JP4032340B2 - Multilayer electronic components - Google Patents
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- JP4032340B2 JP4032340B2 JP2001313785A JP2001313785A JP4032340B2 JP 4032340 B2 JP4032340 B2 JP 4032340B2 JP 2001313785 A JP2001313785 A JP 2001313785A JP 2001313785 A JP2001313785 A JP 2001313785A JP 4032340 B2 JP4032340 B2 JP 4032340B2
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【０００１】
【発明の属する技術分野】
本発明は、グリーンシート一体焼結型の多層基板を用いて構成されるアンテナスイッチ、ＶＣＯ等の高周波回路部品などに用いられる積層型電子部品に関する。
【０００２】
【従来の技術】
従来の積層型電子部品は、図５に示すように誘電体や磁性体のグリーンシートに内部電極１をパターン印刷して積層した積層基板２に、前記内部電極１によりインダクタやコンデンサ等の内部回路要素を形成し、これらの内部回路要素と積層基板２の側面に形成された外部端子３と適宜接続するとともに、積層基板２の上面（第１の主面）にチップコンデンサ、チップ抵抗、チップインダクタ、ダイオード、トランジスタ等の回路素子（図示せず）を搭載して、前記内部回路要素と適宜接続して構成される。
【０００３】
前述の構成よりなる積層型電子部品を回路基板に実装する場合、回路基板ＭＢには外部端子３に対応して形成された半田付け用のランドに、前記外部端子３が半田付けされるのが一般的である。
このような実装方法においては、機械的かつ電気的に確実な接続とするように、外部端子３及びランド間に滑らかにフィレットＦＬが形成する半田付けが行われる。滑らかなフィレットＦＬを形成するためには、外部端子３の大きさに応じ、また隣接するランド間の距離を十分に確保して半田付け用のランドを形成する必要がある。
【０００４】
【発明が解決しようとする課題】
前述した従来の積層型電子部品においては、回路基板に半田付けする際に十分なフィレットＦＬを配設して半田付け強度やオーミック接続を得るため、半田付けランドを長くする必要がある。このため回路基板には積層型電子部品形状よりも、十分に広い実装面積が必要であり、部品実装密度の向上を図ることが出来ないという問題があった。
また積層型電子部品の小型化に伴い、外部端子そのものの寸法形状も小さくせざるを得ず、半田付け面積が減少する傾向にあり、必要な半田付け強度を得ることも困難な状況にあった。
そこで本発明は、小型の積層型電子部品であっても、必要な半田付け強度が得られ、かつ部品実装密度を向上する積層型電子部品を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明は、相対向する第１および第２の主面と、当該主面間を連結する側面を備えた積層基板に、内部回路要素を介在し、該内部回路要素と接続する回路素子を第１の主面に実装するとともに、第２の主面を回路基板への実装面とし、その近傍にグランド電極を積層配置した積層型電子部品であって、前記第２の主面の周縁には、前記内部回路要素に接続された高周波端子と、前記高周波端子と並んで形成され、前記グランド電極と接続されたグランド端子を備え、前記第２の主面には、高周波端子及びグランド端子と離間し、前記グランド電極と接続された外部グランド電極を備え、前記高周波端子と、前記グランド端子と前記外部グランド電極は、それぞれ回路基板のランドと接続されるものであり、前記外部グランド電極と前記グランド電極との間には内部回路要素を備えず、かつ、前記外部グランド電極と前記グランド電極とを、２ヶ所以上に設けられたスルーホールを介して接続したことを特徴とするの積層型電子部品である。グランド電極と外部グランド電極とのスルーホールによる接続を２ヶ所以上で行うことで固着性を向上出来る。
本発明においては、前記外部グランド電極を前記高周波端子及び前記グランド端子よりも広い面積とし、その周辺部をオーバーコートガラスで被覆するのが好ましい。
さらに、前記積層基板の側面にキャスタレーション（窪み）を設けて、該キャスタレーションに前記高周波端子やグランド端子と接続する側面電極を形成するのも好ましい。
【０００６】
【発明の実施の形態】
図１は本発明の積層型電子部品に係る一実施例の斜視図である。
この積層型電子部品は、低温焼成が可能なセラミック誘電体材料からなり、厚さが３０μｍ〜２００μｍのグリーンシートを用意し、そのグリーンシート上にＡｇを主体とする導電ペーストを印刷して、所望の電極パターンを形成し、それを適宜積層し、圧着し、一体焼成して、外形寸法が５．４ｍｍ×４．０ｍｍ×１．０ｍｍの積層基板とし、これにダイオード、チップコンデンサ、チップ抵抗などの回路素子を実装して形成される。図３は本発明の積層型電子部品に係る一実施例の等価回路である。
図２に前記積層基板の各層の平面図を一例として示す。最下層のグリーンシート上には、電流分布が均一化するようにグランド電極がほぼ全面に形成され、積層基板の側面電極と接続するように構成されている。前記グランド電極の上層には、ライン電極やコンデンサ用の電極が形成され適宜スルーホール（図中、黒丸で表示）で接続されてコンデンサやインダクタ等の内部回路要素を構成する。
そして内部回路要素は接続用のラインやスルーホールを介して積層体の外表面に導出され、積層基板の上面（第１の主面）に搭載されるダイオード、チップコンデンサ、チップ抵抗などの回路素子と接続される。なお、図１及び図２には、説明の簡単化のために前記回路素子については図示していない。
