel 2 is received and supported at a predetermined supply position (not shown), and arbitrary X, Y The movable positioning means 3 that can be positioned at an arbitrary rotational position around the vertical axis at the position, and one side portion of the moving range of the side edge of the liquid crystal panel 2 that is supported and moved by the moving positioning means 3 The crimping means 4 is provided. The crimping means 4 includes a crimping head part 6 having a crimping tool 5 having a crimping surface 5a at the lower end, a pressurizing means 7 that drives the crimping head part 6 up and down to apply a crimping force, and is opposed to the crimping surface 5a. A crimping stage 8 that is fixedly installed below and receives and supports the crimping part from below.

  In the present embodiment, an electronic component (IC, TCP, FPC, etc.) 9 is bonded in advance to one or a plurality of side edge portions of the liquid crystal panel 2, and the thermocompression bonding apparatus 1 as shown in FIG. The electronic component 9 is thermocompression bonded to the printed circuit board 10. The printed circuit board 10 is positioned on the pressure-bonding stage 8 by component supply means (not shown) disposed on the back side (opposite to the moving positioning means 3) of the pressure-bonding stage 8 of FIG. Supplied as

  Next, the configuration of the pressure-bonding head portion 6 that is the main part of the present invention will be described with reference to FIG. The crimping head part 6 has a shape that is substantially the same length as the crimping tool 5 and has a vertically long cross-sectional shape with protruding mounting flanges 12 on both sides of the lower end, and a heat insulating material 13 is interposed in the middle part in the vertical direction. The head main body 11 is provided, and the upper end surface of the crimping tool 5 is brought into contact with the lower end surface 11 a of the head main body 11. A plurality of (three in the illustrated example) vertical warp correction heaters 14 are disposed at positions below the heat insulating material 13 of the head body 11 so as to extend over almost the entire length, and a temperature detection sensor 15 made of a thermocouple is provided in the vicinity of each central portion. Is arranged. Specifically, as shown in FIG. 3 (b), the vertical warp correction heater 14 is housed and disposed in a placement recess 16 that is recessed and formed on one side of the head body 11. It is fixed so that the heater 14 for correcting vertical warpage can be easily replaced and repaired.

  A plurality (five in the illustrated example) of mounting brackets 18 are vertically arranged at equal intervals in the longitudinal direction of the lower surface of the mounting flange 12, and the upper portion of the heater block 20 is formed by the mounting flange 12 and the mounting bracket 18. Heater block mounting means 19 is configured to support the center portion in a cantilever state and press the heater block 20 against the side surface of the crimping tool 5 and fix it. The heater block 20 is configured such that the heater 21 is sandwiched between a heater placement plate 22 and a sandwich plate 23 that are attached to the side surface of the crimping tool 5 by the heater block attachment means 19. The heater 21 is disposed, and a temperature detection sensor 24 is disposed at the lower center of the heater 21.

  Each heater block 20 is temperature-controlled by a control unit (not shown) so that the temperature detected by the temperature detection sensor 24 becomes a predetermined temperature. In addition, as shown in FIG. 2, when the shape of the printed circuit board 10 is not uniform in the longitudinal direction of the crimping tool 5 and there is a part with a large area and the heat dissipation characteristic of the part is large, the heat dissipation is performed. The heating temperature of the heater block 20 corresponding to a portion having a large characteristic is set high.

  The heater block mounting means 19 is provided with angle adjusting means 25 for adjusting the horizontal inclination angle along the longitudinal direction of the pressure bonding tool 5 of the heater block 20 and the vertical inclination angle along the perspective direction with respect to the tip of the pressure bonding tool 5. It has been. The angle adjusting means 25 is configured to place the heater block 20 on the crimping tool 5 at a position spaced from the fulcrum pressing bolt 26 that presses the upper central portion of the heater block 20 against the side surface of the crimping tool 5 and on both lower sides of the fulcrum pressing bolt 26. A pair of adjustment pressing bolts 27a, 27b pressed against the side surfaces and a tension bolt 28 for adjusting the heater block 20 in a direction away from the crimping tool 5 at an intermediate position between the pair of adjustment pressing bolts 27a, 27b.

