JP4086902B2 - 工作物を製造するための方法および構成要素を処理する方法 - Google Patents

工作物を製造するための方法および構成要素を処理する方法 Download PDF

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Publication number
JP4086902B2
JP4086902B2 JP53661897A JP53661897A JP4086902B2 JP 4086902 B2 JP4086902 B2 JP 4086902B2 JP 53661897 A JP53661897 A JP 53661897A JP 53661897 A JP53661897 A JP 53661897A JP 4086902 B2 JP4086902 B2 JP 4086902B2
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JP
Japan
Prior art keywords
hydrogen
discharge
component
atmosphere
hlst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP53661897A
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English (en)
Japanese (ja)
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JP2001505119A5 (enExample
JP2001505119A (ja
Inventor
ドーマン，アレックス
リューヒンガー―バウティスタ，クリストフ・ベンノ
オンダ，ニコリーノ
ラム，ユルゲン
ツィマーマン，ハインリヒ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
OC Oerlikon Balzers AG
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Publication date
Application filed by OC Oerlikon Balzers AG filed Critical OC Oerlikon Balzers AG
Publication of JP2001505119A publication Critical patent/JP2001505119A/ja
Publication of JP2001505119A5 publication Critical patent/JP2001505119A5/ja
Application granted granted Critical
Publication of JP4086902B2 publication Critical patent/JP4086902B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/338—Changing chemical properties of treated surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Wire Bonding (AREA)
  • Cleaning In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP53661897A 1996-04-15 1997-04-14 工作物を製造するための方法および構成要素を処理する方法 Expired - Fee Related JP4086902B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH948/96 1996-04-15
CH00948/96A CH692446A5 (de) 1996-04-15 1996-04-15 Verfahren zur Herstellung von Werkstücken und von Teilen hierfür
PCT/CH1997/000147 WO1997039472A1 (de) 1996-04-15 1997-04-14 Verwendung eines reinigungsverfahrens, reinigungsverfahren, verbindungsverfahren und werkstückpaar

Publications (3)

Publication Number Publication Date
JP2001505119A JP2001505119A (ja) 2001-04-17
JP2001505119A5 JP2001505119A5 (enExample) 2005-03-10
JP4086902B2 true JP4086902B2 (ja) 2008-05-14

Family

ID=4198897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53661897A Expired - Fee Related JP4086902B2 (ja) 1996-04-15 1997-04-14 工作物を製造するための方法および構成要素を処理する方法

Country Status (6)

Country Link
US (3) US6203637B1 (enExample)
EP (1) EP0894332B8 (enExample)
JP (1) JP4086902B2 (enExample)
CH (1) CH692446A5 (enExample)
DE (1) DE59710130D1 (enExample)
WO (1) WO1997039472A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH692446A5 (de) * 1996-04-15 2002-06-28 Esec Sa Verfahren zur Herstellung von Werkstücken und von Teilen hierfür
FR2778190B1 (fr) * 1998-05-04 2000-06-02 Air Liquide Procede et appareil de traitement de surfaces metalliques par voie seche
US6605175B1 (en) * 1999-02-19 2003-08-12 Unaxis Balzers Aktiengesellschaft Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber
US6749691B2 (en) 2001-02-14 2004-06-15 Air Liquide America, L.P. Methods of cleaning discolored metallic arrays using chemical compositions
US6776330B2 (en) 2001-09-10 2004-08-17 Air Products And Chemicals, Inc. Hydrogen fluxless soldering by electron attachment
US6902774B2 (en) 2002-07-25 2005-06-07 Inficon Gmbh Method of manufacturing a device
US7387738B2 (en) * 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
US7897029B2 (en) * 2008-03-04 2011-03-01 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US8361340B2 (en) * 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US6980015B2 (en) * 2003-06-17 2005-12-27 Agilent Technologies, Inc. Back side probing method and assembly
DE502006003016D1 (de) * 2005-05-04 2009-04-16 Oerlikon Trading Ag Plasmaverstärker für plasmabehandlungsanlage
US7434719B2 (en) * 2005-12-09 2008-10-14 Air Products And Chemicals, Inc. Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment
US20070243713A1 (en) * 2006-04-12 2007-10-18 Lam Research Corporation Apparatus and method for generating activated hydrogen for plasma stripping
KR101046520B1 (ko) 2007-09-07 2011-07-04 어플라이드 머티어리얼스, 인코포레이티드 내부 챔버 상의 부산물 막 증착을 제어하기 위한 ｐｅｃｖｄ 시스템에서의 소스 가스 흐름 경로 제어
US8454850B2 (en) 2009-09-02 2013-06-04 Air Products And Chemicals, Inc. Method for the removal of surface oxides by electron attachment
US9006975B2 (en) 2011-02-09 2015-04-14 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
US9053894B2 (en) 2011-02-09 2015-06-09 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
JP6219227B2 (ja) * 2014-05-12 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構及びステージの温度制御方法
CN115430663A (zh) * 2022-08-17 2022-12-06 成都飞机工业（集团）有限责任公司 一种电子束金属表面清洗方法
CN117798451B (zh) * 2024-03-01 2024-04-30 深圳市志胜威电子设备有限公司 一种选择性波峰焊喷锡装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2663580B2 (ja) * 1988-11-22 1997-10-15 日本電気株式会社 シリコン表面のパッシベーション方法及び装置
GB8827933D0 (en) * 1988-11-30 1989-01-05 Plessey Co Plc Improvements relating to soldering processes
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
DE4029270C1 (enExample) 1990-09-14 1992-04-09 Balzers Ag, Balzers, Li
DE4029268C2 (de) 1990-09-14 1995-07-06 Balzers Hochvakuum Verfahren zur gleichspannungs-bogenentladungs-unterstützten, reaktiven Behandlung von Gut und Vakuumbehandlungsanlage zur Durchführung
DE59202116D1 (de) 1991-04-23 1995-06-14 Balzers Hochvakuum Verfahren zur Abtragung von Material von einer Oberfläche in einer Vakuumkammer.
US5376223A (en) * 1992-01-09 1994-12-27 Varian Associates, Inc. Plasma etch process
CH687111A5 (de) * 1992-05-26 1996-09-13 Balzers Hochvakuum Verfahren zum Erzeugen einer Niederspannungsentladung, Vakuumbehandlungsanlage hierfuer sowie Anwendung des Verfahrens.
US5409543A (en) * 1992-12-22 1995-04-25 Sandia Corporation Dry soldering with hot filament produced atomic hydrogen
CH692446A5 (de) * 1996-04-15 2002-06-28 Esec Sa Verfahren zur Herstellung von Werkstücken und von Teilen hierfür

Also Published As

Publication number Publication date
US6503351B2 (en) 2003-01-07
EP0894332B1 (de) 2003-05-21
DE59710130D1 (de) 2003-06-26
WO1997039472A1 (de) 1997-10-23
JP2001505119A (ja) 2001-04-17
US6203637B1 (en) 2001-03-20
US20010001184A1 (en) 2001-05-17
EP0894332B8 (de) 2003-12-17
US20030051792A1 (en) 2003-03-20
CH692446A5 (de) 2002-06-28
EP0894332A1 (de) 1999-02-03

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