JP4105996B2 - ワイヤボンディング方法 - Google Patents

ワイヤボンディング方法 Download PDF

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Publication number
JP4105996B2
JP4105996B2 JP2003279556A JP2003279556A JP4105996B2 JP 4105996 B2 JP4105996 B2 JP 4105996B2 JP 2003279556 A JP2003279556 A JP 2003279556A JP 2003279556 A JP2003279556 A JP 2003279556A JP 4105996 B2 JP4105996 B2 JP 4105996B2
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JP
Japan
Prior art keywords
wire
ball
neck height
bond point
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003279556A
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English (en)
Japanese (ja)
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JP2005045135A (ja
Inventor
竜成 三井
直希 関根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
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Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2003279556A priority Critical patent/JP4105996B2/ja
Priority to TW093115630A priority patent/TW200504902A/zh
Priority to KR1020040052573A priority patent/KR100571344B1/ko
Publication of JP2005045135A publication Critical patent/JP2005045135A/ja
Application granted granted Critical
Publication of JP4105996B2 publication Critical patent/JP4105996B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H10W72/0711—
    • H10W72/071—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5434—
    • H10W72/5522—
    • H10W72/59—
    • H10W90/756—

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  • Wire Bonding (AREA)
JP2003279556A 2003-07-25 2003-07-25 ワイヤボンディング方法 Expired - Fee Related JP4105996B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003279556A JP4105996B2 (ja) 2003-07-25 2003-07-25 ワイヤボンディング方法
TW093115630A TW200504902A (en) 2003-07-25 2004-06-01 Wire-bonding method
KR1020040052573A KR100571344B1 (ko) 2003-07-25 2004-07-07 와이어 본딩방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003279556A JP4105996B2 (ja) 2003-07-25 2003-07-25 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
JP2005045135A JP2005045135A (ja) 2005-02-17
JP4105996B2 true JP4105996B2 (ja) 2008-06-25

Family

ID=34265628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003279556A Expired - Fee Related JP4105996B2 (ja) 2003-07-25 2003-07-25 ワイヤボンディング方法

Country Status (3)

Country Link
JP (1) JP4105996B2 (cg-RX-API-DMAC10.html)
KR (1) KR100571344B1 (cg-RX-API-DMAC10.html)
TW (1) TW200504902A (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0838127A (ja) * 1994-08-04 1996-02-13 Asahi Chem Ind Co Ltd 非コーヒー乳性飲料及びその製法
TWI372453B (en) 2008-09-01 2012-09-11 Advanced Semiconductor Eng Copper bonding wire, wire bonding structure and method for processing and bonding a wire
US8110931B2 (en) 2008-07-11 2012-02-07 Advanced Semiconductor Engineering, Inc. Wafer and semiconductor package
TWI415707B (zh) * 2008-09-01 2013-11-21 日月光半導體製造股份有限公司 銅製銲線、銲線接合結構及銲線接合方法
JP2011054727A (ja) * 2009-09-01 2011-03-17 Oki Semiconductor Co Ltd 半導体装置、その製造方法、及びワイヤボンディング方法
CN102097317B (zh) * 2010-12-01 2015-04-29 佛山市南海区宏乾电子有限公司 一种全包封装开关电源三极管的生产方法
JP5890798B2 (ja) * 2013-05-27 2016-03-22 ラピスセミコンダクタ株式会社 半導体装置及びその製造方法
JP2016535463A (ja) 2014-10-03 2016-11-10 インテル コーポレイション 垂直コラムを有するオーバラップ形スタック化ダイパッケージ
JP6166769B2 (ja) * 2015-12-11 2017-07-19 ラピスセミコンダクタ株式会社 半導体装置
CN119016828A (zh) * 2023-05-26 2024-11-26 长江存储科技有限责任公司 引线键合装置、引线键合方法及半导体器件

Also Published As

Publication number Publication date
TW200504902A (en) 2005-02-01
KR20050013074A (ko) 2005-02-02
TWI323013B (cg-RX-API-DMAC10.html) 2010-04-01
KR100571344B1 (ko) 2006-04-14
JP2005045135A (ja) 2005-02-17

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