JP4076430B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

Info

Publication number
JP4076430B2
JP4076430B2 JP2002330039A JP2002330039A JP4076430B2 JP 4076430 B2 JP4076430 B2 JP 4076430B2 JP 2002330039 A JP2002330039 A JP 2002330039A JP 2002330039 A JP2002330039 A JP 2002330039A JP 4076430 B2 JP4076430 B2 JP 4076430B2
Authority
JP
Japan
Prior art keywords
substrate
ion exchanger
processing
electrode
top ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002330039A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003297804A (ja
JP2003297804A5 (enExample
Inventor
充彦 白樫
正行 粂川
穂積 安田
厳貴 小畠
郁太郎 野路
香里 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2002330039A priority Critical patent/JP4076430B2/ja
Priority to TW092102098A priority patent/TWI275436B/zh
Priority to EP03703132A priority patent/EP1470576A4/en
Priority to US10/484,452 priority patent/US20040206634A1/en
Priority to PCT/JP2003/001024 priority patent/WO2003065432A1/en
Publication of JP2003297804A publication Critical patent/JP2003297804A/ja
Publication of JP2003297804A5 publication Critical patent/JP2003297804A5/ja
Priority to US11/723,934 priority patent/US7569135B2/en
Application granted granted Critical
Publication of JP4076430B2 publication Critical patent/JP4076430B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2002330039A 2002-01-31 2002-11-13 基板処理装置 Expired - Fee Related JP4076430B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002330039A JP4076430B2 (ja) 2002-01-31 2002-11-13 基板処理装置
TW092102098A TWI275436B (en) 2002-01-31 2003-01-30 Electrochemical machining device, and substrate processing apparatus and method
US10/484,452 US20040206634A1 (en) 2002-01-31 2003-01-31 Electrolytic processing apparatus and substrate processing apparatus and method
PCT/JP2003/001024 WO2003065432A1 (en) 2002-01-31 2003-01-31 Electrolytic processing apparatus and substrate processing apparatus and method
EP03703132A EP1470576A4 (en) 2002-01-31 2003-01-31 ELECTROLYTIC PROCESSING APPARATUS AND APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE
US11/723,934 US7569135B2 (en) 2002-01-31 2007-03-22 Electrolytic processing apparatus and substrate processing apparatus and method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-23785 2002-01-31
JP2002023785 2002-01-31
JP2002330039A JP4076430B2 (ja) 2002-01-31 2002-11-13 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007332475A Division JP2008160134A (ja) 2002-01-31 2007-12-25 基板処理方法

Publications (3)

Publication Number Publication Date
JP2003297804A JP2003297804A (ja) 2003-10-17
JP2003297804A5 JP2003297804A5 (enExample) 2005-08-25
JP4076430B2 true JP4076430B2 (ja) 2008-04-16

Family

ID=29404788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002330039A Expired - Fee Related JP4076430B2 (ja) 2002-01-31 2002-11-13 基板処理装置

Country Status (1)

Country Link
JP (1) JP4076430B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005281753A (ja) * 2004-03-29 2005-10-13 Ebara Corp 電解加工装置
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
JP6757011B2 (ja) * 2018-08-31 2020-09-16 東邦エンジニアリング株式会社 触媒基準装置

Also Published As

Publication number Publication date
JP2003297804A (ja) 2003-10-17

Similar Documents

Publication Publication Date Title
JP4043234B2 (ja) 電解加工装置及び基板処理装置
US7655118B2 (en) Electrolytic processing apparatus and method
US20070187259A1 (en) Substrate processing apparatus and method
KR20050004156A (ko) 기판처리장치 및 기판처리방법
JPWO2003080898A1 (ja) 電解加工装置及び電解加工方法
US20060091005A1 (en) Electolytic processing apparatus
JP2008160134A (ja) 基板処理方法
JP4076430B2 (ja) 基板処理装置
JP4233376B2 (ja) 基板処理方法
TWI275436B (en) Electrochemical machining device, and substrate processing apparatus and method
US20040256237A1 (en) Electrolytic processing apparatus and method
JP2003338490A (ja) 基板処理装置及び基板処理方法
US7527723B2 (en) Electrolytic processing apparatus and electrolytic processing method
JP2004015028A (ja) 基板処理方法及び半導体装置
JP4274714B2 (ja) 加工装置及び加工方法
JP4130073B2 (ja) イオン交換体の再生方法及び再生装置
JP4172945B2 (ja) 電解加工用イオン交換体の再生方法及び再生装置
JP2008524434A (ja) 平坦化方法及び平坦化装置
JP2007284795A (ja) 電極構造及び電解加工装置
JP4233331B2 (ja) 電解加工方法及び装置
JP3967207B2 (ja) 電解加工装置
JP2005199401A (ja) 電解加工装置及び方法
JP4245453B2 (ja) 電解加工装置及び電解加工方法
JP2005153142A (ja) 電解加工装置
JPWO2004083494A1 (ja) 複合加工装置及び方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050209

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071023

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071225

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080129

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080129

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110208

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees