JP4040695B2 - 半導体ダイを冷却する装置 - Google Patents

半導体ダイを冷却する装置 Download PDF

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Publication number
JP4040695B2
JP4040695B2 JP54923498A JP54923498A JP4040695B2 JP 4040695 B2 JP4040695 B2 JP 4040695B2 JP 54923498 A JP54923498 A JP 54923498A JP 54923498 A JP54923498 A JP 54923498A JP 4040695 B2 JP4040695 B2 JP 4040695B2
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JP
Japan
Prior art keywords
semiconductor die
cooling plate
heat
cooling
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP54923498A
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English (en)
Japanese (ja)
Other versions
JP2001526838A (ja
JP2001526838A5 (enExample
Inventor
ウィナー，ポール
パニシア，マリオ・ジェイ
マ，カール・ジェイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JP2001526838A publication Critical patent/JP2001526838A/ja
Publication of JP2001526838A5 publication Critical patent/JP2001526838A5/ja
Application granted granted Critical
Publication of JP4040695B2 publication Critical patent/JP4040695B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP54923498A 1997-05-14 1998-04-14 半導体ダイを冷却する装置 Expired - Fee Related JP4040695B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/856,267 US5923086A (en) 1997-05-14 1997-05-14 Apparatus for cooling a semiconductor die
US08/856,267 1997-05-14
PCT/US1998/007490 WO1998052223A1 (en) 1997-05-14 1998-04-14 Method and apparatus for cooling a semiconductor die

Publications (3)

Publication Number Publication Date
JP2001526838A JP2001526838A (ja) 2001-12-18
JP2001526838A5 JP2001526838A5 (enExample) 2005-12-02
JP4040695B2 true JP4040695B2 (ja) 2008-01-30

Family

ID=25323202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54923498A Expired - Fee Related JP4040695B2 (ja) 1997-05-14 1998-04-14 半導体ダイを冷却する装置

Country Status (7)

Country Link
US (1) US5923086A (enExample)
JP (1) JP4040695B2 (enExample)
KR (1) KR100381431B1 (enExample)
CN (1) CN1154180C (enExample)
AU (1) AU6971898A (enExample)
MY (1) MY114590A (enExample)
WO (1) WO1998052223A1 (enExample)

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US6060777A (en) 1998-07-21 2000-05-09 Intel Corporation Underside heat slug for ball grid array packages
JP2001015545A (ja) * 1999-07-02 2001-01-19 Shinkawa Ltd ワイヤボンディング装置及び方法
US6461891B1 (en) * 1999-09-13 2002-10-08 Intel Corporation Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
US6372997B1 (en) 2000-02-25 2002-04-16 Thermagon, Inc. Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
US6761211B2 (en) 2000-03-14 2004-07-13 Delphi Technologies, Inc. High-performance heat sink for electronics cooling
US6364669B1 (en) * 2000-07-12 2002-04-02 Advanced Micro Devices, Inc. Spring contact for providing high current power to an integrated circuit
US6317326B1 (en) * 2000-09-14 2001-11-13 Sun Microsystems, Inc. Integrated circuit device package and heat dissipation device
US7526158B2 (en) * 2001-02-07 2009-04-28 University Of Rochester System and method for high resolution optical imaging, data storage, lithography, and inspection
US6545346B2 (en) 2001-03-23 2003-04-08 Intel Corporation Integrated circuit package with a capacitor
US6558169B2 (en) 2001-03-29 2003-05-06 Intel Corporation Shunt power connection for an integrated circuit package
FR2826508B1 (fr) * 2001-06-20 2004-05-28 Alstom Module electronique de puissance et composant de puissance destine a equiper un tel module
US6504242B1 (en) 2001-11-15 2003-01-07 Intel Corporation Electronic assembly having a wetting layer on a thermally conductive heat spreader
US6836014B2 (en) * 2002-10-03 2004-12-28 Credence Systems Corporation Optical testing of integrated circuits with temperature control
US6771500B1 (en) * 2003-03-27 2004-08-03 Stmicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
JP4607445B2 (ja) * 2003-11-04 2011-01-05 浜松ホトニクス株式会社 温度制御装置及び顕微鏡台
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US7280363B2 (en) * 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
US20070125526A1 (en) * 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
TW200813695A (en) 2006-03-30 2008-03-16 Cooligy Inc Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
US7834442B2 (en) * 2007-12-12 2010-11-16 International Business Machines Corporation Electronic package method and structure with cure-melt hierarchy
US20090225514A1 (en) 2008-03-10 2009-09-10 Adrian Correa Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US9297571B1 (en) 2008-03-10 2016-03-29 Liebert Corporation Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
CN102316699B (zh) * 2010-07-07 2015-10-14 富泰华工业（深圳）有限公司 冷却方法、使用该冷却设备方法的电路板维修装置及设备
KR101343233B1 (ko) * 2011-11-28 2013-12-18 삼성전기주식회사 전력 모듈 패키지
CN102788945A (zh) * 2012-07-19 2012-11-21 中国科学院电工研究所 一种功率半导体模块通用夹具
JP6048068B2 (ja) * 2012-10-25 2016-12-21 株式会社島津製作所 プラズマ用高周波電源及びそれを用いたｉｃｐ発光分光分析装置
TWI576196B (zh) * 2012-12-05 2017-04-01 新川股份有限公司 The cooling method of the joining tool cooling device and the joining tool
TWI490956B (zh) * 2013-03-12 2015-07-01 新川股份有限公司 覆晶接合器以及覆晶接合方法
CN108626331B (zh) 2017-03-21 2021-03-02 株式会社椿本链条 张紧装置

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Also Published As

Publication number Publication date
KR100381431B1 (ko) 2003-04-23
WO1998052223A1 (en) 1998-11-19
US5923086A (en) 1999-07-13
JP2001526838A (ja) 2001-12-18
CN1263638A (zh) 2000-08-16
MY114590A (en) 2002-11-30
AU6971898A (en) 1998-12-08
KR20010012569A (ko) 2001-02-15
CN1154180C (zh) 2004-06-16

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