JP3070464B2 - Thermocompression bonding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a thermocompression bonding apparatus. In particular, LCD panels and TAB (Tape AutomatedBondin
g) is temporarily press-bonded through an anisotropic conductive adhesive sheet (ACF) to form a pressure-bonded body, and the pressure-bonded body is heated and pressed by a thermocompression bonding head to completely press-bond the liquid crystal panel and TAB. In this case, the present invention relates to a thermocompression bonding apparatus capable of strictly adjusting the degree of parallelism of a thermocompression bonding surface of a thermocompression bonding head with respect to a body to be compressed.

[0002]

2. Description of the Related Art A liquid crystal panel and a TAB are preliminarily pressure-bonded through an anisotropic conductive adhesive sheet to form a pressure-bonded body, and the pressure-bonded body is heated and pressed by a thermocompression head to form a liquid crystal panel and a TAB. When bonding the LCD panel to the IC, connecting the rigid or film-like substrate to the TAB, mounting the IC on the rigid or film-like substrate, and mounting the semiconductor element to various other circuit boards. In the case of mounting or the like, an apparatus 100 as shown in FIG. 10 is used as a heating / pressing apparatus for the adhered pressure body.

[0003] A thermocompression bonding apparatus 100 shown in FIG. 1 includes a stage 2 on which a body 1 to be pressed is mounted, and a body 1 to be mounted on the stage 2.
And a support 4 for supporting the thermocompression head 3. Here, the thermocompression bonding head 3 and the support body 4 are integrated to form a head unit 5 that cannot be easily separated. The support 4 is connected to a cylinder 7 via a linear motion guide 6, and the operation of the cylinder 7 causes the thermocompression bonding head 3 supported by the support 4 to move up and down. A heater 8 passes through the inside of the thermocompression bonding head 3,
A temperature sensor (not shown) is also attached so that the thermocompression bonding head 3 is heated to a predetermined temperature.

In the thermocompression bonding apparatus 100, the thermocompression bonding head 3 may need to be replaced depending on the shape and size of the body 1 to be pressed. On the other hand, in such a thermocompression bonding apparatus, the degree of parallelism between the thermocompression bonding surface 3a of the thermocompression bonding head 3 and the surface 1 of the stage 2 (stage surface 2a) with respect to the body 1 is more appropriately adjusted. The body can be thermo-compressed.

Therefore, the thermocompression bonding apparatus 100 shown in FIG.
In, when the thermocompression bonding head 3 is replaced, the entire head unit 5 is replaced. Further, in this case, the parallelism between the thermocompression bonding surface 3 and the stage surface 2a can be obtained more accurately by improving the processing accuracy and the assembly accuracy of the apparatus.

As a conventional thermocompression bonding apparatus, FIG.
Is also known. FIG. 12 is a side view of the vicinity of the thermocompression bonding head 3 of the apparatus 101. This apparatus 101 is also similar to the thermocompression bonding apparatus 100 shown in FIG.
The thermocompression bonding head 3 supported by the support 4 moves up and down by the action of the cylinder 7, and
The thermocompression bonding head 3 is made detachable from the support 4 in order to facilitate the exchange of the thermocompression bonding head 3. That is, the thermocompression bonding head 3 has a rotary shaft 9 in a direction orthogonal to the axial direction, while the support 4 has a U-shaped holding portion 4h for holding the thermocompression bonding head 3 and a rotary shaft receiving hole 4i. The rotary shaft 9 of the thermocompression bonding head 3 is fitted into the hole 4i of the support 4 so that the thermocompression bonding head 3 is engaged with the U-shaped holding portion 4h of the support 4. In this case, as a method of fixing the thermocompression bonding head 3 to the support 4 while keeping the thermocompression bonding surface 3a parallel, the rotating shaft 9 of the thermocompression bonding head 3 is attached to the support 4.
After that, the thermocompression bonding surface 3a of the thermocompression bonding head 3 is made parallel to the stage surface 2a in that state, and then the tightening screw 10 attached to the support 4 is tightened with a wrench 1
Using a tool such as 1 or the like, the U-shaped holding portion 4h is tightened by turning as shown by the arrow, and the thermocompression bonding head 3 is fixed.

As a conventional thermocompression bonding apparatus, FIG.
As shown in FIG. 2, there is also known one in which a rotation adjusting mechanism 13 using a bearing 12 is provided on a support 4 in order to make the thermocompression bonding surface 3a and the stage surface 2a parallel. When such a rotation adjusting mechanism 13 is provided, the thermocompression bonding head 3 rotates in the direction of the arrow around the bearing 12 and
Since a tends to become horizontal naturally, it becomes easier to make the thermocompression bonding surface 3a and the stage surface 2a parallel to each other as compared with the apparatus shown in FIG.

[0008]

However, among the conventional devices, in the device shown in FIG. 10, the parallelism between the thermocompression bonding surface 3a and the stage surface 2a depends on the processing accuracy and assembly accuracy of the device. , Thermocompression bonding surface 3a and stage surface 2a
There is a problem that it is difficult to strictly adjust the thermal compression head 3 in parallel, and there is no means for adjusting particularly the thermal deformation of the thermal compression head 3 and the support 4 when the thermal compression head 3 is heated. There was a problem.

