JP4028892B2 - 電解金属析出のために電流パルスを発生するための方法と回路配置 - Google Patents

電解金属析出のために電流パルスを発生するための方法と回路配置 Download PDF

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JP4028892B2
JP4028892B2 JP52324197A JP52324197A JP4028892B2 JP 4028892 B2 JP4028892 B2 JP 4028892B2 JP 52324197 A JP52324197 A JP 52324197A JP 52324197 A JP52324197 A JP 52324197A JP 4028892 B2 JP4028892 B2 JP 4028892B2
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current
pulse
electroplating
bath
source
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Japanese (ja)
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JP2000505145A5 (2
JP2000505145A (ja
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エーゴン ヒューベル
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アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Ac-Ac Conversion (AREA)
  • Physical Vapour Deposition (AREA)
JP52324197A 1995-12-21 1996-09-27 電解金属析出のために電流パルスを発生するための方法と回路配置 Expired - Fee Related JP4028892B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19547948.3 1995-12-21
DE19547948A DE19547948C1 (de) 1995-12-21 1995-12-21 Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung
PCT/EP1996/004232 WO1997023665A1 (de) 1995-12-21 1996-09-27 Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung

Publications (3)

Publication Number Publication Date
JP2000505145A JP2000505145A (ja) 2000-04-25
JP2000505145A5 JP2000505145A5 (2) 2004-09-02
JP4028892B2 true JP4028892B2 (ja) 2007-12-26

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ID=7780889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52324197A Expired - Fee Related JP4028892B2 (ja) 1995-12-21 1996-09-27 電解金属析出のために電流パルスを発生するための方法と回路配置

Country Status (12)

Country Link
US (1) US6132584A (2)
EP (1) EP0868545B1 (2)
JP (1) JP4028892B2 (2)
KR (1) KR100465545B1 (2)
CN (1) CN1093337C (2)
AT (1) ATE186081T1 (2)
BR (1) BR9612163A (2)
CA (1) CA2241055A1 (2)
CZ (1) CZ290052B6 (2)
DE (2) DE19547948C1 (2)
ES (1) ES2139388T3 (2)
WO (1) WO1997023665A1 (2)

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US6174425B1 (en) * 1997-05-14 2001-01-16 Motorola, Inc. Process for depositing a layer of material over a substrate
US6793796B2 (en) 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US6946065B1 (en) * 1998-10-26 2005-09-20 Novellus Systems, Inc. Process for electroplating metal into microscopic recessed features
US6344419B1 (en) 1999-12-03 2002-02-05 Applied Materials, Inc. Pulsed-mode RF bias for sidewall coverage improvement
US6231743B1 (en) 2000-01-03 2001-05-15 Motorola, Inc. Method for forming a semiconductor device
KR20020078307A (ko) 2001-04-09 2002-10-18 주식회사 하이닉스반도체 반도체 소자의 커패시터 제조 방법
DE10259365A1 (de) * 2002-04-08 2003-10-30 Siemens Ag Vorrichtung und Verfahren zur Entfernung von Oberflächenbereichen eines Bauteils
NL1022786C2 (nl) * 2003-02-26 2004-08-30 Tendris Solutions Bv Omzetschakeling, systeem en werkwijze voor het uitvoeren van een elektrochemisch proces.
DE10311575B4 (de) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
US20070068821A1 (en) * 2005-09-27 2007-03-29 Takahisa Hirasawa Method of manufacturing chromium plated article and chromium plating apparatus
RU2248416C1 (ru) * 2003-11-04 2005-03-20 Никифоров Алексей Александрович Устройство для микродугового оксидирования
US20050157475A1 (en) * 2004-01-15 2005-07-21 Endicott Interconnect Technologies, Inc. Method of making printed circuit board with electroplated conductive through holes and board resulting therefrom
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
SE0403047D0 (sv) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Pulse-plating method and apparatus
PL377451A1 (pl) * 2005-10-05 2007-04-16 Instytut Wysokich Ciśnień PAN Sposób prowadzenia reakcji i reaktor chemiczny
EP1890004A1 (de) 2006-08-08 2008-02-20 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Nutzschicht aus wiederverwendetem Schichtmaterial
DE102006044416A1 (de) * 2006-09-18 2008-03-27 Siemens Ag Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen
US20080271995A1 (en) * 2007-05-03 2008-11-06 Sergey Savastiouk Agitation of electrolytic solution in electrodeposition
US8603864B2 (en) 2008-09-11 2013-12-10 Infineon Technologies Ag Method of fabricating a semiconductor device
US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
US9011706B2 (en) * 2008-12-16 2015-04-21 City University Of Hong Kong Method of making foraminous microstructures
US9385035B2 (en) 2010-05-24 2016-07-05 Novellus Systems, Inc. Current ramping and current pulsing entry of substrates for electroplating
JP6161863B2 (ja) * 2010-12-28 2017-07-12 株式会社荏原製作所 電気めっき方法
US9028666B2 (en) 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
CN102277603A (zh) * 2011-08-03 2011-12-14 深圳大学 一种感应热/电沉积制备涂层或薄膜的装置及方法
CA2929515C (en) * 2013-11-19 2019-12-31 Hecker Electronica Potencia Y Procesos S.A. Process for superimposing ac over dc used in copper, or other products, electrowinning or electrorefining processes, wherein the ac source is connected between two consecutive cells from the group of electrolytic cells using an inductor to inject ac and a capacitor to close the electrical circuit
EP3029178A1 (en) 2014-12-05 2016-06-08 ATOTECH Deutschland GmbH Method and apparatus for electroplating a metal onto a substrate
JP7358238B2 (ja) 2016-07-13 2023-10-10 イオントラ インコーポレイテッド 電気化学的方法、装置及び組成物
RU2722754C1 (ru) * 2019-04-23 2020-06-03 Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах
CN114836797B (zh) * 2022-05-12 2023-08-29 广州市慧科高新材料科技有限公司 一种基于脉冲搭桥的通孔填孔电镀工艺

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US3616434A (en) * 1968-04-18 1971-10-26 Novachrome Inc Apparatus with power source for plating
US3959088A (en) * 1975-03-19 1976-05-25 The United States Of America As Represented By The Secretary Of The Army Method and apparatus for generating high amperage pulses from an A-C power source
CH629542A5 (de) * 1976-09-01 1982-04-30 Inoue Japax Res Verfahren und vorrichtung zur galvanischen materialablagerung.
US4208254A (en) * 1976-09-22 1980-06-17 Satoshi Ichioka Method of plating an iron-cobalt alloy on a substrate
US4517059A (en) * 1981-07-31 1985-05-14 The Boeing Company Automated alternating polarity direct current pulse electrolytic processing of metals
GB8801827D0 (en) * 1988-01-27 1988-02-24 Jct Controls Ltd Improvements in electrochemical processes
DE4005346A1 (de) * 1990-02-20 1991-08-22 Siemens Ag Verfahren zur erzeugung von hochfrequenten strompulsen mit steilen pulsflanken in galvanikanlagen und versorgungsschaltung zur durchfuehrung des verfahrens

Also Published As

Publication number Publication date
DE19547948C1 (de) 1996-11-21
HK1017392A1 (en) 1999-11-19
CN1205745A (zh) 1999-01-20
KR100465545B1 (ko) 2005-02-28
CA2241055A1 (en) 1997-07-03
EP0868545B1 (de) 1999-10-27
KR19990071793A (ko) 1999-09-27
ES2139388T3 (es) 2000-02-01
CZ170098A3 (cs) 1998-10-14
BR9612163A (pt) 1999-07-13
JP2000505145A (ja) 2000-04-25
DE59603510D1 (de) 1999-12-02
CN1093337C (zh) 2002-10-23
CZ290052B6 (cs) 2002-05-15
US6132584A (en) 2000-10-17
ATE186081T1 (de) 1999-11-15
EP0868545A1 (de) 1998-10-07
WO1997023665A1 (de) 1997-07-03

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