AU2002223753B2 - Installation wherein is performed an operation requiring control of atmosphere inside a chamber - Google Patents
Installation wherein is performed an operation requiring control of atmosphere inside a chamber Download PDFInfo
- Publication number
- AU2002223753B2 AU2002223753B2 AU2002223753A AU2002223753A AU2002223753B2 AU 2002223753 B2 AU2002223753 B2 AU 2002223753B2 AU 2002223753 A AU2002223753 A AU 2002223753A AU 2002223753 A AU2002223753 A AU 2002223753A AU 2002223753 B2 AU2002223753 B2 AU 2002223753B2
- Authority
- AU
- Australia
- Prior art keywords
- chamber
- installation according
- gas
- forming
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000009434 installation Methods 0.000 title claims description 59
- 239000000758 substrate Substances 0.000 claims description 74
- 239000007789 gas Substances 0.000 claims description 54
- 239000008246 gaseous mixture Substances 0.000 claims description 43
- 238000000605 extraction Methods 0.000 claims description 39
- 239000011261 inert gas Substances 0.000 claims description 33
- 238000002347 injection Methods 0.000 claims description 24
- 239000007924 injection Substances 0.000 claims description 24
- 238000004381 surface treatment Methods 0.000 claims description 23
- 230000001105 regulatory effect Effects 0.000 claims description 19
- 238000011282 treatment Methods 0.000 claims description 19
- 238000007599 discharging Methods 0.000 claims description 18
- 238000011144 upstream manufacturing Methods 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 230000001276 controlling effect Effects 0.000 claims description 4
- 238000003848 UV Light-Curing Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000004132 cross linking Methods 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 74
- 229910052757 nitrogen Inorganic materials 0.000 description 38
- 239000000203 mixture Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- -1 silicon hydrocarbon Chemical class 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000002829 nitrogen Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0676—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on flow sources
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
- Prevention Of Fouling (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Devices For Use In Laboratory Experiments (AREA)
- Ventilation (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0014793A FR2816726B1 (fr) | 2000-11-16 | 2000-11-16 | Installation dans laquelle est realisee une operation necessitant un controle de l'atmosphere a l'interieur d'une enceinte |
| FR00/14793 | 2000-11-16 | ||
| PCT/FR2001/003421 WO2002040738A2 (fr) | 2000-11-16 | 2001-11-06 | Installation dans laquelle est realisee une operation necessitant un contrôle de l'atmosphere a l'interieur d'une enceinte |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2002223753A1 AU2002223753A1 (en) | 2002-08-01 |
| AU2002223753B2 true AU2002223753B2 (en) | 2006-09-28 |
Family
ID=8856545
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002223753A Ceased AU2002223753B2 (en) | 2000-11-16 | 2001-11-06 | Installation wherein is performed an operation requiring control of atmosphere inside a chamber |
| AU2375302A Pending AU2375302A (en) | 2000-11-16 | 2001-11-06 | Installation wherein is performed an operation requiring control of atmosphere inside a chamber |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2375302A Pending AU2375302A (en) | 2000-11-16 | 2001-11-06 | Installation wherein is performed an operation requiring control of atmosphere inside a chamber |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6458330B1 (https=) |
| EP (1) | EP1348039B1 (https=) |
| JP (1) | JP4025196B2 (https=) |
| CN (1) | CN100447295C (https=) |
| AU (2) | AU2002223753B2 (https=) |
| BR (1) | BR0115420B1 (https=) |
