JP2001196422A - Thermocompression bonding device - Google Patents
Thermocompression bonding deviceInfo
- Publication number
- JP2001196422A JP2001196422A JP2000006953A JP2000006953A JP2001196422A JP 2001196422 A JP2001196422 A JP 2001196422A JP 2000006953 A JP2000006953 A JP 2000006953A JP 2000006953 A JP2000006953 A JP 2000006953A JP 2001196422 A JP2001196422 A JP 2001196422A
- Authority
- JP
- Japan
- Prior art keywords
- thermocompression bonding
- tcp
- liquid crystal
- mounting table
- crystal panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Liquid Crystal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、液晶パネルと、駆
動用プリント配線基板を、異方導電性膜の中に含まれる
導電粒子で、電気的に導通を行なう複数個のＴＣＰ（テ
ープ・キャリア・パッケージ）により、実装された液晶
モジュールに於いて、液晶パネルに圧着されたＴＣＰの
内、不良ＴＣＰを新しい物と交換する場合、液晶パネル
の端子である電極とＴＣＰの銅箔を位置合せして、異方
導電性膜をはさんで仮固定されたＴＣＰの液晶パネル圧
着部と駆動用プリント配線基板圧着部を熱圧着する熱圧
着装置に関する。The present invention relates to a plurality of TCPs (tape carriers) for electrically connecting a liquid crystal panel and a driving printed circuit board with conductive particles contained in an anisotropic conductive film.・ When replacing defective TCP with a new one of the TCP crimped to the liquid crystal panel in the mounted liquid crystal module by the package, align the electrode which is the terminal of the liquid crystal panel with the copper foil of the TCP. Further, the present invention relates to a thermocompression bonding apparatus for thermocompression bonding a liquid crystal panel crimping portion of a TCP temporarily fixed with an anisotropic conductive film and a crimping portion of a driving printed circuit board.
【０００２】[0002]
【従来の技術】従来のＴＣＰリペア熱圧着装置につい
て、図４を用いて説明する。2. Description of the Related Art A conventional TCP repair thermocompression bonding apparatus will be described with reference to FIG.
【０００３】図に示すように、従来のＴＣＰリペア熱圧
着装置は、パレット本体１４内に、ガイド１７・１８で
案内されながら、水平移動できるＴＣＰ（テープ・キャ
リア・パッケージ）１個分の圧着が可能な長さのガラス
ステージ７ｂと、液晶パネル２１の手前と、左端面を片
寄せする位置決めブロック３ａ・３ｂと、液晶パネル２
１を真空吸着する複数個のバキュームパッド４とを有し
ていて、ＴＣＰの圧着位置に合せ、ガラスステージ７ｂ
を手で移動させるようになっている。更に、上記構成さ
れたパレット本体１４を、２個のガイドレール１５ａ・
１５ｂで案内する構成を有していて、ＴＣＰの圧着位置
に合せパレット本体１４を手で移動させるようになって
いる。この時、装置ベースプレート１には、パレット本
体１４の裏面に接触するバックアッププレートが設けら
れている。[0003] As shown in the figure, the conventional TCP repair thermocompression bonding apparatus includes a pallet body 14 in which a horizontal movement of one TCP (tape carrier package) is guided while being guided by guides 17 and 18. A glass stage 7b of a possible length, a position in front of the liquid crystal panel 21, positioning blocks 3a and 3b for shifting the left end face, and a liquid crystal panel 2
And a plurality of vacuum pads 4 for vacuum-sucking the glass stage 1 and adjusting the position of the glass pad 7 to the pressure position of the TCP.
Is moved by hand. Further, the pallet body 14 configured as described above is connected to the two guide rails 15a.
15b, the pallet body 14 is manually moved to the TCP crimping position. At this time, the device base plate 1 is provided with a backup plate that contacts the back surface of the pallet body 14.
