CH692446A5 - Verfahren zur Herstellung von Werkstücken und von Teilen hierfür - Google Patents
Verfahren zur Herstellung von Werkstücken und von Teilen hierfür Download PDFInfo
- Publication number
- CH692446A5 CH692446A5 CH00948/96A CH94896A CH692446A5 CH 692446 A5 CH692446 A5 CH 692446A5 CH 00948/96 A CH00948/96 A CH 00948/96A CH 94896 A CH94896 A CH 94896A CH 692446 A5 CH692446 A5 CH 692446A5
- Authority
- CH
- Switzerland
- Prior art keywords
- hydrogen
- workpieces
- atmosphere
- discharge
- hlst
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 40
- 230000008569 process Effects 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 28
- 229910052739 hydrogen Inorganic materials 0.000 claims description 28
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 20
- 239000007789 gas Substances 0.000 claims description 14
- 150000002431 hydrogen Chemical class 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 238000002604 ultrasonography Methods 0.000 claims description 4
- 210000002381 plasma Anatomy 0.000 description 20
- 208000028659 discharge Diseases 0.000 description 17
- 239000010949 copper Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000004321 preservation Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000007667 floating Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000005022 packaging material Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- MYQMFPRXICJOND-UHFFFAOYSA-N 3-(7,8,10-trimethyl-2,4-dioxo-1,5-dihydrobenzo[g]pteridin-3-yl)propane-1-sulfonic acid Chemical compound N1C(=O)N(CCCS(O)(=O)=O)C(=O)C2=C1N(C)C1=CC(C)=C(C)C=C1N2 MYQMFPRXICJOND-UHFFFAOYSA-N 0.000 description 1
- 229910017750 AgSn Inorganic materials 0.000 description 1
- 101100446726 Caenorhabditis elegans flh-2 gene Proteins 0.000 description 1
- 229910020658 PbSn Inorganic materials 0.000 description 1
- 101150071746 Pbsn gene Proteins 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000001994 activation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/335—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/338—Changing chemical properties of treated surfaces
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Wire Bonding (AREA)
- Cleaning In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH00948/96A CH692446A5 (de) | 1996-04-15 | 1996-04-15 | Verfahren zur Herstellung von Werkstücken und von Teilen hierfür |
| EP97915247A EP0894332B8 (de) | 1996-04-15 | 1997-04-14 | Verwendung verbindungsverfahrens und verbindungsverfahren |
| JP53661897A JP4086902B2 (ja) | 1996-04-15 | 1997-04-14 | 工作物を製造するための方法および構成要素を処理する方法 |
| DE59710130T DE59710130D1 (de) | 1996-04-15 | 1997-04-14 | Verwendung verbindungsverfahrens und verbindungsverfahren |
| PCT/CH1997/000147 WO1997039472A1 (de) | 1996-04-15 | 1997-04-14 | Verwendung eines reinigungsverfahrens, reinigungsverfahren, verbindungsverfahren und werkstückpaar |
| US09/172,598 US6203637B1 (en) | 1996-04-15 | 1998-10-15 | Use of a cleaning process, a cleaning process, a connection process and a workpiece pair |
| US09/729,176 US6503351B2 (en) | 1996-04-15 | 2000-12-05 | Use of a cleaning process, a cleaning process, a connection process and a workpiece pair |
| US10/270,495 US20030051792A1 (en) | 1996-04-15 | 2002-10-16 | Use of a cleaning process, a cleaning process, a connection process and a workpiece pair |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH00948/96A CH692446A5 (de) | 1996-04-15 | 1996-04-15 | Verfahren zur Herstellung von Werkstücken und von Teilen hierfür |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH692446A5 true CH692446A5 (de) | 2002-06-28 |
