TW200504902A - Wire-bonding method - Google Patents

Wire-bonding method

Info

Publication number
TW200504902A
TW200504902A TW093115630A TW93115630A TW200504902A TW 200504902 A TW200504902 A TW 200504902A TW 093115630 A TW093115630 A TW 093115630A TW 93115630 A TW93115630 A TW 93115630A TW 200504902 A TW200504902 A TW 200504902A
Authority
TW
Taiwan
Prior art keywords
ball
neck portion
bonding
high neck
wire
Prior art date
Application number
TW093115630A
Other languages
English (en)
Chinese (zh)
Other versions
TWI323013B (cg-RX-API-DMAC10.html
Inventor
Tatsunari Mitsui
Naoki Sekine
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200504902A publication Critical patent/TW200504902A/zh
Application granted granted Critical
Publication of TWI323013B publication Critical patent/TWI323013B/zh

Links

Classifications

    • H10W72/0711—
    • H10W72/071—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5434—
    • H10W72/5522—
    • H10W72/59—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
TW093115630A 2003-07-25 2004-06-01 Wire-bonding method TW200504902A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003279556A JP4105996B2 (ja) 2003-07-25 2003-07-25 ワイヤボンディング方法

Publications (2)

Publication Number Publication Date
TW200504902A true TW200504902A (en) 2005-02-01
TWI323013B TWI323013B (cg-RX-API-DMAC10.html) 2010-04-01

Family

ID=34265628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115630A TW200504902A (en) 2003-07-25 2004-06-01 Wire-bonding method

Country Status (3)

Country Link
JP (1) JP4105996B2 (cg-RX-API-DMAC10.html)
KR (1) KR100571344B1 (cg-RX-API-DMAC10.html)
TW (1) TW200504902A (cg-RX-API-DMAC10.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097317A (zh) * 2010-12-01 2011-06-15 庄玉巧 一种全包封装开关电源三极管的生产方法
US8053906B2 (en) 2008-07-11 2011-11-08 Advanced Semiconductor Engineering, Inc. Semiconductor package and method for processing and bonding a wire
US8110931B2 (en) 2008-07-11 2012-02-07 Advanced Semiconductor Engineering, Inc. Wafer and semiconductor package
TWI415707B (zh) * 2008-09-01 2013-11-21 日月光半導體製造股份有限公司 銅製銲線、銲線接合結構及銲線接合方法
TWI578466B (zh) * 2014-10-03 2017-04-11 英特爾股份有限公司 具有垂直柱之重疊堆疊的晶粒封裝

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0838127A (ja) * 1994-08-04 1996-02-13 Asahi Chem Ind Co Ltd 非コーヒー乳性飲料及びその製法
JP2011054727A (ja) * 2009-09-01 2011-03-17 Oki Semiconductor Co Ltd 半導体装置、その製造方法、及びワイヤボンディング方法
JP5890798B2 (ja) * 2013-05-27 2016-03-22 ラピスセミコンダクタ株式会社 半導体装置及びその製造方法
JP6166769B2 (ja) * 2015-12-11 2017-07-19 ラピスセミコンダクタ株式会社 半導体装置
CN119016828A (zh) * 2023-05-26 2024-11-26 长江存储科技有限责任公司 引线键合装置、引线键合方法及半导体器件

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8053906B2 (en) 2008-07-11 2011-11-08 Advanced Semiconductor Engineering, Inc. Semiconductor package and method for processing and bonding a wire
US8110931B2 (en) 2008-07-11 2012-02-07 Advanced Semiconductor Engineering, Inc. Wafer and semiconductor package
TWI415707B (zh) * 2008-09-01 2013-11-21 日月光半導體製造股份有限公司 銅製銲線、銲線接合結構及銲線接合方法
CN102097317A (zh) * 2010-12-01 2011-06-15 庄玉巧 一种全包封装开关电源三极管的生产方法
CN102097317B (zh) * 2010-12-01 2015-04-29 佛山市南海区宏乾电子有限公司 一种全包封装开关电源三极管的生产方法
TWI578466B (zh) * 2014-10-03 2017-04-11 英特爾股份有限公司 具有垂直柱之重疊堆疊的晶粒封裝
US10256208B2 (en) 2014-10-03 2019-04-09 Intel Corporation Overlapping stacked die package with vertical columns
US10629561B2 (en) 2014-10-03 2020-04-21 Intel Corporation Overlapping stacked die package with vertical columns

Also Published As

Publication number Publication date
JP4105996B2 (ja) 2008-06-25
KR20050013074A (ko) 2005-02-02
TWI323013B (cg-RX-API-DMAC10.html) 2010-04-01
KR100571344B1 (ko) 2006-04-14
JP2005045135A (ja) 2005-02-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees