JP4104461B2 - Cac部品の腐食防止 - Google Patents
Cac部品の腐食防止 Download PDFInfo
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- JP4104461B2 JP4104461B2 JP2002567537A JP2002567537A JP4104461B2 JP 4104461 B2 JP4104461 B2 JP 4104461B2 JP 2002567537 A JP2002567537 A JP 2002567537A JP 2002567537 A JP2002567537 A JP 2002567537A JP 4104461 B2 JP4104461 B2 JP 4104461B2
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- Prior art keywords
- copper foil
- sheet
- aluminum
- copper
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005260 corrosion Methods 0.000 title description 4
- 230000007797 corrosion Effects 0.000 title description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 125
- 239000011889 copper foil Substances 0.000 claims description 82
- 229910052782 aluminium Inorganic materials 0.000 claims description 72
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 72
- 239000000758 substrate Substances 0.000 claims description 39
- 239000010949 copper Substances 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 229910000077 silane Inorganic materials 0.000 claims description 12
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 238000011109 contamination Methods 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims 7
- 229910001316 Ag alloy Inorganic materials 0.000 claims 5
- 229910001020 Au alloy Inorganic materials 0.000 claims 5
- 229910000599 Cr alloy Inorganic materials 0.000 claims 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims 5
- 229910052804 chromium Inorganic materials 0.000 claims 5
- 239000003353 gold alloy Substances 0.000 claims 2
- 239000011253 protective coating Substances 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 239000002689 soil Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 11
- 238000003475 lamination Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- -1 silane compound Chemical class 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12431—Foil or filament smaller than 6 mils
- Y10T428/12438—Composite
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12736—Al-base component
- Y10T428/1275—Next to Group VIII or IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
Description
また、前記汚れおよび/または腐食問題を防止するため塗布されたアルミニウム支持基板を有する前記の銅/アルミニウム/銅の部品を提供するのが本発明の目的である。
図面を参照するに際して、図面は発明の望ましい実施の形態を図解する目的のためだけのものであり、発明を図1の断面に示す部品10(銅/アルミニウム/銅の頭文字であるCACとしても知られている)に限定する目的のためではない。部品10は保護膜14が適用される面12iを有する金属基板12で構成される。面12iはほぼ汚染されていない。金属基板12は約0.010インチ(0.25mm)と約0.020インチ(0.50mm)の間の厚さとし市販グレードのアルミニウムで形成するのが望ましい。金属基板12は最終用途に基づき約0.001インチ(0.025mm)と約0.125インチ(3.175mm)の間の厚さのアルミニウムから作ることもできる。
図4に示す部品10には約0.010インチ(0.25mm)から約0.015インチ(0.38mm)までの厚さで市販グレードのアルミニウムからなるアルミニウム基板が含まれる。アルミニウム基板12のオーバーレイは保護膜14である。保護膜14上に、例えば1/2オンス(0.15kg/m2)、すなわち約0.0007インチ(0.018mm)厚さの銅箔シート16がある。めくり上げた角には銅箔16と保護膜14を有する金属基板12の内面すなわち「処女」面が露出する。
Claims (21)
- 完成したプリント配線板において機能要素を構成して第1の面を有する銅箔シートと、
廃棄可能要素を構成するアルミニウムの基板シートと、
前記アルミニウムの基板シート面の保護塗膜であって、銅箔シートの第1の面および前記アルミニウムの基板シートの塗膜は互いに接触し、アルミニウムの基板シートと銅箔シートの界面は、アルミニウムの基板シートと銅箔シートのそれぞれの縁から内部へ中央領域が形成され、それらのそれぞれの縁で互いに接合され、前記アルミニウムの基板シートと銅箔シートは中央領域では接合されず、
前記塗膜は、シラン、クロム、銅、ニッケル、銀、金、ならびにクロム、銅、ニッケル、銀および金の合金からなる群から選択された材料から構成される、
プリント配線板の製造に使用する部品。 - 前記塗膜は、クロム、銅、ニッケル、銀、金、ならびにクロム、銅、ニッケル、銀および金の合金からなる群から選択された金属から構成され、少なくとも20オングストロームの膜厚を有する、請求項1に記載の部品。