また第２の主面には、前記内部回路要素やグランド電極と接続する高周波端子（ＡＮＴ端子、ＴＸ２端子、ＴＸ１端子、ＲＸ１端子、ＲＸ２端子）とグランド端子、コントロール端子ＶＣ１、ＶＣ２が形成され、さらに前記高周波端子やグランド端子に囲まれるように第２の主面の略中央に、２．０ｍｍ×１．０ｍｍの大きさの外部グランド電極が形成されている。そして、前記グランド電極と外部グランド電極とはφ０．１５に形成されたスルーホールを介して接続されている。
【０００７】
本発明の積層型電子部品について固着性試験を行った。図４に固着性試験結果を示す。固着性は、積層型電子部品の高周波端子、グランド端子、コントロール端子、外部グランド電極を試験用のプリント基板に半田付けし、その側面を押し治具で押えつけ、積層型電子部品がプリント基板から脱落するのに必要な荷重を測定して評価した。比較例として、外部グランド電極を形成しないもの、単に外部グランド電極を形成しスルーホールによるグランド電極との接続を行わないものを準備して評価した。その結果、単に外部グランド電極を形成した場合であっても、固着性は向上するがその効果は十分ではなく、さらにグランド電極とスルーホールで接続すれば固着性が向上し、スルーホールの数が増加するほどその効果が大きいことがわかった。このスルーホールによる強度向上の理由は定かではないが、マクロなアンカー効果により固着性が向上し、スルーホールを複数化することで更にアンカー効果が向上発揮されるものと考えられる。
【０００８】
第２の主面において、前記外部グランド電極と前記グランド端子とが離間して配置される。このように構成することで積層型電子部品を回路基板に実装する際に多少の実装ずれが発生しても、回路基板の高周波端子との接続用ランドとの短絡を防ぐことが出来る。より好ましくは、前記外部グランド電極の周辺部をオーバーコートガラスで被覆すれば、確実に短絡を防ぐことが出来る。
【０００９】
また本発明の積層型電子部品では、積層基板の側面にキャスタレーション（窪み）を有し、このキャスタレーションに前記第２の主面に形成した高周波端子やグランド端子と接続する側面電極を形成している。この様に構成することで、前記第２の主面にのみ高周波端子やグランド端子を形成する場合よりも、半田付け面積を確保できると共に、前記キャスタレーション（窪み）にはんだフィレットを収容できるので、積層型電子部品の実装面積をその外形寸法とほぼ等しくすることが出来、部品実装密度の向上を図ることができる。
【００１０】
本発明の積層型電子部品において、グランド電極と外部グランド電極とをスルーホールを介して接続すると高周波特性の積層型電子部品間バラツキも低減することができる。
【００１１】
【発明の効果】
本発明によれば、小型の積層型電子部品であっても必要な半田付け強度が得られ、かつ部品実装密度を向上する積層型電子部品を提供することが出来る。
【図面の簡単な説明】
【図１】本発明の一実施例に係る積層型電子部品の斜視図である。
【図２】本発明の一実施例に係る積層型電子部品の分解平面図である。
【図３】本発明の一実施例に係る積層型電子部品の等価回路である。
【図４】固着性試験結果を示す特性図である。
【図５】従来の積層型電子部品の断面図である。
【符号の説明】
１ 内部電極
２ 積層基板
３ 外部端子
ＦＬ フィレット
ＭＢ 回路基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer electronic component used for an antenna switch, a high-frequency circuit component such as a VCO, which is configured using a green sheet integrated sintered multilayer substrate.
[0002]
[Prior art]
As shown in FIG. 5, a conventional multilayer electronic component has an internal circuit such as an inductor or a capacitor formed on a
[0003]
When the multilayer electronic component having the above-described configuration is mounted on a circuit board, the
In such a mounting method, soldering is performed in which a fillet FL is smoothly formed between the
[0004]
[Problems to be solved by the invention]
In the above-described conventional multilayer electronic component, it is necessary to lengthen the soldering land in order to obtain a sufficient soldering strength and ohmic connection by arranging a sufficient fillet FL when soldering to the circuit board. For this reason, the circuit board requires a sufficiently large mounting area as compared with the shape of the multilayer electronic component, and there is a problem in that the component mounting density cannot be improved.
