JP4128513B2 - ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム - Google Patents

ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム Download PDF

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Publication number
JP4128513B2
JP4128513B2 JP2003348887A JP2003348887A JP4128513B2 JP 4128513 B2 JP4128513 B2 JP 4128513B2 JP 2003348887 A JP2003348887 A JP 2003348887A JP 2003348887 A JP2003348887 A JP 2003348887A JP 4128513 B2 JP4128513 B2 JP 4128513B2
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Japan
Prior art keywords
image
positioning pattern
reference image
pattern
conversion
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Expired - Fee Related
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JP2003348887A
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English (en)
Japanese (ja)
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JP2005116765A5 (https=
JP2005116765A (ja
Inventor
聡 榎戸
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Shinkawa Ltd
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Shinkawa Ltd
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Publication date
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Priority to JP2003348887A priority Critical patent/JP4128513B2/ja
Priority to US10/959,241 priority patent/US7224829B2/en
Publication of JP2005116765A publication Critical patent/JP2005116765A/ja
Publication of JP2005116765A5 publication Critical patent/JP2005116765A5/ja
Priority to US11/582,585 priority patent/US7321681B2/en
Priority to US11/582,586 priority patent/US7324683B2/en
Application granted granted Critical
Publication of JP4128513B2 publication Critical patent/JP4128513B2/ja
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G06T7/73—Determining position or orientation of objects or cameras using feature-based methods
    • G06T7/74—Determining position or orientation of objects or cameras using feature-based methods involving reference images or patches
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/20—Image preprocessing
    • G06V10/24—Aligning, centring, orientation detection or correction of the image
    • G06V10/243—Aligning, centring, orientation detection or correction of the image by compensating for image skew or non-uniform image deformations
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/46—Descriptors for shape, contour or point-related descriptors, e.g. scale invariant feature transform [SIFT] or bags of words [BoW]; Salient regional features
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/32—Wires
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Image Processing (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2003348887A 2003-10-07 2003-10-07 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム Expired - Fee Related JP4128513B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003348887A JP4128513B2 (ja) 2003-10-07 2003-10-07 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム
US10/959,241 US7224829B2 (en) 2003-10-07 2004-10-06 Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
US11/582,585 US7321681B2 (en) 2003-10-07 2006-10-16 Bonding pattern discrimination program
US11/582,586 US7324683B2 (en) 2003-10-07 2006-10-16 Bonding pattern discrimination device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003348887A JP4128513B2 (ja) 2003-10-07 2003-10-07 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム

Publications (3)

Publication Number Publication Date
JP2005116765A JP2005116765A (ja) 2005-04-28
JP2005116765A5 JP2005116765A5 (https=) 2006-01-26
JP4128513B2 true JP4128513B2 (ja) 2008-07-30

Family

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Family Applications (1)

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JP2003348887A Expired - Fee Related JP4128513B2 (ja) 2003-10-07 2003-10-07 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム

Country Status (2)

Country Link
US (3) US7224829B2 (https=)
JP (1) JP4128513B2 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4128513B2 (ja) * 2003-10-07 2008-07-30 株式会社新川 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム
JP5006357B2 (ja) * 2009-03-11 2012-08-22 株式会社東芝 ボンディング方法およびボンディング装置
KR20100130654A (ko) * 2009-06-01 2010-12-14 삼성전자주식회사 영상 데이터 처리 방법
JP5409237B2 (ja) * 2009-09-28 2014-02-05 キヤノン株式会社 パターン検出装置、その処理方法及びプログラム
US8091762B1 (en) * 2010-12-08 2012-01-10 Asm Assembly Automation Ltd Wedge bonding method incorporating remote pattern recognition system
US9393641B2 (en) * 2010-12-29 2016-07-19 Orthodyne Electronics Corporation Methods and systems for aligning tooling elements of ultrasonic bonding systems
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
WO2018216132A1 (ja) * 2017-05-24 2018-11-29 株式会社Ｆｕｊｉ 測定位置決定装置
JP7454975B2 (ja) * 2020-03-23 2024-03-25 Juki株式会社 画像処理装置及び画像処理方法
KR102792630B1 (ko) * 2020-11-23 2025-04-04 세메스 주식회사 다이 본딩 방법
CN114200532B (zh) * 2021-12-14 2024-05-14 中国航发南方工业有限公司 航空发动机铸件机匣内多余物的检测装置及检测方法
CN115278184B (zh) * 2022-07-18 2024-03-15 峰米(重庆)创新科技有限公司 投影画面校正方法及装置
CN117637501B (zh) * 2023-11-28 2024-10-15 武汉新芯集成电路股份有限公司 键合装置及键合方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356764A (ja) 1986-08-28 1988-03-11 Toshiba Corp 画像処理装置
JPH0258845A (ja) * 1988-08-25 1990-02-28 Toshiba Corp 超音波ワイヤボンディング装置
JP2953116B2 (ja) * 1991-06-11 1999-09-27 日本電気株式会社 ワイヤーボンディング装置
US6205259B1 (en) * 1992-04-09 2001-03-20 Olympus Optical Co., Ltd. Image processing apparatus
EP0651337A4 (en) 1992-07-03 1996-07-03 Omron Tateisi Electronics Co IMAGE DETECTION METHOD, DEVICE AND IMAGE PROCESSING METHOD AND DEVICE.
JP3243894B2 (ja) * 1993-06-04 2002-01-07 オムロン株式会社 濃淡画像処理装置
JP2991593B2 (ja) * 1993-08-19 1999-12-20 株式会社東京精密 ダイシング装置の半導体ウェハ形状認識装置
DE69529501T2 (de) * 1994-04-18 2003-12-11 Micron Technology, Inc. Verfahren und vorrichtung zum automatischen positionieren elektronischer würfel in bauteilverpackungen
US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
JP3143038B2 (ja) * 1994-11-18 2001-03-07 株式会社日立製作所 自動焦点合わせ方法及び装置並びに三次元形状検出方法及びその装置
SG54995A1 (en) * 1996-01-31 1998-12-21 Texas Instr Singapore Pet Ltd Method and apparatus for aligning the position of die on a wafer table
JPH11163047A (ja) * 1997-11-27 1999-06-18 Toshiba Corp 半導体装置の製造方法及びその装置
JPH11218412A (ja) * 1998-02-02 1999-08-10 Shinkawa Ltd ボンディング装置
JP4446609B2 (ja) * 2001-01-11 2010-04-07 株式会社新川 画像処理方法および装置
JP2002319028A (ja) * 2001-04-20 2002-10-31 Shinkawa Ltd 画像処理方法、同装置、およびボンディング装置
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
JP4088232B2 (ja) * 2003-10-07 2008-05-21 株式会社新川 ボンディング方法、ボンディング装置及びボンディングプログラム
JP4128513B2 (ja) * 2003-10-07 2008-07-30 株式会社新川 ボンディング用パターン識別方法、ボンディング用パターン識別装置及びボンディング用パターン識別プログラム

Also Published As

Publication number Publication date
US7321681B2 (en) 2008-01-22
US7324683B2 (en) 2008-01-29
JP2005116765A (ja) 2005-04-28
US7224829B2 (en) 2007-05-29
US20050167470A1 (en) 2005-08-04
US20070036424A1 (en) 2007-02-15
US20070036423A1 (en) 2007-02-15

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