- 前記基板シートは前記銅箔シートにフレキシブル接着剤で接合される、請求項1に記載の部品。
- 前記シランはプロピルトリメトキシシランである、請求項1に記載の部品。
- 前記銅箔シートは圧延銅箔である、請求項4に記載の部品。
- 前記銅箔シートは電着銅箔である、請求項4に記載の部品。
- 前記銅箔シートは基準銅箔、処理銅箔、反対面処理銅箔および両面処理銅箔からなる群から選択された、請求項6に記載の部品。
- 少なくとも第1の側面に塗膜を有するアルミニウムシートであって、前記アルミニウムシートは廃棄可能要素を構成し、前記第1の側面は第1の面を有し、
前記塗膜は、シラン、クロム、銅、ニッケル、銀、金、ならびにクロム、銅、ニッケル、銀および金の合金からなる群から選択された材料から構成され、
第1の面を有する銅箔シートであって、前記銅箔シートの第1の面を前記アルミニウムシートに対向して隣接配置され、フレキシブル接着剤は銅箔シートとアルミニウムシートのそれぞれの縁に塗布し、アルミニウムシートの前記塗膜に接触する前記銅箔シートを保護するのに用いられる、プリント配線板の製造に使用する部品。 - 前記塗膜は、クロム、銅、ニッケル、銀、金、ならびにクロム、銅、ニッケル、銀および金の合金からなる群から選択された金属から構成され、前記金属は、少なくとも20オングストロームの膜厚を有する、請求項8に記載の部品。
- 前記シランはプロピルトリメトキシシランである、請求項8に記載の部品。
- 前記フレキシブル接着剤は前記アルミニウムシートの前記塗膜と前記銅箔シートとの間に配置される、請求項10に記載の部品。
- 前記銅箔シートは圧延銅箔である、請求項10に記載の部品。
- 前記銅箔シートは電着銅箔である、請求項10に記載の部品。
- 前記銅箔シートは基準銅箔、処理銅箔、反対面処理銅箔および両面処理銅箔からなる群から選択された、請求項13に記載の部品。
- プリント配線板の製造に使用する部品において、部品はアルミニウムシートの第1の面に対向する銅箔シートの第1の面を有し、前記銅箔シートとアルミニウムシートの前記第1の面は銅箔シートとアルミニウムシートはそれぞれの縁から内部へ中央領域を形成する領域で互いに付着しないで接触し、
前記中央領域で前記銅箔シートを汚さないようにするため前記アルミニウムシートの前記第1の面にシラン塗布をし、前記銅箔シートと前記アルミニウムシートとは前記中央領域の外部でフレキシブル接着剤によって接合される改善が行われた部品。 - 前記シラン塗布はプロピルトリメトキシシランである、請求項15に記載の部品。
- 前記アルミニウムシートと前記銅箔シートとは、前記アルミニウムシートおよび前記銅箔シートのそれぞれの縁から内部へ前記中央領域を形成するためそれぞれの縁で互いに接合される、請求項16に記載の部品。
- シランで塗布されたアルミニウム分離シート面が銅箔シートに隣接配置され、プロピルトリメトキシシランで塗布された面を有する、プリント配線板の部品の製造に使用するアルミニウム分離シート。
- それぞれが面を有する2枚の銅箔シートと、
2枚の銅箔シートの間に配置されたアルミニウムシートであって、前記アルミニウムシートは2枚の銅箔シートの面に隣接配置されそれぞれ第1および第2の面を有する、アルミニウムシートと、
銅箔シートの縁から内部へ中央領域を形成する領域で銅箔シートの汚れを防止するため、アルミニウムシートの第1および第2の面の少なくとも1つの面上にあり、シラン、クロム、銅、ニッケル、銀、金、ならびにクロム、銅、ニッケル、銀および金の合金からなる群から選択された材料からなる保護塗膜と、
アルミニウムシートを少なくとも1枚の銅箔シートに隣接保持するため、少なくとも1枚の銅箔シート上のフレキシブル接着剤とから構成される、プリント配線板の製造に使用する部品。 - 前記シランはプロピルトリメトキシシランである、請求項19に記載の部品。
- 前記フレキシブル接着剤は前記アルミニウムシートと前記2枚の銅箔シートのそれぞれの間に配置される、請求項19に記載の部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/792,717 US6673471B2 (en) | 2001-02-23 | 2001-02-23 | Corrosion prevention for CAC component |
PCT/US2002/004514 WO2002068198A1 (en) | 2001-02-23 | 2002-02-19 | Corrosion prevention for cac component |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004527074A JP2004527074A (ja) | 2004-09-02 |
JP2004527074A5 JP2004527074A5 (ja) | 2005-11-17 |
JP4104461B2 true JP4104461B2 (ja) | 2008-06-18 |
Family
ID=25157839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002567537A Expired - Fee Related JP4104461B2 (ja) | 2001-02-23 | 2002-02-19 | Cac部品の腐食防止 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6673471B2 (ja) |
EP (1) | EP1401659B1 (ja) |
JP (1) | JP4104461B2 (ja) |
KR (1) | KR100561026B1 (ja) |
CN (1) | CN1238187C (ja) |
DE (1) | DE60212390T2 (ja) |
MY (1) | MY135743A (ja) |
TW (1) | TW577246B (ja) |
WO (1) | WO2002068198A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6299721B1 (en) * | 1998-12-14 | 2001-10-09 | Gould Electronics Incl | Coatings for improved resin dust resistance |
US20080187745A1 (en) * | 2003-06-26 | 2008-08-07 | Miles Justin Russell | Component and method for manufacturing printed circuit boards |
US20050064222A1 (en) * | 2003-09-18 | 2005-03-24 | Russell Miles Justin | Component and method for manufacturing printed circuit boards |
US20080182121A1 (en) * | 2007-01-29 | 2008-07-31 | York Manufacturing, Inc. | Copper aluminum laminate for replacing solid copper sheeting |