【０００４】上記のような構成を有する従来のＴＣＰリ
ペア熱圧着装置の動作を、以下、説明する。すなわち、
ＴＣＰの圧着位置上部より、図示しない圧着ツールをツ
ール温度１７０℃から１９０℃に加熱しながら、エアー
シリンダー等により加圧力２０ｋｇ／ｃｍ2から３０ｋ
ｇ／ｃｍ2で下降させ、下死点において、タイマーで１
０秒から３０秒停止させる。これにより、ＴＣＰ２３に
貼り付けられた異方導電性膜２４に含まれる導電粒子２
７を、ＴＣＰ２３の銅箔２６と液晶パネル２１および駆
動用プリント配線基板２２の電極部とに導通接続させ
る。[0004] The operation of the conventional TCP repair thermocompression bonding apparatus having the above configuration will be described below. That is,
From above the crimping position of the TCP, a crimping tool (not shown) is heated from 170 ° C. to 190 ° C. while applying a pressure of 20 kg / cm 2 to 30 k with an air cylinder or the like.
g / cm 2 at the bottom dead center
Stop for 0 to 30 seconds. As a result, the conductive particles 2 contained in the anisotropic conductive film 24 attached to the TCP 23
7 is electrically connected to the copper foil 26 of the TCP 23 and the electrode portions of the liquid crystal panel 21 and the printed wiring board 22 for driving.
【０００５】[0005]
【発明が解決しようとする課題】従来のＴＣＰリペア熱
圧着装置の動作は以上のようなものであるが、図７に示
す接続のメカニズム上、異方導電膜２４の中に含まれる
導電粒子２７をムラ無く分布、圧縮することによって、
電極２５と銅箔２６の導通を取る実装に有っては、圧着
時における圧着ツール１０とガラスステージ７ｂの平行
度は、数ミクロンの精度が必要である。The operation of the conventional TCP repair thermocompression bonding device is as described above. However, due to the connection mechanism shown in FIG. By evenly distributing and compressing
In the mounting for conducting the electrode 25 and the copper foil 26, the parallelism between the crimping tool 10 and the glass stage 7b at the time of crimping requires an accuracy of several microns.
【０００６】ところが、ＴＣＰ２３の圧着位置を設定す
る場合、ガラスステージ７ｂとパレット本体１４を、手
等により移動させるが、このとき、パレット本体１４
と、ガラスステージ７ｂとの接面の精度は均一ではない
ため、圧着時におけるガラスステージ７ｂとパレット本
体１４との平行度が狂ってしまう。したがって、圧着位
置を設定するたびに、圧着ツール１０の平行度を微調整
しなければならないと言う問題点を有していた。However, when the crimping position of the TCP 23 is set, the glass stage 7b and the pallet main body 14 are moved by hand or the like.
In addition, since the accuracy of the contact surface with the glass stage 7b is not uniform, the parallelism between the glass stage 7b and the pallet body 14 at the time of pressing is out of order. Therefore, there is a problem that the parallelism of the crimping tool 10 must be finely adjusted every time the crimping position is set.
【０００７】上記の問題点を解決する方法としては、液
晶パネル２１の一辺全体に、該一辺長に相当する長さの
ガラスステージ７ｂを用いることが考えられるが、この
場合、ガラスステージ７ｂは耐熱ガラスを使用してお
り、ガラス上面の平行度数ミクロンの加工が難しく、ガ
ラスステージ自体が高価なものとなってしまい、作製お
よびコストの点で問題があった。また、圧着ツール１０
を自動調芯にすると、圧着ツール１０がガラスステージ
７ｂに接触して平行になる時にＴＣＰ２３を横にずらす
力が発生して、ＴＣＰ２３の位置がずれてしまう。As a method of solving the above problem, it is conceivable to use a glass stage 7b having a length corresponding to the length of one side of the entire liquid crystal panel 21. In this case, the glass stage 7b is heat-resistant. Since glass is used, it is difficult to process the upper surface of the glass with a degree of parallelism of several microns, and the glass stage itself becomes expensive, and there is a problem in manufacturing and cost. Also, the crimping tool 10
When the self-alignment is performed, when the crimping tool 10 comes into contact with the glass stage 7b and becomes parallel, a force for laterally displacing the TCP 23 is generated, and the position of the TCP 23 is displaced.
【０００８】本発明は、このような課題に鑑みてなされ
たものであり、簡便にガラスステージの平面度を確保し
て、圧着ツールの平行度を微調整することなく、圧着処
理を行うことのできる熱圧着装置を提供することを目的
とする。SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and it is an object of the present invention to easily secure the flatness of a glass stage and perform a crimping process without finely adjusting the parallelism of a crimping tool. It is an object of the present invention to provide a thermocompression bonding apparatus that can perform the thermocompression bonding.
【０００９】[0009]
【課題を解決するための手段】上記の目的を達成するた
めに、第１の本発明（請求項１に対応）は、少なくとも
第１の部材、第２の部材および第３の部材を含む複数の
部材を、熱圧着により接合するための熱圧着装置であっ
て、ベースプレートと、前記ベースプレート上に設けら
れたガイド軸と、前記ガイド軸上を移動可能な、前記第
１、第２および第３の部材を載置するための載置テーブ
ルと、少なくとも前記第１の部材と第２の部材とを熱圧
着する、または第１の部材と第３の部材とを熱圧着する
ための熱圧着手段と、前記ベースプレート上に設けら
れ、前記熱圧着手段と対向している熱圧着補助手段とを
備え、前記熱圧着補助手段の一主面は、前記載置テーブ
ルの載置面と同一平面上に形成されるとともに、前記第
１の部材と第２の部材との間、または前記第１の部材と
第３の部材との間に配置され、少なくとも前記第１の部
材と第２の部材、または第１の部材と第３の部材は、前
記熱圧着手段と前記熱圧着補助手段の一主面との間に挟
まれて熱圧着されることを特徴とする熱圧着装置であ
る。In order to achieve the above object, a first aspect of the present invention (corresponding to claim 1) comprises a plurality of parts including at least a first member, a second member and a third member. A thermocompression bonding apparatus for bonding the members by thermocompression bonding, the base, a guide shaft provided on the base plate, and the first, second, and third members movable on the guide shaft. Thermocompression bonding means for thermocompression bonding at least the first member and the second member, or thermocompression bonding the first member and the third member, And a thermocompression bonding auxiliary means provided on the base plate and facing the thermocompression bonding means, and one main surface of the thermocompression bonding auxiliary means is on the same plane as the mounting surface of the mounting table. And the first member and the second part are formed. Or between the first member and the third member, and at least the first member and the second member, or the first member and the third member, are connected to the thermocompression bonding means. And a thermocompression bonding apparatus, wherein the thermocompression bonding device is sandwiched between the thermocompression bonding auxiliary means and one main surface of the thermocompression bonding means.
【００１０】また、第２の本発明（請求項２に対応）
は、前記熱圧着補助手段は、少なくとも前記一主面を含
む部分が耐熱ガラスにより形成されていることを特徴と
する上記本発明である。Further, the second invention (corresponding to claim 2)
In the present invention, the thermocompression bonding assisting means is characterized in that at least a portion including the one main surface is formed of heat-resistant glass.
【００１１】また、第３の本発明（請求項３に対応）
は、前記第１の部材はＴＣＰ（テープ・キャリア・パッ
ケージ）であり、前記第２の部材は液晶パネルを有し、
前記第３の部材は前記液晶パネルと協動する部材である
ことを特徴とする上記本発明である。Further, a third aspect of the present invention (corresponding to claim 3)
The first member is a TCP (tape carrier package), the second member has a liquid crystal panel,
The present invention is characterized in that the third member is a member that cooperates with the liquid crystal panel.