In addition, with the miniaturization of multilayer electronic components, the size and shape of the external terminals themselves have to be reduced, the soldering area tends to decrease, and it is difficult to obtain the required soldering strength. .
Accordingly, an object of the present invention is to provide a multilayer electronic component that can obtain a necessary soldering strength and improve a component mounting density even for a small multilayer electronic component.
[0005]
[Means for Solving the Problems]
The present invention provides a circuit element that interposes an internal circuit element and is connected to the internal circuit element on a laminated substrate having first and second main surfaces facing each other and a side surface that connects the main surfaces. while mounted on the first major surface, a second major surface and the mounting surface of the circuit board, a multilayer electronic component formed by stacking disposed ground electrode in the vicinity, the periphery of the second main surface A high-frequency terminal connected to the internal circuit element; and a ground terminal formed side by side with the high-frequency terminal and connected to the ground electrode. The second main surface is separated from the high-frequency terminal and the ground terminal. and, with the ground electrode and the connected external ground electrode, wherein the high-frequency terminals, the said ground terminal ground external electrodes, which are respectively connected to the lands of the circuit board, the said external ground electrode Gran Not provided with the internal circuit elements between the electrodes, and the the external ground electrode and said ground electrode, the multilayer electronic component to characterized in that it is connected through a through hole provided in two or more places It is. Adhesion can be improved by connecting the ground electrode and the external ground electrode through through holes at two or more locations.
In the present invention, it is preferable that the external ground electrode has a larger area than the high-frequency terminal and the ground terminal, and the periphery thereof is covered with overcoat glass.
Furthermore, it is also preferable to provide a castellation (dent) on the side surface of the multilayer substrate, and to form a side electrode connected to the high-frequency terminal or the ground terminal on the castellation.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view of an embodiment of a multilayer electronic component according to the present invention.
This multilayer electronic component is made of a ceramic dielectric material that can be fired at a low temperature. A green sheet having a thickness of 30 μm to 200 μm is prepared, and a conductive paste mainly composed of Ag is printed on the green sheet to obtain a desired The electrode pattern is appropriately laminated, pressure-bonded, and integrally fired to obtain a multilayer substrate having an outer dimension of 5.4 mm × 4.0 mm × 1.0 mm, and a diode, a chip capacitor, a chip resistor, etc. These circuit elements are mounted and formed. FIG. 3 is an equivalent circuit of one embodiment according to the multilayer electronic component of the present invention.
FIG. 2 shows an example of a plan view of each layer of the laminated substrate. On the lowermost green sheet, a ground electrode is formed on almost the entire surface so as to make the current distribution uniform, and is configured to be connected to the side electrode of the multilayer substrate. A line electrode and a capacitor electrode are formed on the ground electrode, and are connected to each other through through holes (indicated by black circles in the figure) to constitute internal circuit elements such as a capacitor and an inductor.
The internal circuit elements are led to the outer surface of the multilayer body through connection lines and through holes, and are mounted on the upper surface (first main surface) of the multilayer substrate, such as diodes, chip capacitors, and chip resistors. Connected. In FIG. 1 and FIG. 2, the circuit elements are not shown for simplicity of explanation.
Further, on the second main surface, high frequency terminals (ANT terminal, TX2 terminal, TX1 terminal, RX1 terminal, RX2 terminal) and ground terminals, control terminals VC1, VC2 connected to the internal circuit elements and the ground electrode are formed, Further, an external ground electrode having a size of 2.0 mm × 1.0 mm is formed in the approximate center of the second main surface so as to be surrounded by the high frequency terminal and the ground terminal. The ground electrode and the external ground electrode are connected to each other through a through hole having a diameter of 0.15.
[0007]
An adhesion test was performed on the multilayer electronic component of the present invention. FIG. 4 shows the adhesion test results. Adhesion is achieved by soldering the high-frequency terminal, ground terminal, control terminal, and external ground electrode of the multilayer electronic component to the test printed circuit board, and pressing the side with a pressing jig. The load necessary to drop off was measured and evaluated. As a comparative example, an example in which an external ground electrode is not formed and an external ground electrode that is simply formed and not connected to the ground electrode by a through hole are prepared and evaluated. As a result, even when an external ground electrode is simply formed, the adhesion is improved, but the effect is not sufficient.If the ground electrode is connected with a through hole, the adhesion is improved and the number of through holes is reduced. It turned out that the effect is so large that it increases. The reason for the strength improvement by the through hole is not clear, but it is considered that the anchoring property is improved by the macro anchor effect, and that the anchor effect is further improved by using a plurality of through holes.