In the apparatus shown in FIG. 11, the thermocompression bonding head 3 is hooked on the U-shaped holding portion 4h, and then the thermocompression bonding surface 3a is made parallel to the stage surface 2a. In order to fix the head 3 to the support 4, as shown in FIG.
0, the thermocompression bonding head 3 is tightened by the U-shaped holding portion 4h, and the tightening torque moment M causes the thermocompression bonding head 3 to rotate from the initial adjustment position as shown by the arrow in FIG. The degree of parallelism of the crimping surface 3a is changed. Therefore, there is a problem that the parallelism between the thermocompression bonding surface 3a and the stage surface 2a cannot be strictly adjusted.

In the apparatus shown in FIG. 13, a rotation adjusting mechanism 13 is provided to make the thermocompression bonding surface 3a and the stage surface 2a parallel.
However, the rotation adjustment mechanism 13 using the bearing 12 has a problem that the adjustment range is large and the adjustment accuracy is too coarse to perform fine adjustment. Further, pressure is applied to the rotation adjustment mechanism 13 during thermocompression bonding. Thus, there has been a problem that the size of the gap between the bearings 12 changes and the parallelism goes wrong.

An object of the present invention is to solve the above-mentioned problems of the prior art, and to provide a thermocompression-bonded body of a liquid crystal panel, an anisotropic conductive adhesive sheet, and a TAB. It is an object of the present invention to enable a parallelism between a thermocompression bonding surface and a stage surface to be strictly adjusted in a compression bonding device.

[0012]

Means for Solving the Problems The present inventors have developed a stage on which a body to be compressed is mounted, a thermocompression head for heating and pressing the body to be compressed mounted on the stage, and a support for supporting the thermocompression head. In the thermocompression bonding apparatus having (i) the parallelism between the thermocompression bonding surface and the stage surface can be finely adjusted by providing a parallelism adjusting means using a wedge mechanism on the support, (i)
i) Similarly, by providing a parallelism adjusting means using a wedge mechanism on the stage, the parallelism between the thermocompression bonding surface and the stage surface can be finely adjusted. (iii) In addition, the thermocompression bonding head is fixed to the support. In order to complete the present invention, it has been found that a thermocompression bonding head can be fixed at an initial adjustment position by using a clamp mechanism including an eccentric cam without using a tightening screw for generating a torque moment M. Reached.

That is, the present invention provides, as a first invention,
In a thermocompression bonding apparatus having a stage on which a body to be compressed is mounted, a thermocompression bonding head for heating and pressing the body to be mounted mounted on the stage, and a support for supporting the thermocompression bonding head, a thermocompression bonding surface of the thermocompression bonding head and a stage surface Parallelism adjusting means for finely adjusting the parallelism with the wedge mechanism is provided on the support .
Wherein the parallelism adjusting means has a V-shaped groove.
To move in the V-shaped groove in the V-shaped depth direction.
A movable member for changing the opening of the V-shaped groove, and a screw
A movable member that moves the movable member in the V-shaped depth direction
From the moving screw and the backing plate fixed to the moving member moving screw
Wherein the movable member moving screw has a V-shaped groove
It is provided without touching the
In the interior space so that it does not contact the side walls of the space.
The present invention provides a thermocompression bonding device characterized by being provided as follows .

In particular, such a thermocompression bonding apparatus is as follows : (a) The movable member is a wedge that comes into surface contact with the groove surface of the V-shaped groove of the bracket, and is determined according to the position of the wedge in the V-shaped groove. An aspect in which fixing means for fixing the degree of opening of the V-shaped groove is provided; (b) a movable member, a sphere that makes point contact with the groove surface of the V-shaped groove of the bracket, and the sphere is held; An aspect comprising a sphere holding member screwed to the moving screw,
(c) a bracket having a V-shaped groove, an upper bracket forming one groove surface of the V-shaped groove, a lower bracket forming the other groove surface of the V-shaped groove, an upper bracket and a lower bracket; And a pressure bolt for pressing each other.
At the joint between the upper bracket and the lower bracket, a V-shaped small groove is provided to face the upper bracket and the lower bracket, respectively, and a round shaft passes through a hollow portion formed by the opposed V-shaped small grooves. Are provided.

According to a second aspect of the present invention, there is provided a thermocompression-bonding head having a stage for mounting a body to be compressed, a thermocompression head for heating and compressing the body to be mounted on the stage, and a support for supporting the thermocompression head. In the crimping device, a parallelism adjusting means for finely adjusting the parallelism between the thermocompression bonding surface of the thermocompression bonding head and the stage surface by a wedge mechanism is provided on the stage ,
A bracket having a V-shaped groove;
By moving in the V-shaped groove in the V-shaped depth direction,
A movable member that changes the opening of the V-shaped groove, and
Movable member moving the movable member in the V-shaped depth direction
Screws and a backing plate fixed to the movable member moving screw.
The movable member moving screw is a bracket having a V-shaped groove.
Is installed without contacting the
In a space that does not contact the side walls of the space
It is provided to provide a thermocompression bonding apparatus according to claim.

