JP2003297804A5 - - Google Patents
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- Publication number
- JP2003297804A5 JP2003297804A5 JP2002330039A JP2002330039A JP2003297804A5 JP 2003297804 A5 JP2003297804 A5 JP 2003297804A5 JP 2002330039 A JP2002330039 A JP 2002330039A JP 2002330039 A JP2002330039 A JP 2002330039A JP 2003297804 A5 JP2003297804 A5 JP 2003297804A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- processing
- electrolytic
- chemical mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 88
- 238000005498 polishing Methods 0.000 claims 32
- 239000000126 substance Substances 0.000 claims 26
- 238000003754 machining Methods 0.000 claims 20
- 238000003672 processing method Methods 0.000 claims 12
- 239000007788 liquid Substances 0.000 claims 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 8
- 239000008151 electrolyte solution Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 239000012530 fluid Substances 0.000 claims 4
- 230000004888 barrier function Effects 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 3
- 229910021642 ultra pure water Inorganic materials 0.000 claims 3
- 239000012498 ultrapure water Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002330039A JP4076430B2 (ja) | 2002-01-31 | 2002-11-13 | 基板処理装置 |
| TW092102098A TWI275436B (en) | 2002-01-31 | 2003-01-30 | Electrochemical machining device, and substrate processing apparatus and method |
| US10/484,452 US20040206634A1 (en) | 2002-01-31 | 2003-01-31 | Electrolytic processing apparatus and substrate processing apparatus and method |
| PCT/JP2003/001024 WO2003065432A1 (en) | 2002-01-31 | 2003-01-31 | Electrolytic processing apparatus and substrate processing apparatus and method |
| EP03703132A EP1470576A4 (en) | 2002-01-31 | 2003-01-31 | ELECTROLYTIC PROCESSING APPARATUS AND APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE |
| US11/723,934 US7569135B2 (en) | 2002-01-31 | 2007-03-22 | Electrolytic processing apparatus and substrate processing apparatus and method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-23785 | 2002-01-31 | ||
| JP2002023785 | 2002-01-31 | ||
| JP2002330039A JP4076430B2 (ja) | 2002-01-31 | 2002-11-13 | 基板処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007332475A Division JP2008160134A (ja) | 2002-01-31 | 2007-12-25 | 基板処理方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003297804A JP2003297804A (ja) | 2003-10-17 |
| JP2003297804A5 true JP2003297804A5 (enExample) | 2005-08-25 |
| JP4076430B2 JP4076430B2 (ja) | 2008-04-16 |
Family
ID=29404788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002330039A Expired - Fee Related JP4076430B2 (ja) | 2002-01-31 | 2002-11-13 | 基板処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4076430B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281753A (ja) * | 2004-03-29 | 2005-10-13 | Ebara Corp | 電解加工装置 |
| US7655565B2 (en) * | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
| JP6757011B2 (ja) * | 2018-08-31 | 2020-09-16 | 東邦エンジニアリング株式会社 | 触媒基準装置 |
-
2002
- 2002-11-13 JP JP2002330039A patent/JP4076430B2/ja not_active Expired - Fee Related
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