JP4079206B2 - 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置 - Google Patents

基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置 Download PDF

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JP4079206B2
JP4079206B2 JP2000381715A JP2000381715A JP4079206B2 JP 4079206 B2 JP4079206 B2 JP 4079206B2 JP 2000381715 A JP2000381715 A JP 2000381715A JP 2000381715 A JP2000381715 A JP 2000381715A JP 4079206 B2 JP4079206 B2 JP 4079206B2
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substrate
signal
container
wafer
stored
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JP2002184839A (ja
JP2002184839A5 (enrdf_load_stackoverflow
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裕二 上川
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Cleaning Or Drying Semiconductors (AREA)
JP2000381715A 2000-12-15 2000-12-15 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置 Expired - Fee Related JP4079206B2 (ja)

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JP2000381715A JP4079206B2 (ja) 2000-12-15 2000-12-15 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置

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JP2000381715A JP4079206B2 (ja) 2000-12-15 2000-12-15 基板検査装置および基板検査方法ならびに基板検査装置を備えた液処理装置

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JP2002184839A JP2002184839A (ja) 2002-06-28
JP2002184839A5 JP2002184839A5 (enrdf_load_stackoverflow) 2005-06-16
JP4079206B2 true JP4079206B2 (ja) 2008-04-23

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005072374A (ja) * 2003-08-26 2005-03-17 Dainippon Screen Mfg Co Ltd 基板処理装置
EP1767293B1 (en) * 2004-07-02 2013-08-14 Sintokogio, Ltd. Method and facility for after-treatment of aluminum casting coarse material
JP2006140418A (ja) * 2004-11-15 2006-06-01 Kaijo Corp 被処理基板の検出システム
JP4863985B2 (ja) * 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置
JP5059054B2 (ja) 2009-05-25 2012-10-24 東京エレクトロン株式会社 基板処理システム、基板検出装置および基板検出方法
JP5579796B2 (ja) * 2012-07-23 2014-08-27 東京エレクトロン株式会社 基板処理システム、基板検出装置および基板検出方法
JP6128941B2 (ja) 2013-05-10 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置の製造方法及び半導体製造装置
CN109817509A (zh) * 2017-11-20 2019-05-28 顶程国际股份有限公司 晶圆侦测装置及晶圆清洗机
WO2021202029A1 (en) * 2020-04-02 2021-10-07 Applied Materials, Inc. Inspection system
CN119229627B (zh) * 2024-11-29 2025-02-28 艾庞半导体科技(四川)有限公司 用于处理半导体晶片的控制系统

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