JP4025196B2 - チャンバー内の環境全体の制御を必要とする操作が達成される装置 - Google Patents

チャンバー内の環境全体の制御を必要とする操作が達成される装置 Download PDF

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JP4025196B2
JP4025196B2 JP2002543046A JP2002543046A JP4025196B2 JP 4025196 B2 JP4025196 B2 JP 4025196B2 JP 2002543046 A JP2002543046 A JP 2002543046A JP 2002543046 A JP2002543046 A JP 2002543046A JP 4025196 B2 JP4025196 B2 JP 4025196B2
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Prior art keywords
chamber
gas
surface treatment
substrate
inert gas
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Expired - Fee Related
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Japanese (ja)
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JP2004514062A5 (https=
JP2004514062A (ja
Inventor
ココリオ、パナヨティス
クーレ、フランソワ
デーリンク、ボルフガンク
フェルスター、フランク
ジェロー、ジャン・ルイ
マルテンス、ベルント
メレン、ステファーヌ
プリンツ、エカルト
トネリエ、ジャン−イブ
ビレルメ、アラン
Original Assignee
レール・リキード−ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード
ソフタル エレクトロニック エリク ブルーメンフェルト ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45519—Inert gas curtains
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0676—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on flow sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Chemical Vapour Deposition (AREA)
  • Prevention Of Fouling (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
  • Ventilation (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2002543046A 2000-11-16 2001-11-06 チャンバー内の環境全体の制御を必要とする操作が達成される装置 Expired - Fee Related JP4025196B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0014793A FR2816726B1 (fr) 2000-11-16 2000-11-16 Installation dans laquelle est realisee une operation necessitant un controle de l'atmosphere a l'interieur d'une enceinte
PCT/FR2001/003421 WO2002040738A2 (fr) 2000-11-16 2001-11-06 Installation dans laquelle est realisee une operation necessitant un contrôle de l'atmosphere a l'interieur d'une enceinte

Publications (3)

Publication Number Publication Date
JP2004514062A JP2004514062A (ja) 2004-05-13
JP2004514062A5 JP2004514062A5 (https=) 2007-10-04
JP4025196B2 true JP4025196B2 (ja) 2007-12-19

Family

ID=8856545

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JP2002543046A Expired - Fee Related JP4025196B2 (ja) 2000-11-16 2001-11-06 チャンバー内の環境全体の制御を必要とする操作が達成される装置

Country Status (9)

Country Link
US (1) US6458330B1 (https=)
EP (1) EP1348039B1 (https=)
JP (1) JP4025196B2 (https=)
CN (1) CN100447295C (https=)
AU (2) AU2002223753B2 (https=)
BR (1) BR0115420B1 (https=)
DK (1) DK1348039T3 (https=)
FR (1) FR2816726B1 (https=)
WO (1) WO2002040738A2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2855322B1 (fr) * 2003-05-21 2005-07-01 Air Liquide Dispositif de traitement de surface par zone d'un article
FR2865418B1 (fr) * 2004-01-28 2006-03-03 Air Liquide Equipement de reticulation ultraviolette sous atmosphere controlee
US9255330B2 (en) 2010-07-09 2016-02-09 Vito Nv Method and device for atmospheric pressure plasma treatment
FR2978775B1 (fr) 2011-08-03 2014-02-14 Air Liquide Procede de preparation de surfaces d'aluminium par traitement par plasma atmospherique pour le depot de revetements sans promoteurs d'adherence
DE102012213095A1 (de) * 2012-07-25 2014-01-30 Roth & Rau Ag Gasseparation
CN104191578A (zh) * 2014-08-28 2014-12-10 京东方光科技有限公司 一种注塑机及应用该注塑机的注塑方法
EP3054032B1 (en) 2015-02-09 2017-08-23 Coating Plasma Industrie Installation for film deposition onto and/or modification of the surface of a moving substrate
FR3035122B1 (fr) 2015-04-20 2017-04-28 Coating Plasma Ind Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede
KR102441291B1 (ko) 2016-10-27 2022-09-08 코팅 플라스마 이노베이션 제어된 분위기에서 이동하는 기판의 표면을 처리하는 설비 및 그의 크기를 규정하는 방법
JP2018143985A (ja) * 2017-03-07 2018-09-20 コニカミノルタ株式会社 活性エネルギー線照射装置
JP7687557B2 (ja) * 2021-08-10 2025-06-03 日本エア・リキード合同会社 紫外線硬化装置及び紫外線硬化方法
DE102022126294A1 (de) * 2022-10-11 2024-04-11 Maschinenfabrik Kaspar Walter Gmbh & Co Kg Vorrichtung und Verfahren zum Härten einer Polymerschicht auf einem zylindrischen Körper

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4209357A (en) * 1979-05-18 1980-06-24 Tegal Corporation Plasma reactor apparatus
US5356718A (en) * 1993-02-16 1994-10-18 Ppg Industries, Inc. Coating apparatus, method of coating glass, compounds and compositions for coating glasss and coated glass substrates
FR2704558B1 (fr) * 1993-04-29 1995-06-23 Air Liquide Procede et dispositif pour creer un depot d'oxyde de silicium sur un substrat solide en defilement.
JPH09232296A (ja) * 1996-02-23 1997-09-05 Mitsubishi Electric Corp 半導体装置の製造装置および製造方法
US5851293A (en) * 1996-03-29 1998-12-22 Atmi Ecosys Corporation Flow-stabilized wet scrubber system for treatment of process gases from semiconductor manufacturing operations
US6143080A (en) * 1999-02-02 2000-11-07 Silicon Valley Group Thermal Systems Llc Wafer processing reactor having a gas flow control system and method

Also Published As

Publication number Publication date
AU2002223753B2 (en) 2006-09-28
FR2816726B1 (fr) 2006-06-23
AU2375302A (en) 2002-05-27
CN100447295C (zh) 2008-12-31
WO2002040738A3 (fr) 2002-07-11
DK1348039T3 (da) 2013-03-25
WO2002040738A2 (fr) 2002-05-23
EP1348039A2 (fr) 2003-10-01
CN1636079A (zh) 2005-07-06
FR2816726A1 (fr) 2002-05-17
US20020057999A1 (en) 2002-05-16
BR0115420B1 (pt) 2011-07-26
US6458330B1 (en) 2002-10-01
JP2004514062A (ja) 2004-05-13
BR0115420A (pt) 2003-10-21
EP1348039B1 (fr) 2013-01-02

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