[0008]
On the second main surface, the external ground electrode and the ground terminal are spaced apart. With such a configuration, even if a slight mounting deviation occurs when the multilayer electronic component is mounted on the circuit board, it is possible to prevent a short circuit with the connection land with the high frequency terminal of the circuit board. More preferably, if the peripheral portion of the external ground electrode is covered with overcoat glass, a short circuit can be reliably prevented.
[0009]
In the multilayer electronic component of the present invention, the side surface of the multilayer substrate has a castellation (dent), and a side electrode connected to the high frequency terminal and the ground terminal formed on the second main surface is formed on the castellation. ing. By configuring in this way, it is possible to secure a soldering area and to accommodate a solder fillet in the castellation (indentation), compared to the case where a high frequency terminal and a ground terminal are formed only on the second main surface. The mounting area of the multilayer electronic component can be made substantially equal to its outer dimension, and the component mounting density can be improved.
[0010]
In the multilayer electronic component of the present invention, when the ground electrode and the external ground electrode are connected via a through hole, the variation between the multilayer electronic components having high frequency characteristics can be reduced.
[0011]
【The invention's effect】
According to the present invention, it is possible to provide a multilayer electronic component that can obtain a necessary soldering strength and improve a component mounting density even with a small multilayer electronic component.
[Brief description of the drawings]
FIG. 1 is a perspective view of a multilayer electronic component according to an embodiment of the present invention.
FIG. 2 is an exploded plan view of a multilayer electronic component according to an embodiment of the present invention.
FIG. 3 is an equivalent circuit of a multilayer electronic component according to an embodiment of the present invention.
FIG. 4 is a characteristic diagram showing the result of adhesion test.
FIG. 5 is a cross-sectional view of a conventional multilayer electronic component.
[Explanation of symbols]
1
Claims (3)
前記第２の主面の周縁には、前記内部回路要素に接続された高周波端子と、前記高周波端子と並んで形成され、前記グランド電極と接続されたグランド端子を備え、
前記第２の主面には、高周波端子及びグランド端子と離間し、前記グランド電極と接続された外部グランド電極を備え、
前記高周波端子と、前記グランド端子と前記外部グランド電極は、それぞれ回路基板のランドと半田接続されるものであり、前記外部グランド電極と前記グランド電極との間には内部回路要素を備えず、かつ、前記外部グランド電極と前記グランド電極とを、２ヶ所以上に設けられたスルーホールを介して接続したことを特徴とするの積層型電子部品。A circuit element connected to the internal circuit element is interposed between the first main surface and the first and second main surfaces facing each other, and a laminated substrate having a side surface connecting the main surfaces. A multilayer electronic component in which the second main surface is a mounting surface to the circuit board and a ground electrode is stacked in the vicinity thereof,
A peripheral edge of the second main surface includes a high-frequency terminal connected to the internal circuit element, a ground terminal formed side by side with the high-frequency terminal, and connected to the ground electrode,
The second main surface includes an external ground electrode separated from the high frequency terminal and the ground terminal and connected to the ground electrode,
The high-frequency terminal , the ground terminal, and the external ground electrode are each solder- connected to a land of a circuit board, do not include an internal circuit element between the external ground electrode and the ground electrode, and The multilayer electronic component according to claim 1, wherein the external ground electrode and the ground electrode are connected via through holes provided at two or more locations .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313785A JP4032340B2 (en) | 2001-10-11 | 2001-10-11 | Multilayer electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001313785A JP4032340B2 (en) | 2001-10-11 | 2001-10-11 | Multilayer electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003124058A JP2003124058A (en) | 2003-04-25 |
| JP4032340B2 true JP4032340B2 (en) | 2008-01-16 |
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| JP2001313785A Expired - Lifetime JP4032340B2 (en) | 2001-10-11 | 2001-10-11 | Multilayer electronic components |
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| JP2007036315A (en) | 2005-07-22 | 2007-02-08 | Tdk Corp | High frequency electric component |
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| JP3088021B2 (en) * | 1990-12-20 | 2000-09-18 | 株式会社村田製作所 | Voltage controlled oscillator |
| JPH06151243A (en) * | 1992-11-12 | 1994-05-31 | Tdk Corp | Laminated filter |
| JPH09106916A (en) * | 1995-10-12 | 1997-04-22 | Ngk Spark Plug Co Ltd | Lc filter and its frequency adjusting method |
| JPH11168303A (en) * | 1997-12-05 | 1999-06-22 | Hitachi Metals Ltd | High frequency switch module |
| JP2000236227A (en) * | 1999-02-12 | 2000-08-29 | Ngk Spark Plug Co Ltd | Laminate type balun |
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