JP4120581B2 - パワーモジュール - Google Patents

パワーモジュール Download PDF

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Publication number
JP4120581B2
JP4120581B2 JP2003427683A JP2003427683A JP4120581B2 JP 4120581 B2 JP4120581 B2 JP 4120581B2 JP 2003427683 A JP2003427683 A JP 2003427683A JP 2003427683 A JP2003427683 A JP 2003427683A JP 4120581 B2 JP4120581 B2 JP 4120581B2
Authority
JP
Japan
Prior art keywords
electrode
metal
electrode terminal
power module
power element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003427683A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004096135A5 (https=
JP2004096135A (ja
Inventor
雄二 八木
厚志 塚田
宏 長瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Central R&D Labs Inc
Original Assignee
Toyota Central R&D Labs Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Central R&D Labs Inc filed Critical Toyota Central R&D Labs Inc
Priority to JP2003427683A priority Critical patent/JP4120581B2/ja
Publication of JP2004096135A publication Critical patent/JP2004096135A/ja
Publication of JP2004096135A5 publication Critical patent/JP2004096135A5/ja
Application granted granted Critical
Publication of JP4120581B2 publication Critical patent/JP4120581B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07635—Applying EM radiation, e.g. induction heating or using a laser
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003427683A 2003-12-24 2003-12-24 パワーモジュール Expired - Fee Related JP4120581B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003427683A JP4120581B2 (ja) 2003-12-24 2003-12-24 パワーモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003427683A JP4120581B2 (ja) 2003-12-24 2003-12-24 パワーモジュール

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP24008398A Division JP3525753B2 (ja) 1998-08-26 1998-08-26 パワーモジュール

Publications (3)

Publication Number Publication Date
JP2004096135A JP2004096135A (ja) 2004-03-25
JP2004096135A5 JP2004096135A5 (https=) 2005-05-26
JP4120581B2 true JP4120581B2 (ja) 2008-07-16

Family

ID=32064828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003427683A Expired - Fee Related JP4120581B2 (ja) 2003-12-24 2003-12-24 パワーモジュール

Country Status (1)

Country Link
JP (1) JP4120581B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7619302B2 (en) * 2006-05-23 2009-11-17 International Rectifier Corporation Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
JP5103863B2 (ja) 2006-10-16 2012-12-19 富士電機株式会社 半導体装置
JP2015119072A (ja) 2013-12-19 2015-06-25 富士電機株式会社 レーザ溶接方法、レーザ溶接治具、半導体装置
JP6684996B2 (ja) * 2015-07-29 2020-04-22 パナソニックＩｐマネジメント株式会社 半導体装置
KR101703724B1 (ko) * 2015-12-09 2017-02-07 현대오트론 주식회사 파워 모듈 패키지
CN108292656B (zh) * 2016-01-31 2020-12-22 新电元工业株式会社 半导体模块
DE102022207522A1 (de) * 2022-07-22 2024-01-25 Zf Friedrichshafen Ag Leistungsmodul

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07118514B2 (ja) * 1989-04-24 1995-12-18 株式会社東芝 半田バンプ型半導体装置
DE4103486A1 (de) * 1991-02-06 1992-08-20 Abb Patent Gmbh Anordnung zur kuehlung waermeerzeugender bauelemente
JP3216305B2 (ja) * 1993-03-11 2001-10-09 株式会社日立製作所 半導体装置
JPH07273276A (ja) * 1994-03-28 1995-10-20 Nissan Motor Co Ltd パワー素子とスナバ素子の接続構造及びその実装構造
JP3433279B2 (ja) * 1995-11-09 2003-08-04 株式会社日立製作所 半導体装置
JP3879150B2 (ja) * 1996-08-12 2007-02-07 株式会社デンソー 半導体装置
WO1998012748A1 (en) * 1996-09-18 1998-03-26 Hitachi, Ltd. Junction semiconductor module

Also Published As

Publication number Publication date
JP2004096135A (ja) 2004-03-25

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