  In this angle adjusting means 25, as shown in FIG. 4A, the crimping tool 5 with the lifting bolt 28 at the lower position in a state where the upper center portion is pressed against the side surface of the crimping tool 5 by the fulcrum pressing bolt 26. By arbitrarily adjusting the adjustment amount in the further away direction, the inclination angle α of the heater block 20 in the vertical direction along the perspective direction with respect to the crimping surface 5a at the tip of the crimping tool 5, that is, the vertical direction is adjusted. As shown in (b), the inclination angle of the heater block 20 in the horizontal direction along the longitudinal direction of the crimping tool 5 by arbitrarily adjusting the pressing amount of the pair of left and right adjustment pressing bolts 27a and 27b on both sides of the tension bolt 28. β can be adjusted.

  According to the above configuration, when the heater block 20 and the crimping tool 5 become high temperature and thermal deformation that causes a minute gap between the side surface of the crimping tool 5 and the contact surface of the heater block 20 occurs. Then, the angle adjusting means 25 press-fits the heater block 20 by adjusting the vertical inclination angle α and the horizontal inclination angle β of the heater block 20 as described in FIGS. 4 (a) and 4 (b). The tool 5 can be pressed so as not to cause a gap. Thus, the heat of the heater block 20 can be transmitted to the crimping tool 5 efficiently and uniformly, the uniformity and flatness of the temperature distribution of the crimping surface 5a of the crimping tool 5 can be improved, and the thermocompression performance is improved. Can do.

  In addition, the angle adjusting means 25 presses the heater block 20 at a position spaced apart from a fulcrum pressing bolt 26 that presses the upper center portion of the heater block 20 against the side surface of the crimping tool 5 and the lower side of the fulcrum pressing bolt 26. Since the heater block 20 is pressed against the side surface of the crimping tool 5 at three points, that is, the upper center portion and the lower side of the heater block 20, a simple structure is provided. The heater block 20 can be brought into contact with the side surface of the crimping tool 5 without any gap in the configuration and adjustment operations.

  Further, the heater block mounting means 19 is configured to support the upper part of the heater block 20 in a cantilever state, and the heater block 20 is configured to hold the heater 21 at the lower part thereof. Since the heater 21 is held at the lower part of the heater block 20, the distance between the heater 21 and the crimping surface 5a at the tip of the crimping tool 5 can be shortened, and the crimping surface 5a Can be heated efficiently to a predetermined temperature with good control response.

  In addition, since the heater block 20 is sandwiched between the heater placement plate 22 and the sandwiching plate 23 that are attached to the side surface of the crimping tool 5 by the heater block mounting means 19, When the heater 21 is replaced, only the heater 21 can be easily replaced by removing the clamping plate 23. Thus, there is no need to perform attachment / adjustment work associated with the attachment / detachment of the heater block 20 as in the case where the heater block 20 is replaced, and maintenance workability is greatly improved.