According to a third aspect of the present invention, there is provided a thermocompression bonding apparatus having a stage for mounting a body to be compressed, a thermocompression head for heating and pressing the body to be mounted on the stage, and a support for supporting the thermocompression head. The body has a U-shaped holding section for hooking the thermocompression bonding head, and the thermocompression head locked on the U-shaped holding section is fixed to the U-shaped holding section. A clamping mechanism comprising an eccentric cam and a fine screw, which tightens the thermocompression bonding head.
The fine screw and the eccentric cam
However, the rotational moment of the eccentric cam is in the axial direction of the fine screw.
Provided is a thermocompression bonding apparatus, wherein the thermocompression bonding apparatus is connected so as not to be in a rotation direction about a center.

According to the first aspect of the present invention, since the support is provided with the parallelism adjusting means by the wedge mechanism, the parallelism of the thermocompression bonding surface to the stage surface can be finely adjusted. The parallelism adjusting means includes a bracket having a V-shaped groove, a movable member for changing the opening of the V-shaped groove by moving in the V-shaped groove in the depth direction of the V-shaped groove, and a screw on the movable member. And a movable member moving screw for moving the movable member in the V-shaped depth direction. Here, the movable member moving screw is provided without contacting the bracket having the V-shaped groove. Thus, even when the thermocompression bonding head is heated and the heat causes the movable member moving screw to thermally expand, the position of the movable member in the V-shaped groove is not changed, so that the degree of opening of the V-shaped groove is reduced. In addition, the initially set parallelism can be stably maintained regardless of the heating state of the thermocompression bonding head.

In the present invention, the movable member used for the parallelism adjusting means is a wedge that comes into surface contact with the groove surface of the V-shaped groove of the bracket, or a sphere that comes into point contact with the groove surface of the V-shaped groove. The one held by the sphere holding member can be used, but by using the latter sphere as the movable member, it becomes possible to more easily and precisely adjust the opening of the V-shaped groove.

In the second aspect of the present invention, the parallelism adjusting means by such a wedge mechanism is provided on the stage. By adjusting the parallelism of the stage surface with respect to the thermocompression bonding surface, it is also possible to adjust the parallelism between the thermocompression surface and the stage. The degree of parallelism with the plane can be strictly adjusted.

According to the third aspect of the present invention, the support has a U-shaped holding portion for hooking the thermocompression head, and the thermocompression head fixed to the U-shaped holding portion is fixed. For this purpose, a clamp mechanism including an eccentric cam is provided. According to this clamp mechanism, even if the eccentric cam is rotated when fixing the thermocompression bonding head to the support, the rotation moment of the eccentric cam rotates the thermocompression bonding head around the rotation shaft of the thermocompression bonding head. Can be prevented. Therefore, when fixing the thermocompression bonding body to the support,
The problem that the thermocompression bonding body rotates from the initial adjustment position and the parallelism of the thermocompression bonding surface is out of order can be solved.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. In the drawings including the above-described conventional example, the same reference numerals represent the same or equivalent components.

FIG. 1 is an explanatory view of one embodiment of the thermocompression bonding apparatus of the present invention. Similar to the thermocompression bonding apparatus 101 shown in FIG. 11, the thermocompression bonding apparatus 200 is thermocompression-bonded by a stage 2 on which the object 1 is placed, a thermocompression bonding head 3 having a built-in heater 8, and a U-shaped holding section 4h. The thermocompression bonding head 3 has a support 4 for holding the head 3, a linear motion guide 6 connected to the support 4, and a cylinder 7. By fitting into the shaft receiving hole 4i provided in the shaft receiving portion 4h, the U-shaped holding portion 4h
Hooked inside.

However, in the thermocompression bonding apparatus 200, first, the support 4 is provided with the parallelism adjusting means 20A by a wedge mechanism, and second, the U-shaped holding of the support 4 is performed. As a means for fixing the thermocompression bonding head 3 hooked on the portion 4h, a clamp mechanism 40 composed of an eccentric cam is provided. Third, a parallelism adjusting means 60 by a wedge mechanism is also provided on the stage. It is characterized by having.

Next, a description will be given of the parallelism adjusting means using a wedge mechanism and a clamp mechanism including an eccentric cam, which are characteristic of the thermocompression bonding apparatus of the present invention.

FIG. 2A is a perspective view of the parallelism adjusting means 20A provided on the support 4, and FIG. 2B is a sectional view thereof. The parallelism adjusting means 20A shown in the figure includes a bracket 21 having a V-shaped groove A (opening angle α = about 5 °).
And a wedge 22 and a wedge moving screw 23.

In this case, the wedge 22 has a V-shaped groove A
Opening of V-shaped groove B by moving in the depth direction x of the character
Is thereby provided as a movable member for rotating the thermocompression bonding surface 3a of the thermocompression bonding head 3 in the direction of arrow β in FIG. The wedge 22 is in surface contact with the groove surface 21 a of the V-shaped groove of the bracket 21, and can move within the range of the distance C along the guide 24 formed on the bracket 21. In addition, pressure is always applied to the bracket 21 in the direction of closing the opening B of the V-shaped groove by the flat screw 25. Therefore, even when the wedge 22 moves in the V-shaped groove A, the surface contact between the wedge 22 and the groove surface 21 a of the V-shaped groove of the bracket 21 is maintained.