【００１２】また、以上のような本発明の熱圧着装置
は、液晶パネルの位置決め固定機能を有するパネル載せ
台を、ベースプレート上に固定したガラスステージに対
して、左右にスライドするように設け、スライド軸に取
り付けた圧着ツールを、上下にスライドさせて圧着する
構成にしている。In the thermocompression bonding apparatus of the present invention as described above, a panel mounting base having a function of positioning and fixing a liquid crystal panel is provided so as to slide left and right with respect to a glass stage fixed on a base plate. The crimping tool attached to the shaft is slid up and down to crimp.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態につい
て、図面を参照して説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００１４】図１、図２および図３は、本発明の実施の
形態によるＴＣＰリペア熱圧着装置の構成を示す図であ
る。図１に示すように、本実施の形態によるＴＣＰリペ
ア熱圧着装置は、装置ベースプレート１上に、平行な複
数本のガイド軸２を設け、そのガイド軸２上に、軸受け
１３で案内され水平に移動をするパネル載せ台５を取付
けられている。また、パネル載せ台５には、着脱自在な
連結部材３０にて、駆動用プリント基板２２を載せるた
めの基板載せテーブル２９が接続されている。パネル載
せ台５の上面には、位置決めプレート３ａ、３ｂおよび
複数個の吸着パッド４が設けられている。さらに装置ベ
ースプレート１上には、取り付け台８が備えられてお
り、取り付け台８の上部には、パネル載せ台５の一辺と
平行に固定された、ＴＣＰ個別長を有するガラスステー
ジ７ａが備えられている。また、パネル載せ台５および
ガラスステージ７ｂ上には、液晶パネル２１が載置さ
れ、このとき液晶パネル２１は、位置決めプレート３
ａ、３ｂで装置手前方向、及び左側方向へ端面片寄せさ
れながら、ガラスステージ７ａと該液晶パネル２１の奥
側端面部の下面とが接触するように載置される。FIGS. 1, 2 and 3 are views showing the configuration of a TCP repair thermocompression bonding apparatus according to an embodiment of the present invention. As shown in FIG. 1, the TCP repair thermocompression bonding apparatus according to the present embodiment is provided with a plurality of parallel guide shafts 2 on a device base plate 1, and is guided by bearings 13 on the guide shafts 2 and horizontally. A moving panel mounting base 5 is attached. A board mounting table 29 for mounting the driving printed circuit board 22 is connected to the panel mounting base 5 by a detachable connecting member 30. On the upper surface of the panel mounting table 5, positioning plates 3a and 3b and a plurality of suction pads 4 are provided. Further, a mounting table 8 is provided on the apparatus base plate 1, and a glass stage 7 a having a TCP individual length is fixed above the mounting table 8 and fixed in parallel with one side of the panel mounting table 5. I have. A liquid crystal panel 21 is mounted on the panel mounting table 5 and the glass stage 7b. At this time, the liquid crystal panel 21
The glass stage 7a and the lower surface of the rear end portion of the liquid crystal panel 21 are placed so that the end faces of the liquid crystal panel 21 are in contact with each other in the front and left directions of the apparatus at a and 3b.
【００１５】また、圧着ツール１０は、スライド軸１１
に案内されながら、エアーシリンダー１２の加圧力で垂
直に上下移動するものであり、ガラスステージ７ａとの
間に上記液晶パネル２１に載せられたＴＣＰ２３を挟ん
で熱圧着する手段である。The crimping tool 10 includes a slide shaft 11
Is vertically moved by the pressure of the air cylinder 12 while being guided by the air cylinder 12, and is a means for thermocompression bonding with the TCP 23 mounted on the liquid crystal panel 21 between the glass stage 7a and the glass stage 7a.