  Further, as shown in FIG. 5A, the heater block mounting means 19 is disposed below the vertical warp correction heater 14 of the crimping tool 5, so that the heat of the heater block 20 passes through the mounting means 19. As shown by the arrow 29, the heat is transmitted to the upper part of the crimping tool 5, but since the heat transfer part is located below the vertical warp correction heater 14, the vertical warp correction heater 14 is heated to heat the part. When the vertical warping of the crimping surface 5a is corrected by expanding, the thermal expansion due to the heat transferred from the heater block 20 occurs at a lower position than that, and as shown in FIG. 5B, the heater block 20 The thermal expansion due to the heat transferred from the plate acts so as to cause a deformation that pulls up both ends of the crimping surface 5a. On the other hand, the vertical warpage correction heater 14 is heated and thermally expanded. Te, can be efficiently and with good controllability correction including warping due to thermal expansion of the heater block 20. On the other hand, as shown in FIG. 6A, when the heater block mounting means 19 is disposed above the up / down warp correction heater 14, the heat of the heater block 20 passes through the mounting means 19 and the arrow 30. As shown in FIG. 6B, the thermal expansion due to the heat transmitted from the heater block 20 causes deformation that pushes down both ends of the crimping surface 5a. In contrast to this, even if an attempt is made to correct the vertical warp of the crimping surface 5a by heating the vertical warp correction heater 14 to thermally expand the portion, the correction action is hindered, so the vertical warp correction is performed. It becomes difficult to correct the vertical warping of the pressure-bonding surface 5a by the heating of the heater 14.

  In addition, since a plurality of heater blocks 20 and heater block mounting means 19 are arranged in the longitudinal direction of the crimping tool 5, even when the crimping tool 5 is enlarged, the required number of heater blocks 20 should be arranged. By controlling the heating of each heater block 20, the temperature unevenness of the crimping surface 5a at the tip of the crimping tool 5 does not occur over the entire length, and the temperature distribution on the crimping surface 5a is uniform. Flatness can be improved and thermocompression bonding performance can be improved.

  Further, when the printed circuit board 10 having a large area is partially crimped along the longitudinal direction of the crimping tool 5, the temperature of the heater block 20 corresponding to the portion having a large area and a large heat dissipation characteristic is set high. Therefore, even when such a printed circuit board 10 is pressure-bonded, it is possible to maintain high thermocompression bonding performance by ensuring uniformity and flatness of the temperature distribution of the pressure-bonding surface 5a of the pressure-bonding tool 5 at the time of pressure bonding.

(Second Embodiment)
Next, a second embodiment of the component mounting apparatus of the present invention will be described with reference to FIG. In the description of the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only differences are mainly described.

  In the above embodiment, the angle adjusting means 25 is exemplified by the fulcrum pressing bolt 26, the pair of adjusting pressing bolts 27a and 27b, and the tension bolt 28. However, in this embodiment, FIG. ) To (d), the fulcrum pressing bolt 31 and a pair of adjustment pressing bolts 32a and 32b are used. The heater block 20 is brought into contact with the side surface of the crimping tool 5 so as not to generate a gap between them.

  In the angle adjusting means 25 of the present embodiment, only the three positions of the heater block 20 are pressed by three pressing bolts, and each heater block 20 is removed in a state where the crimping tool 5 is removed for replacement or the like. As shown in FIG. 7D, a press-fit engagement portion 33 is provided at the tip of the fulcrum pressing bolt 31 and press-fitted at the upper center position of the heater arrangement plate 22 of the heater block 20 as shown in FIG. By providing the recess 34 into which the engaging portion 33 is fitted, the heater block 20 is held by the fulcrum pressing bolt 31.

  In the present embodiment, since the angle adjusting means 25 is composed of only three pressing bolts, the number of parts is small and the adjustment work is easy.

  In the above description of the embodiment, the thermocompression bonding apparatus of the present invention is applied to a case where an electronic component 9 such as TCP or FPC joined to a flat panel display such as the liquid crystal panel 2 is thermocompression bonded to the printed circuit board 10. However, the present invention is not limited to this, and can naturally be applied in the same way to thermocompression bonding of electronic components such as IC, TCP, and FPC on a flat panel display. The present invention can also be suitably applied when electronic parts are thermocompression bonded.

  According to the thermocompression bonding apparatus for electronic parts of the present invention, when the heater block and the crimping tool become high temperature and thermal deformation occurs causing a minute gap between the side surface of the crimping tool and the contact surface of the heater block. However, by adjusting the horizontal and vertical inclination angles of the heater block with the angle adjustment means, the heater block can be pressed against the side of the crimping tool without creating a gap, and the heat of the heater block can be efficiently It can be transmitted evenly to the crimping tool, the uniformity and flatness of the temperature distribution at the tip of the crimping tool can be improved, and the thermocompression performance can be improved. It can utilize suitably for a crimping | compression-bonding apparatus.

