KR100828315B1 - Apparatus For Bonding a Driving Circuit Board Of Flat Panel Display - Google Patents

Abstract

Disclosed is a circuit board bonding apparatus for driving a flat panel display. The driving circuit board bonding apparatus of the flat panel display of the present invention includes a crimping unit for crimping the driving circuit board to the bonding surface of the glass substrate to which the driving circuit board of the flat panel display is attached, wherein the crimping unit is a glass substrate. A pressing body provided to be accessible and spaced apart from the bonding surface at the top; A bonder tool having a crimping surface in contact with the driving circuit board when the driving circuit board is crimped on the bonding surface; A plurality of height adjusting members for coupling the bonder tool to the pressing body and for adjusting the displacement of the pressing face with respect to the bonding face for flatness of the pressing face of the bonder tool; And it is provided on the height adjusting member, characterized in that it comprises a rotation operation unit for operating the rotation of the height adjusting member provided in the area of the height adjusting member between the pressing body and the bonder tool. According to the present invention, when adjusting the flatness of the bonding surface of the bonder tool pressurizing the bonding surface of the glass substrate, it is possible to prevent the breakage of the bolt member that has occurred in the past and to make the flatness of the pressing surface easier than before. It can be adjusted to reduce the tact time of the bonding process.

Flat Panel Displays, Circuit Boards, Bonding, TCP

Description

Apparatus For Bonding a Driving Circuit Board Of Flat Panel Display}

1 is a schematic diagram illustrating a circuit board bonding apparatus for driving a flat panel display according to an exemplary embodiment of the present invention.

2 is a view showing the pressing device of FIG.

3 is a view showing the main compression device of FIG.

4 is a front view of the upper pressing unit of the main pressing device of FIG.

5 is an exploded side view of the upper compression unit of the main compression device of FIG.

Figure 6 is a side exploded view of the upper pressing unit of the main pressing device according to another embodiment of the present invention.

7 is an exploded side view of the upper compression unit of the main compression device according to another embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings *

      100: driving circuit board bonding device 120: pressing device

      130: main compression unit 140: upper compression unit

      142: pressure main body 144: height adjusting member

      145: rotary operation unit 146: bonder tool (bonder tool)

      146c: heater 147: pressing surface

The present invention relates to a circuit board bonding device for driving a flat panel display, and more particularly, to prevent damage of the bolt member that occurs when adjusting the flatness of the conventional crimping surface, and to make flatness of the crimping surface easier than before. The present invention relates to a circuit board bonding apparatus for driving a flat panel display that can be adjusted.

Recently, portable electronic devices such as mobile phones and PDAs require miniaturized and lightweight displays, and TVs and PC monitors require slimmer, flattened and larger displays. According to this trend, technology development for liquid crystal display (LCD), plasma display panel (PDP), and organic light emitting diodes (OLED), which are flat panel displays (FPT), replacing CRT, is being actively conducted. have.

Planar displays such as PDPs, LCDs, and OLEDs are somewhat different in terms of operating principle and structure, but electrical signals such as control signals and image signals generated from printed circuit boards (PCBs) ) Is a common characteristic transmitted to the display panel. Therefore, these flat panel displays use a technology in which a driving chip is directly attached to a display panel, that is, a glass substrate, or a flexible base film such as a tape carrier package (TCP), to which the driving chip is attached, is bonded to the glass substrate. To meet the needs of slimmer and lighter weight.

On the other hand, when TCP is used as the flexible substrate film, the TCP bonding process is largely a process of attaching TCP to the short side of the glass substrate, a process of inverting the glass substrate by 90 degrees for TCP attachment to the long side, and a long side of the glass substrate. It can be divided into the process of attaching TCP. In addition, each adhesion process of attaching TCP to short and long sides of the glass substrate is composed of an anisotropic conductive film (ACF) attachment process, a pre bonding process, and a final bonding process.

Between each process and processes, that is, between the ACF attachment process, the preliminary bonding process, the preliminary bonding process, and the final bonding process, a transfer machine is placed on the upper portion, and the glass substrate having completed the entire process is adsorbed from the upper portion to the next process.

The ACF attaching process is a process of adhering the ACF to the glass substrate, and the preliminary bonding process is a process of pressing the end of TCP to the ACF bonded region on the glass substrate, and the final bonding process is a bonder with a heater. It is a process of finally bonding TCP by thermo-compressing the bonding surface of the glass substrate to which TCP is pressed using a (bonder tool).