Family
ID=4198897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH00948/96A CH692446A5 (de) | 1996-04-15 | 1996-04-15 | Verfahren zur Herstellung von Werkstücken und von Teilen hierfür |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US6203637B1 (enExample) |
| EP (1) | EP0894332B8 (enExample) |
| JP (1) | JP4086902B2 (enExample) |
| CH (1) | CH692446A5 (enExample) |
| DE (1) | DE59710130D1 (enExample) |
| WO (1) | WO1997039472A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH692446A5 (de) * | 1996-04-15 | 2002-06-28 | Esec Sa | Verfahren zur Herstellung von Werkstücken und von Teilen hierfür |
| FR2778190B1 (fr) * | 1998-05-04 | 2000-06-02 | Air Liquide | Procede et appareil de traitement de surfaces metalliques par voie seche |
| US6605175B1 (en) * | 1999-02-19 | 2003-08-12 | Unaxis Balzers Aktiengesellschaft | Process for manufacturing component parts, use of same, with air bearing supported workpieces and vacuum processing chamber |
| US6749691B2 (en) | 2001-02-14 | 2004-06-15 | Air Liquide America, L.P. | Methods of cleaning discolored metallic arrays using chemical compositions |
| US6776330B2 (en) | 2001-09-10 | 2004-08-17 | Air Products And Chemicals, Inc. | Hydrogen fluxless soldering by electron attachment |
| US6902774B2 (en) | 2002-07-25 | 2005-06-07 | Inficon Gmbh | Method of manufacturing a device |
| US7387738B2 (en) * | 2003-04-28 | 2008-06-17 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment for wafer bumping applications |
| US7079370B2 (en) * | 2003-04-28 | 2006-07-18 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation |
| US7897029B2 (en) * | 2008-03-04 | 2011-03-01 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
| US8361340B2 (en) * | 2003-04-28 | 2013-01-29 | Air Products And Chemicals, Inc. | Removal of surface oxides by electron attachment |
| US6980015B2 (en) * | 2003-06-17 | 2005-12-27 | Agilent Technologies, Inc. | Back side probing method and assembly |
| DE502006003016D1 (de) * | 2005-05-04 | 2009-04-16 | Oerlikon Trading Ag | Plasmaverstärker für plasmabehandlungsanlage |
| US7434719B2 (en) * | 2005-12-09 | 2008-10-14 | Air Products And Chemicals, Inc. | Addition of D2 to H2 to detect and calibrate atomic hydrogen formed by dissociative electron attachment |
| US20070243713A1 (en) * | 2006-04-12 | 2007-10-18 | Lam Research Corporation | Apparatus and method for generating activated hydrogen for plasma stripping |
| KR101046520B1 (ko) | 2007-09-07 | 2011-07-04 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 챔버 상의 부산물 막 증착을 제어하기 위한 ｐｅｃｖｄ 시스템에서의 소스 가스 흐름 경로 제어 |
| US8454850B2 (en) | 2009-09-02 | 2013-06-04 | Air Products And Chemicals, Inc. | Method for the removal of surface oxides by electron attachment |
| US9006975B2 (en) | 2011-02-09 | 2015-04-14 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
| US9053894B2 (en) | 2011-02-09 | 2015-06-09 | Air Products And Chemicals, Inc. | Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment |
| JP6219227B2 (ja) * | 2014-05-12 | 2017-10-25 | 東京エレクトロン株式会社 | ヒータ給電機構及びステージの温度制御方法 |
| CN115430663A (zh) * | 2022-08-17 | 2022-12-06 | 成都飞机工业（集团）有限责任公司 | 一种电子束金属表面清洗方法 |
| CN117798451B (zh) * | 2024-03-01 | 2024-04-30 | 深圳市志胜威电子设备有限公司 | 一种选择性波峰焊喷锡装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02140925A (ja) * | 1988-11-22 | 1990-05-30 | Nec Corp | シリコン表面のパッシベーション方法及び装置 |
