JP4105950B2 - 基板の磁気レオロジー的仕上げ装置 - Google Patents
基板の磁気レオロジー的仕上げ装置 Download PDFInfo
- Publication number
- JP4105950B2 JP4105950B2 JP2002560827A JP2002560827A JP4105950B2 JP 4105950 B2 JP4105950 B2 JP 4105950B2 JP 2002560827 A JP2002560827 A JP 2002560827A JP 2002560827 A JP2002560827 A JP 2002560827A JP 4105950 B2 JP4105950 B2 JP 4105950B2
- Authority
- JP
- Japan
- Prior art keywords
- wheel
- carrier
- carrier wheel
- magnetorheological
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
- B24B31/112—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using magnetically consolidated grinding powder, moved relatively to the workpiece under the influence of pressure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Liquid Crystal (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
毛管粘度計は、流体送出し装置内であって、流体送出し装置の出口においてホイール表面上に配置される。流量計及び粘度計からの出力信号は、コンピューターのアルゴリズムに入力されて、コンピューターはホイールへ送り出されるMRFの見かけ粘度を計算すると共に粘度計前方の混合室内の再循環MRFに対して担体流体を補充する割合を制御して、見かけ粘度を目標値に調節する。
第1は、磁極片はホイールの縁部の下方において球体の被包体の外側から伸長し、ホイールはその被包体から出ており、且つ磁極片はその球体表面に略接しているから、磁極片が立体的な障害となり、従来技術の装置は、例えば、ホイールの半径と略同等の曲率半径を有する大きさのレンズのような大きな凹状対象物を仕上げることができなかった。
Claims (5)
- 基板の磁気レオロジー的仕上げ装置において、
a)フレームと、
b)前記フレーム上に回転自在に取り付けられたキャリア・ホイールであって、該キャリア・ホイールは中空の内部を有し、該キャリア・ホイールの外面は作業領域内の磁気レオロジー的流体のためのキャリア面を画成し、該キャリア・ホイールは球体の赤道部分である前記キャリア・ホイールと、
c)前記キャリア面上の前記磁気レオロジー的流体を硬化させるために前記フレーム上に取り付けられた磁石装置であって、前記球体の突出した被包体内に配置された前記磁石装置と、を具備し、
前記磁石装置は、
コアの周りに巻き線を有する電磁石と、
前記コアの反対側端部に取り付けられた第1及び第2のヨーク片であって、略平行に伸長して前記キャリア面の内壁に近接する前記第1及び第2のヨーク片と、
前記第1及び第2のヨーク片に対して且つこれら部材間に夫々取り付けられる第1及び第2の極片であって、互いの方向へ伸長して、互いの間に磁気的空隙を前記内壁に近接して画成し、これにより、前記キャリア面上の作業領域内に磁界を生じさせる前記第1及び第2の極片と、を含む、
ことを特徴とする基板の磁気レオロジー的仕上げ装置。 - 請求項1記載の基板の磁気レオロジー的仕上げ装置において、
前記第1及び第2のヨーク片は、前記キャリア・ホイールの中心角約120度にわたって伸長することを特徴とする基板の磁気レオロジー的仕上げ装置。 - 請求項1記載の基板の磁気レオロジー的仕上げ装置において、
前記作業領域は、前記キャリア面上であって前記キャリア・ホイールの頂部死点位置のまわりに存在することを特徴とする基板の磁気レオロジー的仕上げ装置。 - 基板の磁気レオロジー的仕上げ装置において、
a)フレームと、
b)前記フレーム上に回転自在に取り付けられたキャリア・ホイールであって、該キャリア・ホイールは中空の内部を有し、該キャリア・ホイールの外面は作業領域内の磁気レオロジー的流体のためのキャリア面を画成し、該キャリア・ホイールは球体の赤道部分である前記キャリア・ホイールと、
c)前記キャリア面上の前記磁気レオロジー的流体を硬化させるために前記フレーム上に取り付けられた磁石装置であって、前記球体の突出した被包体内に配置された前記磁石装置と、を具備し、
前記作業領域は、前記キャリア面上であって前記キャリア・ホイールの底部死点位置のまわりに存在することを特徴とする基板の磁気レオロジー的仕上げ装置。 - 請求項1記載の基板の磁気レオロジー的仕上げ装置において、
前記磁石装置は、前記キャリア・ホイール内に配置されることを特徴とする基板の磁気レオロジー的仕上げ装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/775,282 US6506102B2 (en) | 2001-02-01 | 2001-02-01 | System for magnetorheological finishing of substrates |
PCT/US2002/002667 WO2002060646A1 (en) | 2001-02-01 | 2002-01-31 | System for magnetorheological finishing of substrates |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004520948A JP2004520948A (ja) | 2004-07-15 |
JP2004520948A5 JP2004520948A5 (ja) | 2005-06-09 |
JP4105950B2 true JP4105950B2 (ja) | 2008-06-25 |
Family
ID=25103919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002560827A Expired - Lifetime JP4105950B2 (ja) | 2001-02-01 | 2002-01-31 | 基板の磁気レオロジー的仕上げ装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6506102B2 (ja) |
EP (1) | EP1365889B1 (ja) |
JP (1) | JP4105950B2 (ja) |
AT (1) | ATE469729T1 (ja) |
DE (1) | DE60236577D1 (ja) |
ES (1) | ES2344340T3 (ja) |
WO (1) | WO2002060646A1 (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7091412B2 (en) * | 2002-03-04 | 2006-08-15 | Nanoset, Llc | Magnetically shielded assembly |
US7162302B2 (en) * | 2002-03-04 | 2007-01-09 | Nanoset Llc | Magnetically shielded assembly |
US20040210289A1 (en) * | 2002-03-04 | 2004-10-21 | Xingwu Wang | Novel nanomagnetic particles |
US6746310B2 (en) * | 2002-08-06 | 2004-06-08 | Qed Technologies, Inc. | Uniform thin films produced by magnetorheological finishing |
US20070010702A1 (en) * | 2003-04-08 | 2007-01-11 | Xingwu Wang | Medical device with low magnetic susceptibility |
