JPH0888473A - Lamination compound parts - Google Patents

Abstract

PURPOSE: To provide lamination compound parts where parts packaging density can be improved and at the same time soldering failure can be reduced. CONSTITUTION: When a bump 7 consisting of solder in a certain shape is formed on a land (terminal electrode) 8 for bump on the reverse side which is conductively connected to an external electrode 4 formed on the side surface of lamination compound parts 1 and the lamination compound parts 1 are mounted to an electronic parts mounting substrate 5 such as a mother board, a land 9 for soldering is formed on the electronic parts mounting substrate 5 corresponding to the bump 7 in advance, and the bump 7 is soldered to the land 9. Since the land 9 for soldering is formed under the low surface of the lamination compound parts 1, only a packaging area which is nearly identical to the parts shape is required, thus improving the parts packaging density. Also, even if the circuit of the lamination compound parts 1 becomes complex and the number of I/O terminals increases, it is not necessary to extremely narrow the pitch of the bump 7, thus easily performing soldering and reducing soldering failure as compared with before.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used for power supply circuit parts such as DC / DC converters made of multilayer ceramics, high frequency circuit parts such as antenna switches and VCOs made of multilayer ceramics. The present invention relates to a laminated composite component.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 2, a laminated composite component 1 has an electronic component 3 mounted on the surface of a body 2 composed of a laminated inductor network, a laminated capacitor network and a composite of these, and an end face 2a. An external electrode 4 for external connection is formed on.

When the laminated composite component 1 having the above-mentioned structure is mounted on the electronic component mounting substrate 5 such as a mother board, the electronic component mounting substrate 5 is preliminarily formed with the soldering lands 6 corresponding to the external electrodes 4. The external electrode 4 is soldered to the land 6.

[0004]

However, in the above-described conventional laminated composite component 1, when the laminated composite component 1 is soldered to the electronic component mounting board 5, the soldering land is long to increase the soldering strength. Since it is necessary to provide the mounting area, a mounting area larger than the shape of the component is required, so that the component mounting density cannot be improved.

Further, when the circuit of the laminated composite component 1 becomes complicated and the number of input / output terminals increases, the pitch of the external electrodes 4 becomes narrower, so that there is a problem that defects are likely to occur during soldering.

In view of the above problems, it is an object of the present invention to provide a laminated composite component which can improve the component mounting density and reduce soldering defects.

[0007]

In order to achieve the above-mentioned object, the present invention provides, in claim 1, a conductor pattern in a plurality of layers inside a laminate, wherein the conductor pattern is the laminate. In a laminated composite component in which a predetermined electronic circuit is formed by being internally connected to each other, an inductor or a laminated capacitor or both of them are formed inside the laminated body, and an electronic component is mounted on the surface, an external circuit and While providing a terminal electrode to be a connection terminal of on the back surface of the laminate,
We propose a laminated composite component in which bumps are provided on the terminal electrodes.

A second aspect of the present invention proposes the laminated composite component according to the first aspect, wherein the terminal electrode is connected to a conductor pattern inside the laminated body by a through hole.

According to a third aspect, in the laminated composite component according to the first aspect, the laminated body has a magnetic body portion and a dielectric portion, and the terminal electrode is formed on the dielectric portion. Propose laminated composite parts.

A fourth aspect of the present invention proposes the laminated composite component according to the third aspect, in which a capacitor is formed by the terminal electrode and the conductor pattern inside the dielectric.

According to a fifth aspect, in the laminated composite component according to the first aspect, a capacitor electrode pattern is provided between a conductor pattern forming a strip line or an inductor provided inside the laminate and the terminal electrode. Propose a laminated composite component that is placed.

[0012]

According to the first aspect of the present invention, it is connected to the substrate or the like through the bumps provided on the terminal electrodes on the back surface of the laminate.
As a result, since the connecting portion of the laminated composite component is located at the bottom of the component, it occupies the same mounting area as the lower surface of the laminated composite component. Moreover, since the bumps of the connection portion can be formed in a matrix, many connection electrodes can be provided.

According to a second aspect of the present invention, it is connected to a substrate or the like via bumps provided on the terminal electrodes on the back surface of the laminate,
The terminal electrode is connected to a conductor pattern inside the laminated body by a through hole.

According to a third aspect of the present invention, it is connected to a substrate or the like via bumps provided on the terminal electrodes on the back surface of the laminate,
The laminated body has a magnetic material portion and a dielectric material portion, and has a stronger element body than the magnetic material and a terminal electrode and a bump are formed on the dielectric material portion where cracks due to temperature are less likely to occur. Further, the wiring distance between the substrate to be mounted and the capacitor formed on the dielectric portion becomes short.

According to a fourth aspect of the present invention, it is connected to a substrate or the like via bumps provided on the terminal electrodes on the back surface of the laminate,
The laminated body has a magnetic material portion and a dielectric material portion, the terminal electrode is formed in the dielectric material portion, and a capacitor is formed by the terminal electrode and a conductor pattern inside the dielectric material. .