The perspective view which shows the whole schematic structure of 1st Embodiment of the thermocompression bonding apparatus of the electronic component of this invention. The perspective view which expanded and showed the principal part of the same embodiment. The detailed structure of the principal part of the embodiment is shown, (a) is a front view, (b) is an AA arrow enlarged sectional view of (a), (c) is a partial enlarged view of (a). The angle adjustment method in the embodiment is shown, (a) is a BB arrow sectional view of FIG. 3 (c), (b) is a CC arrow sectional view of FIG. 3 (c). It is explanatory drawing of the curvature adjustment of the crimping head in the embodiment, (a) is sectional drawing similar to FIG.3 (b), (b) is explanatory drawing of an adjustment state. It is explanatory drawing of the curvature adjustment of the crimping head at the time of setting it as the structure different from the embodiment, (a) is sectional drawing similar to FIG.3 (b), (b) is explanatory drawing of an unadjustable state. The angle adjustment means in 2nd Embodiment of the thermocompression bonding apparatus of the electronic component of this invention is shown, (a) is a front view, (b) is DD sectional view taken on the line of (a), (c) is ( The EE arrow sectional drawing of a), (d) is F section enlarged detail drawing of (c).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thermocompression bonding apparatus 5 Crimping tool 5a Tip crimping surface 9 Electronic component 10 Printed circuit board 14 Vertical warp correction heater 19 Heater block mounting means 20 Heater block 21 Heater 22 Heater arrangement plate 23 Holding plate 25 Angle adjustment means 26 Supporting point pressing bolt 27a 27b Adjusting push bolt 31 Supporting point push bolt 32a, 32b Adjusting push bolt

Claims (6)

An electronic component thermocompression bonding apparatus that presses the tip of a heated crimping tool against an electronic component and crimps the electronic component to a substrate, the crimping tool, a heater block holding a heater, and the heater block of the crimping tool. A heater block mounting means that is pressed against the side surface and fixed. The heater block mounting means has a horizontal inclination angle along the longitudinal direction of the crimping tool of the heater block and a vertical tilt angle along the perspective direction with respect to the tip of the crimping tool. The angle adjustment means crimps the heater block at positions spaced apart on both sides of the lower part of the fulcrum pressing bolt and the fulcrum pressing bolt that presses the upper center of the heater block against the side of the crimping tool. thermocompression bonding apparatus that electronic components to characterized by comprising a pair of adjusting the pressing bolt for pressing the tool side. Heater block mounting means supports the upper portion of the heater block in cantilever fashion, the heater block thermocompression bonding apparatus for an electronic component according to claim 1 Symbol mounting, characterized in that holding the heater in its lower part. The heater block is mounted in contact with the side surface of the crimping tool by the heater block mounting means, and the heater arrangement plate having the heater disposed on the opposite side of the contact surface and the heater is sandwiched between the heater arrangement plate thermocompression bonding apparatus for an electronic component according to claim 1 or 2, characterized in that constituted by a plate. Vertical warp correction heater crimping tool is disposed above the bonding tool, the heater block mounting means, according to any one of claims 1 to 3, characterized in that from the top and bottom warp correction heater disposed below Electronic parts thermocompression bonding equipment. Heater block and the heater block mounting means, the thermocompression bonding device for an electronic component according to any one of claims 1-4, characterized in that it is more arranged in the longitudinal direction of the crimping tool. 6. The thermocompression bonding apparatus for an electronic component according to claim 5 , wherein, in the case of a heating object having a partly large heat radiation characteristic, the temperature of the heater block corresponding to the part having a large heat radiation characteristic is set high.

Images