Here, ACF is an anisotropic conductive film in which fine conductive particles are mixed with an adhesive that is cured by heat. When ACF is applied to a contact bonding surface between a glass substrate and a flexible substrate film at high temperature through ACF, a portion where the circuit pattern contacts is conductive. The particles are energized.

In the final bonding process, the end portion of the TCP pressed onto the glass substrate is pressed by contact with a bonder tool, but is heated in a crimped state heated by a heater mounted inside the bonder tool. By holding for about 15 to 15 seconds, the TCP is finally pressed onto the glass substrate.

On the other hand, the large display should be attached to 15 to 20 or more TCP on the long side of the glass substrate. In general, in the process of attaching TCP, it is advantageous to attach the TCP by one compression to shorten the process time. However, as the length of the long side becomes longer, the length of the pressing surface of the bonder tool becomes longer, and as a result, the flatness of the pressing surface (parallel to the bonding surface of the glass substrate) due to errors in machining, thermal deformation by a heater, and the like. It is difficult to keep good).

If the flatness of the pressed surface is bad, the bonding force applied to the bonding surface may not be uniform, and there may be a risk of glass substrate breakage at the place where a large pressing force is applied, and TCP is not perfectly pressed on the glass substrate at the place where a small pressing force is applied. There is a problem.

In consideration of these problems, a method of adjusting the flatness of the pressing surface by providing a height adjusting member having a bolt member shape on the upper part of the bonnet tool and moving the height adjusting member in the vertical direction has been considered.

By the way, in the conventional flat display drive circuit board bonding apparatus, since the height adjustment means is provided in the shape of a bolt member, in order to move a bolt member shape up and down, the head part provided at the end of a bolt member shape is clockwise or clockwise. In this case, as the bolt member shape is relatively long and the head is formed at the end of the bolt member shape, a large torque is required to move the bolt member shape, and the head of the bolt member shape is required. When a large torque is applied, a problem occurs that the head is broken, and as the length of the bolt member becomes longer, the deformation of the bolt member becomes larger, which makes it difficult to adjust the flatness of the pressing surface. This causes a problem in that the process time is delayed.

SUMMARY OF THE INVENTION An object of the present invention is to prevent breakage of a bolt member that has occurred in the past when adjusting the flatness of a crimping surface of a bonder tool that presses the bonding surface of a glass substrate, and to improve the flatness of the crimping surface. It is to provide a circuit board bonding apparatus for driving a flat panel display that can be easily adjusted to reduce the tact time of the bonding process.

      An object of the present invention includes a crimping unit for crimping the driving circuit board to a bonding surface of a glass substrate to which a driving circuit board of a flat panel display is attached, wherein the crimping unit includes the bonding surface on an upper portion of the glass substrate. Pressurized main body is provided to be accessible and spaced apart; A bonder tool having a pressing surface contacting the driving circuit board when pressing the driving circuit board on the bonding surface; A plurality of height adjusting members coupling the bonder tool to the pressing body and adjusting displacement of the pressing face with respect to the bonding face for flatness of the pressing face of the bonding tool; And a rotation manipulation unit provided in the height adjustment member and provided in an area of the height adjustment member between the press body and the bonder tool to manipulate rotation of the height adjustment member. Achieved by a substrate bonding apparatus.

Here, the plurality of height adjusting members are disposed to be spaced apart from each other, it is possible to adjust the displacement with respect to the bonding surface of the pressing surface of the predetermined section of the pressing surface, respectively.

In addition, the height adjusting member is screwed to the pressing body and the bonder, respectively, the direction of the screw thread formed between the height adjusting member and the pressing body, and the direction of the screw thread formed between the height adjusting member and the bonder tool Are preferably processed in opposite directions.

And, the height adjustment member, the body; A first screw part provided at an upper end of the body and having a first screw thread screwed to a first screw hole formed in the pressing body; And a second threaded portion provided at a lower end of the body and having a second screw thread that is screwable to a second screw hole formed in the bonder tool.

On the other hand, the rotation operation portion, may be integrally coupled to protrude in the radial direction to the body portion between the first screw portion and the second screw portion of the height adjustment member.

At this time, the rotating operation portion may be a hexagonal nut shape.

In addition, the rotation operation portion, may be provided in the body portion between the first screw portion and the second screw portion of the height adjustment member, the tool insertion groove formed so that the rotation rod for rotating the height adjustment member can be inserted. .

The bonder tool, the support body coupled to the height adjustment member; A pressing bar for pressing the bonding surface of the glass substrate; And a heater provided in the support body to heat the compression bar.