【００１６】さらにパネル載せ台５には、ＴＣＰ取付け
ピッチと同じ位置に溝を有する位置決めブロック６が設
けられており、位置決めブロック６の溝部には、コイル
ばね１９で押し当てられたピン２０が填るようになって
いて、このピン２０を手等で溝より外すことにより、パ
ネル載せ台５の定位置決めを行なうことができる。な
お、本実施の形態においては、図３に示すように、パネ
ル載せ台５に、位置決め用のピン穴を設けて位置決めプ
レート３を差し替えることにより、液晶パネル２１のＸ
端面側およびＹ端面側や、プリント配線基板２２のＸ側
やＹ側への切り替えを行なう。Further, the panel mounting table 5 is provided with a positioning block 6 having a groove at the same position as the TCP mounting pitch, and a pin 20 pressed by a coil spring 19 is inserted into the groove of the positioning block 6. By removing the pin 20 from the groove by hand or the like, the fixed position of the panel mounting base 5 can be performed. In the present embodiment, as shown in FIG. 3, the positioning of the positioning plate 3 by replacing the positioning plate 3 by providing a pin hole for positioning on the panel mounting base 5,
Switching is performed between the end surface side and the Y end surface side and the X side and the Y side of the printed wiring board 22.
【００１７】以上のような構成を有する、本発明の実施
の形態によるＴＣＰリペア熱圧着装置の動作について、
以下説明を行う。The operation of the TCP repair thermocompression bonding apparatus according to the embodiment of the present invention having the above configuration will be described.
The following is a description.
【００１８】図１において、パネル載せ台５に液晶パネ
ル２１を、圧着の対象となる端面を奥側にして位置決め
プレート３で装置手前方向、及び左側方向へ端面片寄し
ながら、パネル載せ台５の上面に組み込まれた吸着パッ
ド４で、真空吸着して搭載する。In FIG. 1, the liquid crystal panel 21 is placed on the panel mounting table 5 with the end face to be crimped on the back side, and the positioning plate 3 is used to shift the end face of the panel mounting table 5 toward the front and left sides of the apparatus. Vacuum suction and mounting are performed by the suction pad 4 incorporated on the upper surface.
【００１９】次に、パネル載せ台５を圧着する位置に固
定する、コイルばね１９で位置決めブロック６の溝部に
押し込めたピン２０を、手等で溝より外し、液晶パネル
２１のパネル載せ台５をＴＣＰ圧着位置が決まるまで左
右に移動させる。Next, the pin 20 pressed into the groove of the positioning block 6 by the coil spring 19 for fixing the panel mounting table 5 at the position where the panel mounting table 5 is crimped is removed from the groove by hand or the like. Move left and right until the TCP crimping position is determined.
【００２０】上記ベースプレート１上に、取付け台８で
パネル載せ台５と平行調整され固定したＴＣＰ個別長さ
のガラスステージ７ａに、液晶パネル２１の奥側ＴＣＰ
搭載部の下面が接触するように載置される。On the base plate 1, a TCP stage 7 a having a TCP individual length fixed in parallel with the panel mounting table 5 by the mounting table 8 and fixed to the rear side TCP of the liquid crystal panel 21.
It is mounted so that the lower surface of the mounting portion contacts.
【００２１】ベースプレート１上部に設置された圧着ツ
ール１０が、スライド軸１１に案内されながら、垂直に
上下移動し、ガラスステージ７ａとの間に、液晶パネル
２１に載せられたＴＣＰ２３を、挟んで圧着する。The crimping tool 10 installed on the upper portion of the base plate 1 is vertically moved while being guided by the slide shaft 11, and presses the TCP 23 mounted on the liquid crystal panel 21 between the crimping tool 10 and the glass stage 7a. I do.
【００２２】以上の動作において、ガラスステージ７ａ
は、取り付け台８を介してベースプレート１上に固定し
ており、ベースプレート１上を移動するのはパネル載せ
台５および基板載せテーブル２９のみである。したがっ
て、ガラスステージ７ａと、圧着ツール１０とは、常に
同一の平行度を保つことができる。In the above operation, the glass stage 7a
Are fixed on the base plate 1 via the mounting table 8, and only the panel mounting table 5 and the substrate mounting table 29 move on the base plate 1. Therefore, the glass stage 7a and the crimping tool 10 can always maintain the same parallelism.
【００２３】なお、本発明のベースプレートは、本実施
の形態の装置ベースプレートに、また、本発明の載置テ
ーブルは、本実施の形態のパネル載せ台５および基板載
せテーブル２９に、また、本発明の熱圧着手段は、本実
施の形態の圧着ツール１０に、また、本発明の熱圧着補
助手段は、本実施の形態のガラスステージ７ａおよび取
り付け台８にそれぞれ相当するものである。The base plate of the present invention is used for the apparatus base plate of the present embodiment, and the mounting table of the present invention is used for the panel mounting table 5 and the substrate mounting table 29 of the present embodiment. The thermocompression bonding means corresponds to the crimping tool 10 of the present embodiment, and the thermocompression bonding auxiliary means of the invention corresponds to the glass stage 7a and the mounting table 8 of the embodiment.
【００２４】[0024]
【発明の効果】以上のように本発明は、圧着ツールとガ
ラスステージの平行状態を一定に保つ事が可能で、圧着
位置を変えた場合でも、圧着ツールの平行度の微調整作
業が不用になり、又、部品も加工精度も高度な平面度加
工精度が不要となる。As described above, according to the present invention, the parallel state of the crimping tool and the glass stage can be kept constant, and even if the crimping position is changed, fine adjustment of the parallelism of the crimping tool is unnecessary. In addition, neither the parts nor the processing accuracy require a high degree of flatness processing accuracy.
【図１】本発明の実施の形態によるＴＣＰリペア本圧着
装置の側面図FIG. 1 is a side view of a TCP repair main crimping apparatus according to an embodiment of the present invention.
【図２】本発明の実施の形態によるＴＣＰリペア本圧着
装置の正面図FIG. 2 is a front view of the TCP repair main crimping apparatus according to the embodiment of the present invention.
【図３】本発明の実施の形態における液晶パネル搭載部
の詳細図FIG. 3 is a detailed view of a liquid crystal panel mounting portion according to the embodiment of the present invention.
【図４】従来例における液晶パネル搭載部の詳細図FIG. 4 is a detailed view of a liquid crystal panel mounting section in a conventional example.
【図５】液晶モジュール製品の斜視図FIG. 5 is a perspective view of a liquid crystal module product.
【図６】液晶モジュール製品の実装詳細図FIG. 6 is a detailed mounting diagram of a liquid crystal module product.
【図７】液晶モジュール実装の原理の説明図FIG. 7 is a diagram illustrating the principle of mounting a liquid crystal module.
１ ベースプレート ２ ガイド軸 ３ パネル位置決めプレート ４ 吸着パッド ５ パネル載せテーブル ６ テーブル位置決めプレート ７ 圧着ガラスステージ ８ 取付け台 ９ ヒーター １０ 圧着ツール １１ スライド軸 １２ エアーシリンダー １３ 軸受け １４ パレット本体 １５ ガイドレール １６ バックアッププレート １７ ガイドＡ １８ ガイドＢ １９ コイルばね ２０ 位置決めピン ２１ 液晶パネル ２２ 駆動用プリント配線基板 ２３ ＴＣＰ（テープ・キャリア・パッケージ） ２４ 異方導電性膜 ２５ 電極 ２６ 銅箔 ２７ 導電粒子 ２８ ブラケット Reference Signs List 1 base plate 2 guide shaft 3 panel positioning plate 4 suction pad 5 panel mounting table 6 table positioning plate 7 pressure bonding glass stage 8 mounting base 9 heater 10 pressure bonding tool 11 slide shaft 12 air cylinder 13 bearing 14 pallet body 15 guide rail 16 backup plate 17 Guide A 18 Guide B 19 Coil spring 20 Positioning pin 21 Liquid crystal panel 22 Printed wiring board for driving 23 TCP (tape carrier package) 24 Anisotropic conductive film 25 Electrode 26 Copper foil 27 Conductive particles 28 Bracket
Claims (3)
び第３の部材を含む複数の部材を、熱圧着により接合す
るための熱圧着装置であって、 ベースプレートと、 前記ベースプレート上に設けられたガイド軸と、 前記ガイド軸上を移動可能な、前記第１、第２および第
３の部材を載置するための載置テーブルと、 少なくとも前記第１の部材と第２の部材とを熱圧着す
る、または第１の部材と第３の部材とを熱圧着するため
の熱圧着手段と、 前記ベースプレート上に設けられ、前記熱圧着手段と対
向している熱圧着補助手段とを備え、 前記熱圧着補助手段の一主面は、前記載置テーブルの載
置面と同一平面上に形成されるとともに、前記第１の部
材と第２の部材との間、または前記第１の部材と第３の
部材との間に配置され、 少なくとも前記第１の部材と第２の部材、または第１の
部材と第３の部材は、前記熱圧着手段と前記熱圧着補助
手段の一主面との間に挟まれて熱圧着されることを特徴