According to a fifth aspect of the present invention, it is connected to a substrate or the like via bumps provided on the terminal electrodes on the back surface of the laminate,
A capacitor electrode pattern is arranged between the terminal electrode and a conductor pattern forming a strip line or an inductor provided inside the laminated body.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram showing a laminated composite component according to a first embodiment of the present invention. In the figure, the same components as those of the above-described conventional example are designated by the same reference numerals and the description thereof is omitted. Further, the difference between the conventional example and the present embodiment is that in the present embodiment, a bump 7 for connection which is conductively connected to the external electrode 4 is provided on the lower surface of the main body 2.

The laminated composite component 1 of this embodiment is formed, for example, as follows. First, the dielectric sheets on which the internal electrodes are formed are stacked, pressure-bonded, and fired to obtain a multilayer capacitor network substrate. Next, after forming a thick film circuit and a thick film resistor on this surface, the external electrode 4 is formed on the end face. The external electrode 4 connects the front and back circuits and the built-in capacitor and the thick film circuit. Thereby, the main body 2 is formed. Further, electronic parts 3 such as ICs are provided on the surface of the main body 2.
Is soldered, cream solder is supplied to the bump land (terminal electrode) 8 on the back surface which is conductively connected to the external electrode 4 by a printing method, and this is reflowed to obtain bumps 7 made of solder having a certain shape. ..

When the laminated composite component 1 having the above structure is mounted on the electronic component mounting substrate 5 such as a mother board, the electronic component mounting substrate 5 is preliminarily formed with soldering lands 9 corresponding to the bumps 7, The bumps 7 are soldered to the lands 9.

As a result, in the above-described laminated composite component 1 of this embodiment, when the laminated composite component 1 is soldered to the electronic component mounting board 5, the soldering land 9 is located on the lower surface of the laminated composite component 1. Since it is formed below, only a mounting area that is substantially the same as the shape of the component is required, so that the component mounting density can be improved.

Further, even if the circuit of the laminated composite component 1 becomes complicated and the number of input / output terminals increases, it is not necessary to make the pitch of the bumps 7 extremely narrow, so that the soldering can be easily performed and the soldering can be performed. Defects can be reduced more than ever before.

The formation positions of the bumps 7 are at the laminated composite component 1
It may be at the central portion of the bottom surface of the above, or may be arranged at the peripheral portion of the lower surface as shown in FIG.

Although solder is the easiest type of bump 7, other conductive materials such as copper balls may be used.

Next, a second embodiment of the present invention will be described.
FIG. 4 is a side sectional view showing the laminated composite component of the second embodiment. In the figure, 10 is a laminated composite component body (hereinafter, referred to as a body) that constitutes a DC-DC converter, and has a magnetic body portion 11 made of magnetic ceramics in an upper portion and a dielectric body portion 12 made of a dielectric ceramics in a lower portion. are doing.

A surface electrode 10a is formed on the top of the magnetic body portion 11, that is, on the surface of the main body 10. Electronic components such as a resistor 13, a semiconductor 14 and a diode 15 are mounted on the surface electrode 10a. Further, inside the magnetic body portion 11, a conductor pattern forming the inductors 16a and 16b is provided.

A terminal electrode 10b is formed on the lower portion of the dielectric portion 12, that is, on the back surface of the body 10, and a bump 17 is formed on the terminal electrode 10b by soldering. Further, inside the dielectric portion 12, capacitors 18a, 18b, 18
A conductor pattern forming c is provided.

Further, the inductors 16a and 16b and the capacitors 18a to 18c are connected to a predetermined surface electrode 10a, terminal electrode 10b and the like through a through hole 19. Further, an end face electrode 20 is formed on the side surface of the main body 10, and the end face electrode 20 also connects the surface electrode 10a, the terminal electrode 10b, and the internal conductor pattern.

According to the laminated composite component having the above-described structure, since the terminal electrode 10b and the conductor pattern inside the main body 10 are connected by the through hole 19, the wiring length can be shortened and high-density wiring can be performed. it can. In addition, since the terminal electrode 10b and the bump 17 are formed on the dielectric portion 12 which is stronger in strength than the magnetic body and is less likely to be cracked by temperature, high strength can be obtained and a substrate to be mounted can be obtained. Since the wiring distance between the capacitor and the capacitor formed in the dielectric portion 12 becomes short, an unnecessary inductance component due to the wiring does not occur even when used at a high frequency. Furthermore, since the capacitor is formed by the terminal electrode 10b and the conductor pattern in the dielectric portion 12, more capacitors can be built in, and high-density mounting becomes possible.

Next, a third embodiment of the present invention will be described.
FIG. 5 is a side sectional view showing the laminated composite component of the third embodiment. In the figure, reference numeral 30 denotes a laminated composite component body (hereinafter referred to as a body) that constitutes an antenna switch, and is formed of a dielectric ceramic.

A surface electrode 30a is formed on the surface of the main body 30, and a resistor 31 and a semiconductor 32 are formed on the surface electrode 30a.
Also, electronic components such as the diode 33 are mounted. Further, inside the main body 30, a strip line 34 forming an inductor and a conductor pattern forming capacitors 35a, 35b, 35c are provided.

Further, the terminal electrode 30 is provided on the back surface of the main body 30.
b is formed, and the bump 36 is formed on the terminal electrode 30b by soldering.

Further, the capacitors 35a to 35c are connected to predetermined surface electrodes 30a, terminal electrodes 30b and the like through through holes 37. An end surface electrode 38 is formed on the side surface of the main body 30, and the end surface electrode 38 also connects the surface electrode 30a, the terminal electrode 30b, and the internal conductor pattern.

According to the laminated composite component having the above-described structure, since the terminal electrode 30b and the conductor pattern inside the main body 30 are connected by the through hole 37, the wiring length can be shortened and high-density wiring can be performed. In addition, even if it is used at a high frequency, an unnecessary inductance component due to wiring does not occur. Further, since the capacitor is formed by the terminal electrode 30b and the conductor pattern in the main body 30, more capacitors can be built in, and high-density mounting is possible.

[0034]

As described above, according to the first aspect of the present invention, the mounting area of the laminated composite component on the component mounting board can be made smaller than in the conventional case, so that the component mounting density can be improved. Further, even if the number of terminals of the laminated composite component is increased, it is not necessary to extremely narrow the pitch of the bumps, so that the soldering can be easily performed and the soldering failure can be reduced as compared with the conventional case.

According to the second aspect, in addition to the above effects, since the terminal electrode and the conductor pattern inside the laminated body are connected by the through hole, the wiring length can be shortened,
High-density wiring can be performed.

According to the third aspect, in addition to the above effects, the terminal electrode and the bump are formed in the dielectric portion which has a strength of the element body higher than that of the magnetic body and is less likely to cause cracks due to temperature. In addition to being able to obtain strength, the wiring distance between the substrate to be mounted and the capacitor formed on the dielectric part becomes short, so that an unnecessary inductance component is generated by the wiring even when used at high frequencies. There is no.

According to claim 4, in addition to the above effect, since the capacitor is formed by the terminal electrode and the conductor pattern inside the dielectric, more capacitors can be built in, and High density mounting is possible.

According to claim 5, in addition to the above effects, a capacitor electrode pattern is arranged between the terminal electrode and a conductor pattern forming a stripline or inductor provided inside the laminated body. Since more capacitors can be built in, high density mounting becomes possible.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a laminated composite component according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a laminated composite component of a conventional example.

FIG. 3 is a configuration diagram showing another embodiment of the present invention.

FIG. 4 is a side sectional view showing a laminated composite component according to a second embodiment of the present invention.

FIG. 5 is a side sectional view showing a laminated composite component according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Laminated composite component, 2 ... Main body, 3 ... Electronic component, 4 ... External electrode, 5 ... Electronic component mounting substrate, 6 ... Soldering land, 7 ... Bump, 8 ... Bump land, 9 ... Soldering Land, 10 ... Laminated composite component body, 10a ... Surface electrode, 10b ... Terminal electrode, 11 ... Magnetic part, 12 ... Dielectric part, 13 ... Resistor, 14 ... Semiconductor, 15 ... Diode,
16a, 16b ... Inductor, 17 ... Bump, 18a ...
18c ... Capacitor, 19 ... Through hole, 20 ... End surface electrode, 30 ... Laminated composite component body, 30a ... Surface electrode, 3
0b ... terminal electrode, 31 ... resistor, 32 ... semiconductor, 33 ...
Diode, 34 ... Strip line, 35a to 35c
… Capacitors, 36… Bumps, 37… Through holes, 3
8 ... Edge electrode.

Claims (5)

[Claims] 1. A laminate having conductor patterns over a plurality of layers, the conductor patterns being mutually connected inside the laminate to form a predetermined electronic circuit, and inside the laminate. In a laminated composite component in which an inductor, a multilayer capacitor, or both of them are formed, and an electronic component is mounted on the surface, a terminal electrode serving as a terminal for connecting to an external circuit is provided on the back surface of the laminate, and the terminal electrode is provided. A laminated composite part characterized in that bumps are provided on the. 2. The laminated composite component according to claim 1, wherein the terminal electrode is connected to a conductor pattern inside the laminated body by a through hole. 3. The laminated composite component according to claim 1, wherein the laminated body has a magnetic body portion and a dielectric body portion, and the terminal electrode is formed on the dielectric body portion. 4. The laminated composite component according to claim 3, wherein a capacitor is formed by the terminal electrode and the conductor pattern inside the dielectric. 5. The laminate according to claim 1, wherein a capacitor electrode pattern is arranged between the terminal electrode and a conductor pattern forming a strip line or an inductor provided inside the laminate. Composite parts.