On the other hand, the driving circuit board bonding apparatus, the pressing device for pressing the driving circuit board to the bonding surface of the glass substrate; And a main pressing device for finally pressing the driving circuit board and the glass substrate pressed by the pressing device, wherein the main pressing device is configured to apply pressure from an upper side to a lower side of the driving circuit board. An upper compression unit; And a backup pressing unit provided below the upper pressing unit to support the glass substrate, wherein the pressing unit may be an upper pressing unit of the main pressing device.

An ionizer for removing static electricity present in the glass substrate and the driving circuit board may be provided on the pressing surface of the upper pressing unit and the backup pressing unit.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

The glass substrate described below may be used for a panel of any one of the flat panel display of LCD, PDP, and OLED, and the circuit board may be a flexible printed circuit (FPC), a tape carrier package (TCP), or a printed circuit board (PCB). Circuit board).

1 is a schematic view showing a circuit board bonding device for driving a flat panel display according to an embodiment of the present invention. As shown therein, the driving circuit board bonding device 100 for a flat panel display according to an embodiment of the present invention. ) Includes a stage unit 102, a loading / unloading unit 104, an ACF attachment device 110, a pressure bonding device 120, and a main compression device 130.

The stage unit 102 mounts the glass substrate G used for the flat display panel on its upper surface, and moves the seated glass substrate G to the loading / unloading position, the pressing position and the main pressing position. Play a role.

In addition, the loading / unloading unit 104 serves to load the glass substrate G into the stage unit 102 and to unload the glass substrate G from which the process is completed from the stage unit 102. Do it.

The ACF attachment device 110 cuts and attaches and compresses an ACF (anisotropic conductive film) to the bonding surface of the glass substrate. An anisotropic conductive film (ACF) is interposed between the bonding surface of the driving circuit board (C) and the glass substrate (G) to bond the driving circuit board (C) to the bonding surface of the glass substrate (G). Play a role.

On the other hand, the pressing device 120, as shown in detail in Figure 2, includes a pressing unit 122, the pressing unit 122 is the upper pressing means (122b) and the lower support (122a) Equipped.

The pressing unit 122 weakly presses and fixes the driving circuit board C placed on the bonding surface of the glass substrate G. The upper pressurizing means 122b is driven up and down by a cylinder provided on the upper part of the pressing unit 122, and the lower support 122a has a slightly larger area than the driving circuit board C being crimped. It is prepared to.

The pressure bonding device 120 accurately measures the positions of the glass substrate G and the driving circuit board C so that the driving circuit board C is placed at the correct position of the bonding surface of the glass substrate G. A vision unit (not shown) is provided. That is, the driving circuit board (C) should be precisely crimped at the bonding position of the glass substrate (G). For this purpose, the position of the driving circuit board (C) and the glass substrate (G) should be accurately identified, and such accurate positioning The vision is prepared for. In the present exemplary embodiment, the vision unit includes a vision for aligning the glass substrate G for alignment of the glass substrate G and a driving circuit board C for aligning the driving circuit board C. A vision for alignment is provided. By using the position information measured by these two visions, the glass substrate G and the driving circuit board C can be exactly matched.

On the other hand, the pressing unit 122, a cartridge heater (not shown) for raising the temperature of the pressing unit 122 to an appropriate temperature is further provided. The cartridge heater is mounted on the surfaces of the lower base 122a and the upper pressurizing means 122b. The cartridge heater increases the temperature of the glass substrate G and the driving circuit board C in the pressing step. Pressurization of (C) is made to proceed easily.

As shown in FIG. 3, the main compression device 130 includes a silicon sheet self-winding unit 160, a teflon sheet self-winding unit 170, an upper compression unit 140, and a back-up. ) Is provided with a pressing unit 150.

Silicon sheet self-winding unit 160, respectively provided on the left and right sides of the upper pressing unit 140, serves to automatically wind the silicon sheet.

Teflon sheet automatic winding unit 170, respectively provided on the left and right sides of the upper pressing unit 140, serves to automatically wind the Teflon sheet.

In addition, the upper pressing unit 140 is driven in the vertical direction by the cylinder provided on the upper portion of the upper pressing unit 140 to serve to apply pressure in the lower direction from the top of the driving circuit board (C).

The backup crimping unit 150 may be provided below the upper crimping unit 140 to support the lower portion of the glass substrate G, and may be driven in the vertical direction.