とする熱圧着装置。1. A thermocompression bonding apparatus for bonding a plurality of members including at least a first member, a second member, and a third member by thermocompression bonding, wherein the thermocompression bonding device is provided on the base plate. A mounting table for mounting the first, second, and third members movable on the guide shaft; and a heat table for heating at least the first member and the second member. Thermocompression bonding means for thermocompression bonding or thermocompression bonding of the first member and the third member; and thermocompression bonding auxiliary means provided on the base plate and facing the thermocompression bonding means, One main surface of the thermocompression bonding assisting means is formed on the same plane as the mounting surface of the mounting table, and between the first member and the second member, or between the first member and the second member. 3 and at least before The first member and the second member, or the first member and the third member, are sandwiched between the thermocompression bonding unit and one main surface of the thermocompression bonding auxiliary unit and thermocompression-bonded. Thermocompression bonding equipment.
一主面を含む部分が耐熱ガラスにより形成されているこ
とを特徴とする請求項１に記載の熱圧着装置。2. The thermocompression bonding apparatus according to claim 1, wherein the thermocompression bonding assisting means has at least a portion including the one main surface made of heat-resistant glass.
リア・パッケージ）であり、前記第２の部材は液晶パネ
ルを有し、前記第３の部材は前記液晶パネルと協動する
部材であることを特徴とする請求項１または２に記載の
熱圧着装置。3. The first member is a TCP (tape carrier package), the second member has a liquid crystal panel, and the third member is a member cooperating with the liquid crystal panel. The thermocompression bonding apparatus according to claim 1 or 2, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000006953A JP2001196422A (en) | 2000-01-14 | 2000-01-14 | Thermocompression bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000006953A JP2001196422A (en) | 2000-01-14 | 2000-01-14 | Thermocompression bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001196422A true JP2001196422A (en) | 2001-07-19 |
Family
ID=18535403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000006953A Pending JP2001196422A (en) | 2000-01-14 | 2000-01-14 | Thermocompression bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001196422A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006126294A (en) * | 2004-10-26 | 2006-05-18 | Toshiba Matsushita Display Technology Co Ltd | Planar display device |
| JP2006210504A (en) * | 2005-01-26 | 2006-08-10 | Osaki Engineering Co Ltd | Method of connecting electronic device |
| CN101515076B (en) * | 2009-02-16 | 2011-06-15 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
-
2000
- 2000-01-14 JP JP2000006953A patent/JP2001196422A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006126294A (en) * | 2004-10-26 | 2006-05-18 | Toshiba Matsushita Display Technology Co Ltd | Planar display device |
| JP2006210504A (en) * | 2005-01-26 | 2006-08-10 | Osaki Engineering Co Ltd | Method of connecting electronic device |
| CN101515076B (en) * | 2009-02-16 | 2011-06-15 | 太原风华信息装备股份有限公司 | Main pressure mechanism used for a liquid crystal display (LCD) module binding process |
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