The wedge moving screw 23 is screwed with the wedge 22, but is provided without directly contacting the bracket 21. A handle 26 is provided at an end of the wedge moving screw 23, and a backing plate 27 is fixed in a space D formed inside the bracket 21. Therefore, by turning the handle 26, the wedge moving screw 23 also rotates, and the wedge 22 moves in the x direction.

Inside the bracket 21, the space D
In addition, a space E is also formed as shown.

As a method of adjusting the parallelism between the thermocompression bonding surface 3a of the thermocompression bonding head 3 and the stage surface 2a of the stage 2 using the parallelism adjusting means 20A, first,
By turning the handle 26, the wedge 22 is moved in the X-direction within the V-shaped groove A of the bracket 21, thereby changing the opening B of the V-shaped groove, that is, rotating the thermocompression bonding surface 3a in the β direction. The size is adjusted so that the thermocompression bonding surface 3a and the stage surface 2a are parallel (see FIG. 1). In this case, the moving distance of the wedge 22 can be finely adjusted by reducing the screw pitch between the wedge 22 and the wedge moving screw 23 that are screwed together, and therefore, the opening B of the V-shaped groove can also be finely adjusted. Can be.

After adjusting the opening B of the V-shaped groove in this way, the size of the adjusted opening B of the V-shaped groove is fixed. As a fixing method in this case, the handle 26 is rotated in a direction opposite to the direction in which the handle 26 is turned at the time of adjusting the opening B of the V-shaped groove, and the abutment plate 27 is
1 so as not to come into contact with the side walls 21d1 and 21d2 of the space D. For example, the backing plate 27 and the side walls 21d1, 21d of the space D
The gaps F1 and F2 with d2 are set to be about 0.1 to 0.5 mm. Then, the size of the opening B of the V-shaped groove is fixed by the fixing bolt 28. Thereby, the thermocompression bonding head 3
The parallelism between the thermocompression bonding surface 3a and the stage surface 2a of the stage 2 can be accurately adjusted.

That is, according to the parallelism adjusting means 20A, the thermocompression bonding bed 3 is heated at the time of thermocompression bonding, so that even if heat is transmitted to the parallelism adjusting means 20A, there is a space D in the bracket 21. So the wedge moving screw 23
Does not change the position of the wedge 22 even if the yoke extends in the x direction due to thermal expansion. Therefore, it is possible to greatly suppress the deviation of the parallelism during thermocompression bonding.

Further, since the V-shaped groove A, the space E, and the space D are formed inside the bracket 21 to promote the heat radiation of the bracket, the bracket 21 and the inside of the bracket 21 are formed. Thermal expansion of the provided wedge 22 and wedge moving screw 23 is suppressed. Therefore, this also makes it possible to further suppress the deviation of the parallelism during thermocompression bonding.

From the viewpoint of suppressing the deviation of the parallelism at the time of thermocompression bonding, it is preferable that the wedge 22, the wedge moving screw 23 and the bracket 21 are formed of the same material. Thereby, even if they are thermally expanded at the time of thermocompression bonding, the degree of expansion becomes uniform, so that it is possible to further suppress the deviation of the parallelism.

The parallelism adjusting means 20A provided on the support 4 of the thermocompression bonding apparatus 200 shown in FIG. 1 has been described above. In the present invention, the parallelism adjusting means shown in FIG. Means 20B can also be used. As with the parallelism adjusting means 20A shown in FIG. 2, the parallelism adjusting means 20B of FIG. 3 also moves the bracket 21 having the V-shaped groove A and the inside of the V-shaped groove A in the V-shaped depth direction x. This has a movable member for changing the opening B of the V-shaped groove and a screw 23 for moving the movable member, and is the same as a parallelism adjusting means using a wedge mechanism.

However, as a movable member, the bracket 21
Instead of a wedge that makes surface contact with the groove surface 21a of the V-shaped groove A, a sphere 30 is used. The sphere 30 is held by a sphere holding member 31, and the sphere holding member 31 is screwed with the sphere moving screw 23. The difference is that the sphere holding member 31 moves along the guide 32 by the rotation of the sphere moving screw 23.

By using the spherical body 30 as the movable member, the opening B of the V-shaped groove can be adjusted more smoothly, and the parallelism between the thermocompression bonding surface 3a and the stage surface 2a can be adjusted more accurately. Can be adjusted.

