JP4077553B2 - 電子部品装着方法および電子部品装着装置 - Google Patents
電子部品装着方法および電子部品装着装置 Download PDFInfo
- Publication number
- JP4077553B2 JP4077553B2 JP10231898A JP10231898A JP4077553B2 JP 4077553 B2 JP4077553 B2 JP 4077553B2 JP 10231898 A JP10231898 A JP 10231898A JP 10231898 A JP10231898 A JP 10231898A JP 4077553 B2 JP4077553 B2 JP 4077553B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- holding state
- suction
- suction member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 63
- 238000001514 detection method Methods 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 12
- 238000001179 sorption measurement Methods 0.000 claims description 11
- 238000012937 correction Methods 0.000 description 17
- 230000000007 visual effect Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005286 illumination Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231898A JP4077553B2 (ja) | 1998-04-14 | 1998-04-14 | 電子部品装着方法および電子部品装着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10231898A JP4077553B2 (ja) | 1998-04-14 | 1998-04-14 | 電子部品装着方法および電子部品装着装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005078928A Division JP4077826B2 (ja) | 2005-03-18 | 2005-03-18 | 電子部品装着方法および電子部品装着装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11298198A JPH11298198A (ja) | 1999-10-29 |
| JPH11298198A5 JPH11298198A5 (enExample) | 2005-09-08 |
| JP4077553B2 true JP4077553B2 (ja) | 2008-04-16 |
Family
ID=14324238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10231898A Expired - Fee Related JP4077553B2 (ja) | 1998-04-14 | 1998-04-14 | 電子部品装着方法および電子部品装着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4077553B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003041478A1 (fr) * | 2001-11-05 | 2003-05-15 | Toray Engineering Co., Ltd. | Procede et dispositif de montage |
| JP6967137B2 (ja) * | 2018-03-07 | 2021-11-17 | 株式会社Fuji | 保持部材制御装置 |
| DE102021105594B3 (de) * | 2021-03-09 | 2022-06-09 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zur Positionskorrektur von Bauteilen mit einer Aufnahmevorrichtung, Aufnahmevorrichtung, Computerprogrammprodukt und computerlesbares Medium |
-
1998
- 1998-04-14 JP JP10231898A patent/JP4077553B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11298198A (ja) | 1999-10-29 |
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