At the time of main compression, the glass substrate G and the driving circuit board C pressed by the pressure bonding device 120 include the upper pressing unit 140 and the backup pressing unit 150 of the main pressing device 130. Located in between, it is compressed in accordance with the downward drive of the upper pressing unit 140.

In the main crimping apparatus 130 according to the present embodiment, ions present on the glass substrate G and the driving circuit board C are provided on the pressing surfaces of the upper pressing unit 140 and the backup pressing unit 150. An ionizer (not shown) is provided.

4 is a front view of the upper pressing unit of the main pressing device of Figure 3, Figure 5 is a side exploded view of the upper pressing unit of the main pressing apparatus of FIG.

As shown in these figures, the upper pressing unit 140, the pressing body 142, the bonder tool 146, the height adjusting member 144, the height adjusting member 144 to operate the rotation The rotary operation unit 145 is provided.

The pressure body 142 receives the driving force of the cylinder and transmits the pressing force to the bonder tool 146 through the plurality of height adjusting members 144, and the glass substrate mounted on the backup pressing unit 130 by vertical movement. Approach and space away from the bonding surface of G). In addition, a plurality of first threaded holes 142a having a screw thread formed therein may be formed at the lower end of the press body 142 so that the height adjusting member 144 may be screwed.

 As shown in more detail in FIG. 5, the bonder tool 146 includes a support body 146b, a heater 146c, and a pressing bar 146d.

The support body 146b has a second screw hole 146a for screwing the height adjusting member 144 to the upper end thereof, and a heater 146c for heating the pressing bar 146d therein is provided therein. have.

The heater 146c heats the pressing bar 146d before pressing the glass substrate G, and when the glass substrate G is pressed, the circuit board and glass having the ACF interposed therebetween through the pressing bar 146d. By transferring heat to the substrate G, it is possible to enable electrical conduction and physical adhesion through the ACF.

The pressing bar 146d is integrally provided on the lower surface of the supporting body 146b, and the pressing surface 147, which is the lower surface of the pressing bar 146c, contacts the circuit board to compress the bonding surface of the glass substrate G. .

On the other hand, the height adjustment member 144 couples the bonder tool 146 to the pressing body 142, the bonding surface of the pressing surface 147 for the flatness of the pressing surface 147 of the bonder tool 146 Adjust the displacement. The height adjusting member 144 is provided in plurality, the plurality of height adjusting members 144 are arranged to be spaced apart from each other, each of the height adjusting members 144, the pressing surface 147 of a predetermined section of the pressing surface 147. The relative displacement with respect to the bonding surface of each can be adjusted.

The height adjusting member 144 includes a body 144a, a first threaded portion 144b provided at the upper end of the body 144a, and a second threaded portion 144c provided at the lower end of the body 144a.

The first threaded portion 144b is integrally manufactured with the upper end of the body 144a, and has a circumference of the first threaded portion 144b in the same direction as the thread formed inside the first threaded hole 142a of the pressing body 142. Since a thread is formed, the first threaded portion 144b may be screwed into the first screw hole 142a.

The second threaded portion 144c is integrally manufactured with the lower end of the body 144a, and the circumference of the second threaded portion 144c has the same direction as the thread formed inside the second threaded hole 146a of the bonder tool 146. The thread is formed so that the second threaded portion 144c can be screwed into the second threaded hole 146a.

Here, the directions of the threads formed in the first threaded hole 142a and the first threaded portion 144b are left screws, and the directions of the threads formed in the second threaded hole 146a and the second threaded portion 144c are right screws. It is formed in the opposite direction. Of course, the reverse is also possible.

The rotation operation part 145 is integrally manufactured to protrude radially in the middle part of the longitudinal direction of the body 144a between the 1st threaded part 144b and the 2nd threaded part 144c of the height adjustment member 144. As shown in FIG. The rotation operation unit 145 has a hexagonal nut shape, and by rotating a height adjusting member 144 in a clockwise or counterclockwise direction by applying a torque by biting a tool such as a wrench. Make sure In this embodiment, the rotary operation unit 145 is made integrally with the height adjustment member 144, but the scope of the present invention is not limited thereto, and the rotation operation unit 145 formed of a separate member of the height adjustment member 144 It may be provided in combination with the body (144a).

In the main pressing device 130 of the circuit board bonding apparatus 100 for driving a flat panel display having such a configuration, a process of adjusting the flatness of the pressing surface 147 of the upper pressing unit 140 is illustrated in FIGS. A description with reference to FIG. 5 is as follows.

As described above, the pressing surface 147 of the pressing bar 146d provided in the bonder tool 146 should be kept parallel to the bonding surface in order to apply uniform pressure across the bonding surface of the glass substrate G. . In other words, the distance between the entire pressing surface 147 and the entire bonding surface should be constant. However, there is a case where the distance between the pressing surface 147 and the bonding surface cannot be kept constant due to an error in machining or thermal deformation by a heater. At this time, the distance between the pressing surface 147 and the bonding surface should be constantly adjusted.

For example, in FIG. 4, when the right pressing surface 147b is raised higher than the left pressing surface 147a, that is, the distance to the bonding surface of the right pressing surface 147b is connected to the bonding surface of the left pressing surface 147a. The method of adjusting the flatness of the crimping surface 147 on the assumption that the distance is greater than the distance for the following is described as follows.

Since the first threaded portion 144b of each height adjusting member 144 is a left screw, and the second threaded portion 144c is a right screw, the bonder tool 146 when the height adjusting member 144 is rotated counterclockwise. ) Is spaced apart from the press body 142.

Therefore, the rotary operation unit 145 provided in the height adjusting member 144 near the right side pressing surface 147b is rotated counterclockwise by using a wrench, so that the right side pressing surface 147b has the height of the left side pressing surface 147a. When it is spaced apart from the press main body 142 until it is equal to, the pressing surface 147 of the bonder tool 146 becomes parallel to the bonding surface of the glass substrate G as a whole. Alternatively, the rotation manipulation unit 145 provided in the height adjusting member 144 near the left pressing surface 147a may be rotated clockwise to increase the distance to the bonding surface of the left pressing surface 147a.

As such, the upper and lower ends of the body 144a of the height adjusting member 144 are provided with the threaded portions 144b and 144c, respectively, and the rotation operation part 145 is disposed at the central region of the body 144a of the height adjusting member 144. When the torque is applied to the height adjusting member 144, the distance between the rotating operation part 145 and the screw parts 144b and 144c of the height adjusting member 144 is reduced by approximately half compared to the conventional method. The stress received by the threads 144b and 144c with respect to torque is reduced by approximately half. Based on these characteristics, the possibility of breakage and deformation of the height adjusting member 144 is significantly reduced compared to the prior art.

In addition, unlike the related art, since the screw portions 144b and 144c of the height adjusting member 144 are provided in two places, but the threads are formed in opposite directions, the bonder tool 146 when the rotation angles of the rotation manipulation unit 145 are the same. The distance to the press body 142 is approached or spaced apart increases the height of the pressing surface 147 of the bonder tool 146 can be easily adjusted and the adjustment time can be reduced, thus, the tact time (tact) of the bonding process time can be reduced.

Hereinafter, other embodiments of the present invention will be described. In the embodiment described below, the configuration and operation as in the above-described embodiment will be omitted.

Figure 6 is a side exploded view of the upper pressing unit of the main pressing device according to another embodiment of the present invention. As shown therein, the upper pressing unit 240 according to another embodiment of the present invention, the pressing body 242, the bonder tool 246, the height adjustment member 244, the rotary operation unit 245 Equipped.

The lower end of the pressing body 242 is provided with a first screw projection (242a) having a thread formed on the outside.

The upper part of the bonder tool 246 is provided with the 2nd screw protrusion 246a by which the screw thread was formed in the outer side.

On the other hand, the upper end of the body 244a of each height adjustment member 244 is provided with a first screw hole 244b having a thread formed therein. The lower end of the body 244a is provided with a second screw hole 244c having a thread formed therein.

The pressing body 242 and the height adjusting member 244 may be coupled by screwing the first screw protrusion 242a and the first screw hole 244b. The height adjusting member 244 and the bonder tool 246 may be coupled by screwing the second screw hole 244c and the second screw protrusion 246a.

The direction of the screw thread formed between the first screw protrusion 242a and the first screw hole 244b and the direction of the screw thread formed between the second screw protrusion 246a and the second screw hole 244c are formed in opposite directions. As the height adjusting member 244 is rotated in a clockwise or counterclockwise direction, the bonder tool 246 approaches or is spaced apart from the pressing body 242, and the bonder tool is appropriately adjusted by adjusting the plurality of height adjusting members 244. The relative displacement with respect to the bonding surface of the crimping surface 247 of 246 can also be adjusted.