The parallelism adjusting means 20B is also different in that the bracket 21 is composed of an upper bracket 21x and a lower bracket 21y, which are joined via a round shaft 33. That is, V-shaped small grooves Gx and Gy are provided opposite to each other at the joint between the upper bracket 21x and the lower bracket 21y, and the round shaft 33 is formed in the hollow formed by the opposed V-shaped grooves Gx and Gy. Is passing. And the upper bracket 21
x, lower bracket 21y and round shaft 33 are shown in FIG.
In the cross-sectional view of FIG.
It contacts and adheres at a total of four points of x and Gy. By joining the upper bracket 21x and the lower bracket 21y using the round shaft 33 and the V-shaped grooves Gx and Gy as described above, the upper bracket 21x and the lower bracket 2 are joined together.
As compared with the case where 1y is joined using a bearing or the like, there is no deviation due to the gap between the inner ring and the outer ring inside the bearing, so that the parallelism between the thermocompression bonding surface 3a and the stage surface 2a is stably and accurately adjusted. It is possible to do.

A pressing bolt 35 fitted with a spring 34 is provided on the bracket of the parallelism adjusting means 20B shown in FIG.
1x and lower bracket 21y are pressed together. Therefore, in order to adjust the parallelism between the thermocompression bonding surface 3a and the stage surface 2a using the parallelism adjusting means 20B, the spherical body 30 is moved to adjust the opening B of the V-shaped groove, and then the opening B is adjusted. No means is required to fix Therefore, the parallelism adjusting means 20B in FIG. 3 does not include a fixing means corresponding to the fixing bolt 28 of the parallelism adjusting means 20A in FIG.

When such a parallelism adjusting means 20B is provided in the thermocompression bonding apparatus, the positional relationship between the parallelism adjusting means 20B and the thermocompression bonding head 3 is as follows.
It is preferable to arrange the thermocompression bonding surface 3a so as to be located in the direction H1 directly below the B round shaft 33. As a result, the opening B of the V-shaped groove once adjusted is smaller than that in the case where the thermocompression bonding surface 3a is located in the direction H2 just below the point closer to the sphere 30 from the round shaft 33. It will be maintained more stably without changing from time to time.

In the thermocompression bonding apparatus 200 shown in FIG. 1, an example is shown in which one parallelism adjusting means 20A is provided on the support 4; however, in the present invention, a plurality of parallelism adjusting means are provided in parallel. Can be. For example, the thermocompression bonding apparatus 20 shown in FIG.
As shown in FIG. 1, two parallelism adjusting means 20A1 and 20A2 similar to the parallelism adjusting means 20A shown in FIG. 2 are provided on the support 4 of the thermocompression bonding apparatus 200 shown in FIG. Can be provided. This makes it possible to rotate the direction of the thermocompression bonding surface 3a in the β1 direction and the β2 direction orthogonal to each other.
a can be more strictly parallel to the stage surface 2a.

When a plurality of parallelism adjusting means are provided on the support 4, the same kind of parallelism adjusting means may be used, or different kinds of parallelism adjusting means may be used in combination. For example, as shown in FIG. 4, two parallelism adjusting means 20A of FIG. 2 may be combined, or two parallelism adjusting means 20B of FIG. 3 may be combined. 20A and the parallelism adjusting means 20B of FIG. 3 may be combined.

Next, the parallelism adjusting means provided on the stage of the thermocompression bonding apparatus of the present invention will be described.

In the thermocompression bonding apparatus of the present invention, for example, as shown in the thermocompression bonding apparatus 200 of FIG.
In addition, a parallelism adjusting means 60 using a wedge mechanism can be provided. The parallelism adjusting means 60 is provided with the support 4 described above.
And a parallelism adjusting means using a wedge mechanism similar to the parallelism adjusting means 20A in FIG. 2 and the parallelism adjusting means 20B in FIG. Can be provided. In the stage parallelism adjusting means 60, the heat transfer from the thermocompression bonding head does not matter as compared with the parallelism adjusting means of the support. Therefore, for example, like the parallelism adjusting means 20A in FIG. It is not always necessary to form a large space for heat dissipation in the bracket.

The thermocompression bonding surface 3 of the parallelism adjusting means 60
In order to adjust the parallelism between the a and the stage surface 2a, the movable member in the V-shaped groove is moved by appropriately rotating the handle 61, thereby changing the opening I of the V-shaped groove and changing the stage surface 2a to γ. This is done by rotating in the direction.

When the parallelism adjusting means 60 is provided on the stage 2, the stage 2 may be provided with a single or plural parallelism adjusting means, similarly to the case where the parallelism adjusting means is provided on the support 4. The parallelism adjusting means used when a plurality of parallelism adjusting means are provided may be of the same type or different types. Therefore, for example, as shown in FIG. 5, two parallelism adjusting means 60A1 and 60A2 substantially similar to the parallelism adjusting means 20A of FIG. 2 can be provided so that the moving directions of the wedges are orthogonal to each other. . Thus, the direction of the stage surface 2a can be rotated in the γ1 direction and the γ2 direction orthogonal to each other, and the parallel between the thermocompression bonding surface 3a and the stage surface 2a can be more strictly set.

Next, a clamp mechanism including an eccentric cam provided in the thermocompression bonding apparatus of the present invention will be described in detail.

In the thermocompression bonding apparatus of the present invention, for example, as shown in the thermocompression bonding apparatus 200 of FIG. 1, the thermocompression bonding head 3 hooked on the U-shaped holding portion 4h of the support 4 is tightened. As a fixing means, a clamp mechanism 40 composed of an eccentric cam can be provided. FIG. 6A is an explanatory view of the vicinity of the clamp mechanism 40 as viewed from the front, and FIG. 6B is an explanatory view of components of the clamp mechanism 40.

In this clamping mechanism 40, the thermocompression bonding head 3 hooked on the U-shaped holding portion 4h of the support 4 is fixed. Here, the method of locking the thermocompression bonding head 3 is shown in FIG.
2 is similar to the conventional example. That is, the thermocompression bonding head 3 has a rotating shaft 9 in a direction orthogonal to the axial direction, while the support 4 has a rotating shaft receiving hole 4i in a U-shaped holding portion 4h, When the rotary shaft 9 of the head 3 is fitted into the hole 4i of the U-shaped holder 4h of the support 4, the thermocompression bonding head 3 is hooked on the U-shaped holder 4h. When the thermocompression bonding head 3 is hung on the U-shaped holding portion 4h of the support 4 in this manner, as shown in FIG. It is preferable that a heat insulating material 14 is interposed between them. In FIG. 6, reference numeral 15 denotes a heater wire connected to the heater 8 built in the thermocompression bonding head 3, and reference numeral 16 denotes a temperature sensor for measuring the temperature of the thermocompression bonding head 3.

In this manner, the thermocompression bonding head 3 hooked on the U-shaped holding portion 4h of the support 4 is moved, and the thermocompression bonding head 3 of the thermocompression bonding surface 3a is held against the stage surface 2a. Align so that it is parallel, then U-shaped holder 4h
The thermocompression bonding apparatus 200 of the present invention includes an eccentric cam 41 and a lever 4 that is detachably attached to the eccentric cam 41 in order to fix the thermocompression bonding head 3 hooked on the thermocompression head 3 in a parallel state.
2 and fine screw 43, these lever 42 and fine screw 4
3 connecting the eccentric cam 41 to the eccentric cam 41;
3 is provided with a clamp mechanism 40 including a nut 45 that is screwed into the nut 3.

FIG. 7 is an enlarged view of the eccentric cam 41. FIG. 7A shows a state before the thermocompression bonding head 3 is tightened, and FIG. 7B shows a state where the thermocompression bonding head 3 is tightened. And a state fixed to the U-shaped holder 4h. As shown in FIG.
The cross section has a wavy shape. A center line L1 passing through the center O1 of the outer curved portion R1 of the eccentric cam 41;
A center line L2 passing through the center O2 of the joint between the lever 1 and the lever 42
And the distance between them (i.e., the amount of eccentricity S of the center O1 of the outer curved portion R1 of the eccentric cam 41 from the center O2 of the connecting portion) is generally about 0.1 to 1.0 mm. A gap T is provided between the side wall 41a of the eccentric cam 41 and the U-shaped holding portion 4h.

Therefore, as a method of adjusting the parallelism between the thermocompression bonding surface 3a and the stage surface 2a and fixing the parallel state, first, the thermocompression bonding head 3 is lowered in the state of FIG. 3a is gently pressed against the stage surface 2a to make them parallel, and then the lever 42 is moved 180 degrees as shown by the arrow.
And the eccentric cam 41 is rotated to the state shown in FIG. In FIG. 6B, the gap T between the side wall of the eccentric cam 41 and the U-shaped holding portion 4h is eliminated, and the side wall 41b of the eccentric cam 41 comes into close contact with the U-shaped holding portion 4h, and The character-shaped holding part 4h is strongly pressed. Therefore, the thermocompression bonding head 3 hooked on the U-shaped holding portion 4h is tightened, and the parallelism between the initial thermocompression bonding surface 3a and the stage surface 2a is fixed. Further, in this case, the rotation moment when rotating the eccentric cam 41 is not the rotation moment centered on the axial direction of the fine screw 43, so that the support 4 cannot rotate as in the conventional example shown in FIG. Absent. Therefore, it is possible to prevent the parallelism of the once set thermocompression bonding surface 3a from going out of order.

The fastening force of the thermocompression bonding head 3 when the thermocompression bonding head 3 is fixed is determined by the side wall 4 of the eccentric cam 41 in the state shown in FIG.
It differs depending on the size of the gap T and the amount of eccentricity S between 1a and the U-shaped holding portion 4h. Further, the appropriate tightening force is determined by the thermocompression bonding head 3 and the heat insulating material 1 held by the U-shaped holding portion 4h.
For example, when an eccentric cam having an eccentric amount of 0.5 mm is used, the eccentric
The gap T between the side wall 41a and the U-shaped holding portion 4h is
Usually, it is preferable to be about 0.1 to 0.2 mm.

When the clamp mechanism 40 having such an eccentric cam is used, a method of adjusting the parallelism of the thermocompression bonding surface 3a to the stage surface 2a before fixing the thermocompression bonding head 3 is as described above with reference to FIG. In addition to the adjustment in the state of (a), as shown in FIG. 8A, the side wall of the eccentric cam 41 has a relatively weak pressing force (for example, about 50 kg / cm ² ).
Presses the U-shaped holding portion 4h, and lowers the thermocompression bonding head 3 in this state to change the thermocompression bonding surface 3a to the stage surface 2a.
, And may be lifted as it is. After the thermocompression bonding surface 3a and the stage surface 2a are set in parallel in this manner, the rotating cam 41 is rotated by turning the lever 42 to rotate the eccentric cam 41, as in the case described with reference to FIG. The side wall may strongly press the U-shaped holding portion 4h, thereby fixing the thermocompression bonding surface (FIG. 8B).