US20050025797A1 (en) * | 2003-04-08 | 2005-02-03 | Xingwu Wang | Medical device with low magnetic susceptibility |
US20050155779A1 (en) * | 2003-04-08 | 2005-07-21 | Xingwu Wang | Coated substrate assembly |
US20060102871A1 (en) * | 2003-04-08 | 2006-05-18 | Xingwu Wang | Novel composition |
US20050149002A1 (en) * | 2003-04-08 | 2005-07-07 | Xingwu Wang | Markers for visualizing interventional medical devices |
US20050119725A1 (en) * | 2003-04-08 | 2005-06-02 | Xingwu Wang | Energetically controlled delivery of biologically active material from an implanted medical device |
US20050149169A1 (en) * | 2003-04-08 | 2005-07-07 | Xingwu Wang | Implantable medical device |
US20050079132A1 (en) * | 2003-04-08 | 2005-04-14 | Xingwu Wang | Medical device with low magnetic susceptibility |
US20040254419A1 (en) * | 2003-04-08 | 2004-12-16 | Xingwu Wang | Therapeutic assembly |
US20070149496A1 (en) * | 2003-10-31 | 2007-06-28 | Jack Tuszynski | Water-soluble compound |
US20050249667A1 (en) * | 2004-03-24 | 2005-11-10 | Tuszynski Jack A | Process for treating a biological organism |
US20060118758A1 (en) * | 2004-09-15 | 2006-06-08 | Xingwu Wang | Material to enable magnetic resonance imaging of implantable medical devices |
US7959490B2 (en) * | 2005-10-31 | 2011-06-14 | Depuy Products, Inc. | Orthopaedic component manufacturing method and equipment |
US7312154B2 (en) * | 2005-12-20 | 2007-12-25 | Corning Incorporated | Method of polishing a semiconductor-on-insulator structure |
KR101333479B1 (ko) * | 2009-03-06 | 2013-11-26 | 퀘드 테크놀러지즈 인터내셔날, 인크. | 기판의 자기유변 마감을 수행하는 시스템 |
WO2011115131A1 (ja) | 2010-03-16 | 2011-09-22 | 旭硝子株式会社 | Euvリソグラフィ光学部材用基材およびその製造方法 |
US9102030B2 (en) * | 2010-07-09 | 2015-08-11 | Corning Incorporated | Edge finishing apparatus |
US8896293B2 (en) * | 2010-12-23 | 2014-11-25 | Qed Technologies International, Inc. | Method and apparatus for measurement and control of magnetic particle concentration in a magnetorheological fluid |
US8613640B2 (en) * | 2010-12-23 | 2013-12-24 | Qed Technologies International, Inc. | System for magnetorheological finishing of substrates |
CN103447891B (zh) * | 2013-08-26 | 2015-12-09 | 中国科学院光电技术研究所 | 一种磁流变高精度定位装置及磁流变去除函数转换方法 |
CN111230602B (zh) * | 2020-02-17 | 2021-07-09 | 辽宁科技大学 | 一种自识别多角度磁极头化学磁粒研磨加工装置 |
CN113352152B (zh) * | 2020-02-20 | 2022-12-06 | 中国科学院长春光学精密机械与物理研究所 | 一种基于机械臂的磁流变抛光加工系统 |
CN113664698B (zh) * | 2021-09-14 | 2022-06-10 | 浙江师范大学 | 一种磁控模量平面抛光装置及抛光方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5795212A (en) * | 1995-10-16 | 1998-08-18 | Byelocorp Scientific, Inc. | Deterministic magnetorheological finishing |
US5951369A (en) | 1999-01-06 | 1999-09-14 | Qed Technologies, Inc. | System for magnetorheological finishing of substrates |
-
2001
- 2001-02-01 US US09/775,282 patent/US6506102B2/en not_active Expired - Lifetime
-
2002
- 2002-01-31 WO PCT/US2002/002667 patent/WO2002060646A1/en active Application Filing
- 2002-01-31 EP EP02707621A patent/EP1365889B1/en not_active Expired - Lifetime
- 2002-01-31 ES ES02707621T patent/ES2344340T3/es not_active Expired - Lifetime
- 2002-01-31 JP JP2002560827A patent/JP4105950B2/ja not_active Expired - Lifetime
- 2002-01-31 AT AT02707621T patent/ATE469729T1/de not_active IP Right Cessation
- 2002-01-31 DE DE60236577T patent/DE60236577D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6506102B2 (en) | 2003-01-14 |
JP2004520948A (ja) | 2004-07-15 |
EP1365889B1 (en) | 2010-06-02 |
US20020102928A1 (en) | 2002-08-01 |
WO2002060646A1 (en) | 2002-08-08 |
ATE469729T1 (de) | 2010-06-15 |
EP1365889A1 (en) | 2003-12-03 |
EP1365889A4 (en) | 2004-11-03 |
DE60236577D1 (de) | 2010-07-15 |
ES2344340T3 (es) | 2010-08-25 |
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