JP4081038B2 - 成形機の金型監視方法 - Google Patents
成形機の金型監視方法 Download PDFInfo
- Publication number
- JP4081038B2 JP4081038B2 JP2004112474A JP2004112474A JP4081038B2 JP 4081038 B2 JP4081038 B2 JP 4081038B2 JP 2004112474 A JP2004112474 A JP 2004112474A JP 2004112474 A JP2004112474 A JP 2004112474A JP 4081038 B2 JP4081038 B2 JP 4081038B2
- Authority
- JP
- Japan
- Prior art keywords
- image data
- mold
- monitoring
- reference image
- monitoring area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012544 monitoring process Methods 0.000 title claims description 149
- 238000000465 moulding Methods 0.000 title claims description 53
- 238000000034 method Methods 0.000 title claims description 46
- 238000003384 imaging method Methods 0.000 claims description 16
- 238000001746 injection moulding Methods 0.000 description 18
- 230000005856 abnormality Effects 0.000 description 16
- 238000004891 communication Methods 0.000 description 15
- 108700028516 Lan-7 Proteins 0.000 description 14
- 230000002159 abnormal effect Effects 0.000 description 9
- 230000006870 function Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000013500 data storage Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004112474A JP4081038B2 (ja) | 2004-04-06 | 2004-04-06 | 成形機の金型監視方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004112474A JP4081038B2 (ja) | 2004-04-06 | 2004-04-06 | 成形機の金型監視方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005297217A JP2005297217A (ja) | 2005-10-27 |
| JP2005297217A5 JP2005297217A5 (enExample) | 2005-12-08 |
| JP4081038B2 true JP4081038B2 (ja) | 2008-04-23 |
Family
ID=35329365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004112474A Expired - Fee Related JP4081038B2 (ja) | 2004-04-06 | 2004-04-06 | 成形機の金型監視方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4081038B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008040647A (ja) * | 2006-08-03 | 2008-02-21 | Meiwa E Tec:Kk | 温度制御装置 |
| JP5037733B2 (ja) * | 2012-01-11 | 2012-10-03 | シグマツクス株式会社 | 射出成形機監視装置 |
| JP6798794B2 (ja) * | 2016-04-22 | 2020-12-09 | ウシオ電機株式会社 | 金型監視装置 |
-
2004
- 2004-04-06 JP JP2004112474A patent/JP4081038B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005297217A (ja) | 2005-10-27 |
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