Although the thermocompression bonding apparatus of the present invention has been described centering on the apparatus 200 shown in FIG. 1, the thermocompression bonding apparatus of the present invention is not limited to this. For example, the thermocompression bonding apparatus 20 of FIG.
At 0, the parallelism adjusting means 20A and 60 by a wedge mechanism are provided on both the support 4 and the stage 2, and the thermocompression bonding head 3 and the support 4 are connected by a clamp mechanism 40 composed of an eccentric cam. However, even when any one of the support parallelism adjusting means 20A, the stage parallelism adjusting means 60, and the clamp mechanism 40 including the eccentric cam is provided in the thermocompression bonding apparatus, compared with the conventional thermocompression bonding apparatus. Thus, the parallelism between the thermocompression bonding surface 3a and the stage surface 2a can be accurately adjusted.

Further, the thermocompression bonding apparatus of the present invention can be configured as a so-called multi-head type thermocompression bonding apparatus in which a plurality of thermocompression bonding heads are arranged in parallel to heat and press a plurality of press-bonded bodies simultaneously. For example, FIG. 9 is a front view of a thermocompression bonding apparatus in which six thermocompression bonding heads 3 each have six thermocompression bonding heads connected to the support 4 as viewed from the eccentric cam 41 side. As shown, each of the thermocompression bonding heads 3 and the support 4 can be connected by the clamp mechanism 40 including an eccentric cam. Thus, the thermocompression bonding surface 3a of each thermocompression bonding head 3 can be finely adjusted precisely in the rotation direction indicated by the arrow in the drawing to be parallel to the stage surface.

Also, in the present invention, except that a parallelism adjusting means by a wedge mechanism is provided on a support or a stage, or that a thermocompression bonding head is fixed to a support by a clamp mechanism using an eccentric cam, Can be configured in the same manner as the thermocompression bonding apparatus. For example, in the above-described example, the one in which one heater 8 is built in is shown as the thermocompression bonding head 3. However, in order to make the temperature distribution during heating uniform, a plurality of heaters are built in the heating head. You may.

The thermocompression bonding apparatus of the present invention can be used as a heating and pressurizing apparatus for various objects to be pressed, and in particular, it is necessary to strictly adjust the parallelism between the thermocompression bonding surface and the stage surface. It is useful as a thermocompression bonding device in the case of For example,
When the liquid crystal panel and the TAB are preliminarily pressure-bonded via an anisotropic conductive adhesive sheet to form a pressure-bonded object, and the pressure-bonded object is heated and pressed by a thermocompression bonding head to perform a final pressure-bond between the liquid crystal panel and the TAB. For connecting a liquid crystal panel to an IC, connecting a rigid or film-like substrate to a TAB, mounting an IC on a rigid or film-like substrate, mounting semiconductor elements on various other circuit boards, etc. However, the present invention is particularly useful as a device in the case where a liquid crystal panel and TAB are preliminarily pressure-bonded via an anisotropic conductive adhesive sheet (ACF) and are fully pressure-bonded.

[0058]

According to the present invention, in a thermocompression bonding apparatus in which a temporary compression bonding body of a liquid crystal panel, an anisotropic conductive adhesive sheet, and TAB is used as a compression-bonding object, a parallel connection between a thermocompression bonding surface and a stage surface is provided. The degree can be strictly adjusted.

[Brief description of the drawings]

FIG. 1 is a perspective view of a thermocompression bonding apparatus according to the present invention.

FIG. 2 is a perspective view (FIG. 2A) and a cross-sectional view (FIG. 2B) of a parallelism adjusting means used in the thermocompression bonding apparatus of the present invention.

FIG. 3 is a sectional view of a parallelism adjusting means used in the thermocompression bonding apparatus of the present invention.

FIG. 4 is a perspective view of the thermocompression bonding apparatus of the present invention.

FIG. 5 is a perspective view of a stage used in the thermocompression bonding apparatus of the present invention.

FIG. 6 is an explanatory front view of the clamp mechanism used in the thermocompression bonding apparatus of the present invention (FIG. 6A) and an explanatory view of the components (FIG. 6B).

FIG. 7 is an enlarged explanatory view of the vicinity of an eccentric cam of a clamp mechanism used in the thermocompression bonding apparatus of the present invention.

FIG. 8 is an explanatory view of a clamp mechanism used in the thermocompression bonding apparatus of the present invention.

FIG. 9 is a front view of the vicinity of the thermocompression bonding head of the thermocompression bonding apparatus of the present invention having six thermocompression bonding heads.

FIG. 10 is a perspective view of a conventional thermocompression bonding apparatus.

FIG. 11 is a perspective view of a conventional thermocompression bonding apparatus.