| EP0371693A1 (en) * | 1988-11-30 | 1990-06-06 | Gec-Marconi Limited | Improvements relating to soldering processes |
| EP0427020A2 (de) * | 1989-11-06 | 1991-05-15 | Herbert Streckfuss Maschinenbau- Und Verwaltungs-Kg | Verfahren und Vorrichtung zur Verarbeitung von zu verlötenden Fügepartnern |
| EP0510340A1 (de) * | 1991-04-23 | 1992-10-28 | Balzers Aktiengesellschaft | Verfahren zur Abtragung von Material von einer Oberfläche in einer Vakuumkammer |
| GB2267387A (en) * | 1992-05-26 | 1993-12-01 | Balzers Hochvakuum | Vacuum treatment installation |
| US5409543A (en) * | 1992-12-22 | 1995-04-25 | Sandia Corporation | Dry soldering with hot filament produced atomic hydrogen |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4029270C1 (enExample) | 1990-09-14 | 1992-04-09 | Balzers Ag, Balzers, Li | |
| DE4029268C2 (de) | 1990-09-14 | 1995-07-06 | Balzers Hochvakuum | Verfahren zur gleichspannungs-bogenentladungs-unterstützten, reaktiven Behandlung von Gut und Vakuumbehandlungsanlage zur Durchführung |
| US5376223A (en) * | 1992-01-09 | 1994-12-27 | Varian Associates, Inc. | Plasma etch process |
| CH692446A5 (de) * | 1996-04-15 | 2002-06-28 | Esec Sa | Verfahren zur Herstellung von Werkstücken und von Teilen hierfür |
-
1996
- 1996-04-15 CH CH00948/96A patent/CH692446A5/de not_active IP Right Cessation
-
1997
- 1997-04-14 JP JP53661897A patent/JP4086902B2/ja not_active Expired - Fee Related
- 1997-04-14 DE DE59710130T patent/DE59710130D1/de not_active Expired - Lifetime
- 1997-04-14 EP EP97915247A patent/EP0894332B8/de not_active Expired - Lifetime
- 1997-04-14 WO PCT/CH1997/000147 patent/WO1997039472A1/de not_active Ceased
-
1998
- 1998-10-15 US US09/172,598 patent/US6203637B1/en not_active Expired - Lifetime
-
2000
- 2000-12-05 US US09/729,176 patent/US6503351B2/en not_active Expired - Fee Related
-
2002
- 2002-10-16 US US10/270,495 patent/US20030051792A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02140925A (ja) * | 1988-11-22 | 1990-05-30 | Nec Corp | シリコン表面のパッシベーション方法及び装置 |
| EP0371693A1 (en) * | 1988-11-30 | 1990-06-06 | Gec-Marconi Limited | Improvements relating to soldering processes |
| EP0427020A2 (de) * | 1989-11-06 | 1991-05-15 | Herbert Streckfuss Maschinenbau- Und Verwaltungs-Kg | Verfahren und Vorrichtung zur Verarbeitung von zu verlötenden Fügepartnern |
| EP0510340A1 (de) * | 1991-04-23 | 1992-10-28 | Balzers Aktiengesellschaft | Verfahren zur Abtragung von Material von einer Oberfläche in einer Vakuumkammer |
| GB2267387A (en) * | 1992-05-26 | 1993-12-01 | Balzers Hochvakuum | Vacuum treatment installation |
| US5409543A (en) * | 1992-12-22 | 1995-04-25 | Sandia Corporation | Dry soldering with hot filament produced atomic hydrogen |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 014, no. 383 (E - 0966) 17 August 1990 (1990-08-17) * |
Also Published As
| Publication number | Publication date |
|---|---|
| US6503351B2 (en) | 2003-01-07 |
| EP0894332B1 (de) | 2003-05-21 |
| DE59710130D1 (de) | 2003-06-26 |
| WO1997039472A1 (de) | 1997-10-23 |
| JP2001505119A (ja) | 2001-04-17 |
| US6203637B1 (en) | 2001-03-20 |
| US20010001184A1 (en) | 2001-05-17 |
| EP0894332B8 (de) | 2003-12-17 |
| US20030051792A1 (en) | 2003-03-20 |
| JP4086902B2 (ja) | 2008-05-14 |
| EP0894332A1 (de) | 1999-02-03 |
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