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US4357395A (en) | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
US4383003A (en) | 1980-09-22 | 1983-05-10 | General Electric Company | Transfer lamination of copper thin sheets and films, method and product |
US4455181A (en) | 1980-09-22 | 1984-06-19 | General Electric Company | Method of transfer lamination of copper thin sheets and films |
DE3322382A1 (de) | 1983-06-22 | 1985-01-10 | Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt | Verfahren zur herstellung von gedruckten schaltungen |
JPS6390890A (ja) | 1986-10-03 | 1988-04-21 | 株式会社 潤工社 | プリント基板 |
US4912020A (en) | 1986-10-21 | 1990-03-27 | Westinghouse Electric Corp. | Printed circuit boards and method for manufacturing printed circuit boards |
US5256474A (en) * | 1986-11-13 | 1993-10-26 | Johnston James A | Method of and apparatus for manufacturing printed circuit boards |
US4875283A (en) * | 1986-11-13 | 1989-10-24 | Johnston James A | Method for manufacturing printed circuit boards |
JP2556897B2 (ja) | 1989-02-23 | 1996-11-27 | ファナック株式会社 | 多層プリント配線板の外層材及び製造方法 |
US5153050A (en) | 1991-08-27 | 1992-10-06 | Johnston James A | Component of printed circuit boards |
US5779870A (en) | 1993-03-05 | 1998-07-14 | Polyclad Laminates, Inc. | Method of manufacturing laminates and printed circuit boards |
JPH0823165A (ja) * | 1994-07-08 | 1996-01-23 | Hitachi Chem Co Ltd | 絶縁接着材料付き銅箔を用いた金属コア配線板の製造方法 |
US6019910A (en) | 1997-12-22 | 2000-02-01 | Ford Motor Company | Etching tri-metal layers to form electronic circuits using aqueous alkaline solutions including nitrates |
US6183880B1 (en) * | 1998-08-07 | 2001-02-06 | Mitsui Mining & Smelting Co., Ltd. | Composite foil of aluminum and copper |
CN1099334C (zh) * | 1998-11-04 | 2003-01-22 | Ga-Tek公司(商业活动中称为哥德电子公司) | 印刷电路板的组件 |
US6299721B1 (en) * | 1998-12-14 | 2001-10-09 | Gould Electronics Incl | Coatings for improved resin dust resistance |
-
2001
- 2001-02-23 US US09/792,717 patent/US6673471B2/en not_active Expired - Fee Related
-
2002
- 2002-02-19 KR KR1020037010640A patent/KR100561026B1/ko not_active IP Right Cessation
- 2002-02-19 DE DE2002612390 patent/DE60212390T2/de not_active Expired - Lifetime
- 2002-02-19 EP EP02707791A patent/EP1401659B1/en not_active Expired - Lifetime
- 2002-02-19 CN CNB028055365A patent/CN1238187C/zh not_active Expired - Fee Related
- 2002-02-19 WO PCT/US2002/004514 patent/WO2002068198A1/en active IP Right Grant
- 2002-02-19 JP JP2002567537A patent/JP4104461B2/ja not_active Expired - Fee Related
- 2002-02-20 MY MYPI20020575A patent/MY135743A/en unknown
- 2002-02-22 TW TW91103168A patent/TW577246B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2002068198A1 (en) | 2002-09-06 |
CN1238187C (zh) | 2006-01-25 |
EP1401659A1 (en) | 2004-03-31 |
CN1529656A (zh) | 2004-09-15 |
JP2004527074A (ja) | 2004-09-02 |
DE60212390D1 (de) | 2006-07-27 |
KR100561026B1 (ko) | 2006-03-16 |
KR20030082592A (ko) | 2003-10-22 |
MY135743A (en) | 2008-06-30 |
US20020119342A1 (en) | 2002-08-29 |
US6673471B2 (en) | 2004-01-06 |
EP1401659B1 (en) | 2006-06-14 |
TW577246B (en) | 2004-02-21 |
DE60212390T2 (de) | 2007-06-06 |
EP1401659A4 (en) | 2005-05-04 |
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