FIG. 12 is a side view showing the vicinity of a thermocompression bonding head of a conventional thermocompression bonding apparatus.

FIG. 13 is a front view showing the vicinity of a thermocompression bonding head of a conventional thermocompression bonding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Compression target 2 Stage 2a Stage surface 3 Thermocompression head 3a Thermocompression surface 4 Support 4h U-shaped holding part 4i Hole 8 Heater 9 Rotating shaft 20A, 20B Parallelism adjusting means 21 Bracket 21x Upper bracket 21y Lower bracket 22 Wedge 23 Wedge moving screw 26 Handle 27 Backing plate 28 Fixing bolt 30 Sphere 31 Sphere holding member 33 Round shaft 34 Spring 35 Pressure bolt 40 Clamp mechanism composed of eccentric cam 41 Eccentric cam 42 Lever 43 Fine screw 60, 60A1 , 60A2 Parallelism adjusting means 200 Thermocompression bonding device 201 Thermocompression bonding device

Continuation of the front page (56) References JP-A-7-307558 (JP, A) JP-A-57-33963 (JP, A) JP-A-4-1799041 (JP, A) , U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01R 43/00-43/02

Claims (9)

(57) [Claims] 1. A thermocompression bonding apparatus having a stage on which a body to be compressed is mounted, a thermocompression head for heating and pressing the body to be mounted on the stage, and a support for supporting the thermocompression head. Parallelism adjusting means for finely adjusting the parallelism between the crimping surface and the stage surface by a wedge mechanism is provided on the support, and the parallelism adjusting means has a V-shaped groove.
And the inside of the V-shaped groove in the V-shaped depth direction
A movable member that changes the opening of the V-shaped groove by moving
With the movable member to move the movable member in the V-shaped depth direction.
Movable member moving screw to move and fixed to movable member moving screw
The movable member moving screw has a V-shape.
It is provided without contacting the bracket with the groove.
The plate does not contact the side walls of the space within the space within the bracket.
A thermocompression bonding device, which is provided so as to be positioned at a suitable position. Wherein the movable member is a wedge which contacts the groove surface and the surface of the V-shaped groove of the bracket, thermocompression bonding according to claim 1, wherein the fixing means for fixing the degree of opening of the V-shaped groove is provided apparatus. Wherein the movable member includes a sphere which contacts the groove surface and the point of the V-shaped groove of the bracket, it holds the sphere, according to claim 1 consisting of the ball holding member which is screwed to the movable member moving screw Thermocompression bonding equipment. 4. A bracket having a V-shaped groove, an upper bracket constituting one groove surface of the V-shaped groove, a lower bracket constituting the other groove surface of the V-shaped groove, an upper bracket and a lower bracket. A pressure bolt for pressing the brackets together; a V-shaped small groove is provided at a joint between the upper bracket and the lower bracket so as to face each of the upper bracket and the lower bracket; thermocompression bonding apparatus according to claim 1, wherein the round shaft is through the hollow portion formed from Jo small groove. 5. The pressure-bonded body is a temporary pressure-bonded body made of an anisotropic conductive adhesive sheet between a liquid crystal panel and TAB.
The thermocompression bonding apparatus according to any one of claims 1 to 4 , wherein 6. A thermocompression bonding apparatus having a stage on which a body to be pressed is placed, a thermocompression head for heating and pressing the body to be pressed placed on the stage, and a support for supporting the thermocompression head. parallelism adjusting means for finely adjusting the parallelism between the bonding surface and the stage surface by the wedge mechanism is provided on the stage, flat Gyodo adjustment hand stage, the V-shaped grooves
Having a V-shaped groove in the V-shaped groove
Movable member that changes the opening of the V-shaped groove by moving
With the movable member to move the movable member in the V-shaped depth direction.
Movable member moving screw to move and fixed to movable member moving screw
The movable member moving screw has a V-shape.
It is provided without contacting the bracket with the groove.
The plate does not contact the side walls of the space within the space within the bracket.
A thermocompression bonding device, which is provided so as to be positioned at a suitable position. 7. A sheath pressing body, claim by an anisotropic conductive adhesive sheet of the liquid crystal panel and TAB is the temporary bonding body 6
The thermocompression bonding apparatus as described in the above. 8. A thermocompression bonding apparatus comprising: a stage on which a body to be pressed is placed; a thermocompression head for heating and pressing the body to be pressed placed on the stage; and a support for supporting the thermocompression head. An eccentric cam having a U-shaped holding portion for hooking a head, wherein the U-shaped holding portion is fixed to the U-shaped holding portion by tightening a thermocompression bonding head hooked thereon; And a clamp mechanism comprising fine screws are provided .
The fine screw keeps the U-shape in the direction of tightening the thermocompression bonding head.
The fine screw and the eccentric cam are passed through the
Rotational moment about the axial direction of the fine screw
A thermocompression bonding device characterized by being connected so as not to be formed . 9. sheath pressing body, according to claim 8 by anisotropic conductive adhesive sheet between the liquid crystal panel and the TAB is temporarily pressure bonded body
The thermocompression bonding apparatus as described in the above.