JP4074287B2 - プローブユニットの製造方法 - Google Patents
プローブユニットの製造方法 Download PDFInfo
- Publication number
- JP4074287B2 JP4074287B2 JP2004374733A JP2004374733A JP4074287B2 JP 4074287 B2 JP4074287 B2 JP 4074287B2 JP 2004374733 A JP2004374733 A JP 2004374733A JP 2004374733 A JP2004374733 A JP 2004374733A JP 4074287 B2 JP4074287 B2 JP 4074287B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- film
- probe unit
- pin
- holding portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 426
- 238000004519 manufacturing process Methods 0.000 title claims description 56
- 238000007747 plating Methods 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 29
- 239000011148 porous material Substances 0.000 claims description 23
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 238000011161 development Methods 0.000 claims description 8
- 239000010408 film Substances 0.000 description 234
- 229910052751 metal Inorganic materials 0.000 description 58
- 239000002184 metal Substances 0.000 description 58
- 239000010949 copper Substances 0.000 description 50
- 239000011888 foil Substances 0.000 description 48
- 239000010409 thin film Substances 0.000 description 47
- 229910052802 copper Inorganic materials 0.000 description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 45
- 229920002120 photoresistant polymer Polymers 0.000 description 43
- 238000004544 sputter deposition Methods 0.000 description 31
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 24
- 239000011651 chromium Substances 0.000 description 20
- 239000010936 titanium Substances 0.000 description 20
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 16
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 16
- 229910052804 chromium Inorganic materials 0.000 description 16
- 238000010586 diagram Methods 0.000 description 16
- 229910052719 titanium Inorganic materials 0.000 description 16
- 238000012360 testing method Methods 0.000 description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 9
- 229910000990 Ni alloy Inorganic materials 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000005304 joining Methods 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 6
- 238000000992 sputter etching Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000007733 ion plating Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004374733A JP4074287B2 (ja) | 2001-09-20 | 2004-12-24 | プローブユニットの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001287088 | 2001-09-20 | ||
| JP2004374733A JP4074287B2 (ja) | 2001-09-20 | 2004-12-24 | プローブユニットの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002164244A Division JP3651451B2 (ja) | 2001-09-20 | 2002-06-05 | プローブユニットおよびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005099052A JP2005099052A (ja) | 2005-04-14 |
| JP2005099052A5 JP2005099052A5 (enExample) | 2007-02-01 |
| JP4074287B2 true JP4074287B2 (ja) | 2008-04-09 |
Family
ID=34466581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004374733A Expired - Fee Related JP4074287B2 (ja) | 2001-09-20 | 2004-12-24 | プローブユニットの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4074287B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220148688A (ko) * | 2021-04-29 | 2022-11-07 | (주)샘씨엔에스 | 프로브 카드용 공간 변환기의 임피던스 정합 방법 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4584972B2 (ja) * | 2007-10-17 | 2010-11-24 | 山一電機株式会社 | プローブコンタクトの製造方法およびプローブコンタクト |
-
2004
- 2004-12-24 JP JP2004374733A patent/JP4074287B2/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220148688A (ko) * | 2021-04-29 | 2022-11-07 | (주)샘씨엔에스 | 프로브 카드용 공간 변환기의 임피던스 정합 방법 |
| KR102594037B1 (ko) | 2021-04-29 | 2023-10-25 | (주)샘씨엔에스 | 프로브 카드용 공간 변환기의 임피던스 정합 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005099052A (ja) | 2005-04-14 |
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