 7 is an exploded side view of the upper compression unit of the main compression device according to another embodiment of the present invention. As shown in this, in the present embodiment, the rotation operation unit 345 is formed in the middle portion of the longitudinal direction of the body 344a of the height adjustment member 344 is the same as the above-described embodiments, the above-described embodiment Unlike the examples, it is provided as a pair of tool insertion grooves 345 in a direction perpendicular to the central axis. In this configuration, a rotating rod may be inserted into the tool insertion groove 345 to rotate the height adjusting member 344 in a clockwise or counterclockwise direction, and thus, by appropriately adjusting the plurality of height adjusting members 344. The relative displacement with respect to the bonding surface of the crimping surface 347 of the bonder tool 346 can also be adjusted.

In the above-described embodiments, the circuit board bonding apparatus for a flat panel display includes a pressing device and a main pressing device, and the pressing unit includes an upper pressing unit of the main pressing device. The driving circuit board bonding device may be the main compression device or the pressing device itself. If the circuit board bonding apparatus for driving a flat panel display according to the present invention is a pressing device, the pressing unit according to the present invention may be a pressing unit.

As described above, the present invention is not limited to the described embodiments, and various modifications and variations can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, when adjusting the flatness of the crimping surface of the bonder tool pressurizing the bonding surface of the glass substrate, it is possible to prevent the damage phenomenon of the bolt member that has occurred in the past and to flatten the crimping surface. The degree can be adjusted more easily than in the prior art can shorten the time (tact time) of the bonding process.

Claims (10)

It includes a crimping unit for crimping the driving circuit board on the bonding surface of the glass substrate to which the driving circuit board of the flat panel display is attached, The pressing unit, A press body provided at an upper portion of the glass substrate to be accessible and spaced apart from the bonding surface; A bonder tool having a pressing surface contacting the driving circuit board when pressing the driving circuit board on the bonding surface; A plurality of height adjusting members for coupling the bonder tool to the pressing body, and adjusting a displacement with respect to the bonding surface of the crimping surface by a predetermined section for the flatness of the crimping surface of the bonder tool; And Bonding circuit board for driving a flat panel display, characterized in that provided in the height adjusting member and provided in the area of the height adjusting member between the pressing body and the bonder tool to manipulate the rotation of the height adjusting member. Device. The method of claim 1, The plurality of height adjusting members are arranged to be spaced apart from each other to adjust the displacement of the bonding surface of the pressing surface of the predetermined section of the pressing surface, each of the flat display driving circuit board bonding apparatus. The method of claim 1, The height adjusting member is screwed to the pressing body and the bonder, respectively, the direction of the thread formed between the height adjusting member and the pressing body, and the direction of the thread formed between the height adjusting member and the bonder tool is mutually different. A circuit board bonding apparatus for driving flat panel displays, which is processed in an opposite direction. The method of claim 3, The height adjustment member, Body; A first screw part provided at an upper end of the body and having a first screw thread screwed to a first screw hole formed in the pressing body; And And a second screw portion provided at a lower end of the body and having a second screw thread that is screwable to a second screw hole formed in the bonder tool. The method of claim 4, wherein And the rotation manipulation unit is integrally coupled to the body portion between the first screw portion and the second screw portion of the height adjusting member so as to protrude in a radial direction. The method of claim 5, Wherein the rotating operation portion is a circuit board bonding device for driving a flat display, characterized in that the hexagonal nut shape. The method of claim 4, wherein The rotation operation portion is provided in the body portion between the first screw portion and the second screw portion of the height adjustment member, characterized in that the tool insertion groove formed so that the rotation rod for rotating the height adjustment member can be inserted. Circuit board bonding device for driving a flat panel display. The method of claim 1, The bonder tool, A support body coupled with the height adjusting member; A pressing bar for pressing the bonding surface of the glass substrate; And A circuit board bonding apparatus for driving a flat panel display, characterized in that it comprises a heater provided in the support body to heat the pressing bar. The method of claim 1, The driving circuit board bonding device, A pressing device for pressing the driving circuit board to a bonding surface of the glass substrate; And And a main crimping device for finally crimping the driving circuit board and the glass substrate which are crimped by the crimping device. The main compression device, An upper press unit for applying pressure from an upper side to a lower side of the driving circuit board; And A backup crimping unit provided below the upper crimping unit to support the glass substrate; And the crimping unit is an upper crimping unit of the main crimping device. The method of claim 1, Bonding surfaces of the upper pressing unit and the backup pressing unit are provided with ionizers for removing static electricity from the glass substrate and the driving circuit board. Device.

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