| DK (1) | DK1348039T3 (https=) |
| FR (1) | FR2816726B1 (https=) |
| WO (1) | WO2002040738A2 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2855322B1 (fr) * | 2003-05-21 | 2005-07-01 | Air Liquide | Dispositif de traitement de surface par zone d'un article |
| FR2865418B1 (fr) * | 2004-01-28 | 2006-03-03 | Air Liquide | Equipement de reticulation ultraviolette sous atmosphere controlee |
| US9255330B2 (en) | 2010-07-09 | 2016-02-09 | Vito Nv | Method and device for atmospheric pressure plasma treatment |
| FR2978775B1 (fr) | 2011-08-03 | 2014-02-14 | Air Liquide | Procede de preparation de surfaces d'aluminium par traitement par plasma atmospherique pour le depot de revetements sans promoteurs d'adherence |
| DE102012213095A1 (de) * | 2012-07-25 | 2014-01-30 | Roth & Rau Ag | Gasseparation |
| CN104191578A (zh) * | 2014-08-28 | 2014-12-10 | 京东方光科技有限公司 | 一种注塑机及应用该注塑机的注塑方法 |
| EP3054032B1 (en) | 2015-02-09 | 2017-08-23 | Coating Plasma Industrie | Installation for film deposition onto and/or modification of the surface of a moving substrate |
| FR3035122B1 (fr) | 2015-04-20 | 2017-04-28 | Coating Plasma Ind | Procede de traitement de surface d'un film en mouvement et installation pour la mise en oeuvre de ce procede |
| KR102441291B1 (ko) | 2016-10-27 | 2022-09-08 | 코팅 플라스마 이노베이션 | 제어된 분위기에서 이동하는 기판의 표면을 처리하는 설비 및 그의 크기를 규정하는 방법 |
| JP2018143985A (ja) * | 2017-03-07 | 2018-09-20 | コニカミノルタ株式会社 | 活性エネルギー線照射装置 |
| JP7687557B2 (ja) * | 2021-08-10 | 2025-06-03 | 日本エア・リキード合同会社 | 紫外線硬化装置及び紫外線硬化方法 |
| DE102022126294A1 (de) * | 2022-10-11 | 2024-04-11 | Maschinenfabrik Kaspar Walter Gmbh & Co Kg | Vorrichtung und Verfahren zum Härten einer Polymerschicht auf einem zylindrischen Körper |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6143080A (en) * | 1999-02-02 | 2000-11-07 | Silicon Valley Group Thermal Systems Llc | Wafer processing reactor having a gas flow control system and method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4209357A (en) * | 1979-05-18 | 1980-06-24 | Tegal Corporation | Plasma reactor apparatus |
| US5356718A (en) * | 1993-02-16 | 1994-10-18 | Ppg Industries, Inc. | Coating apparatus, method of coating glass, compounds and compositions for coating glasss and coated glass substrates |
| FR2704558B1 (fr) * | 1993-04-29 | 1995-06-23 | Air Liquide | Procede et dispositif pour creer un depot d'oxyde de silicium sur un substrat solide en defilement. |
| JPH09232296A (ja) * | 1996-02-23 | 1997-09-05 | Mitsubishi Electric Corp | 半導体装置の製造装置および製造方法 |
| US5851293A (en) * | 1996-03-29 | 1998-12-22 | Atmi Ecosys Corporation | Flow-stabilized wet scrubber system for treatment of process gases from semiconductor manufacturing operations |
-
2000
- 2000-11-16 FR FR0014793A patent/FR2816726B1/fr not_active Expired - Fee Related
- 2000-12-18 US US09/738,314 patent/US6458330B1/en not_active Expired - Lifetime
-
2001
- 2001-11-06 AU AU2002223753A patent/AU2002223753B2/en not_active Ceased
- 2001-11-06 JP JP2002543046A patent/JP4025196B2/ja not_active Expired - Fee Related
- 2001-11-06 CN CNB018189644A patent/CN100447295C/zh not_active Expired - Lifetime
- 2001-11-06 BR BRPI0115420-6A patent/BR0115420B1/pt not_active IP Right Cessation
- 2001-11-06 WO PCT/FR2001/003421 patent/WO2002040738A2/fr not_active Ceased
- 2001-11-06 DK DK01996636.5T patent/DK1348039T3/da active
- 2001-11-06 AU AU2375302A patent/AU2375302A/xx active Pending
- 2001-11-06 EP EP01996636A patent/EP1348039B1/fr not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6143080A (en) * | 1999-02-02 | 2000-11-07 | Silicon Valley Group Thermal Systems Llc | Wafer processing reactor having a gas flow control system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2816726B1 (fr) | 2006-06-23 |
| AU2375302A (en) | 2002-05-27 |
| CN100447295C (zh) | 2008-12-31 |
| WO2002040738A3 (fr) | 2002-07-11 |
| DK1348039T3 (da) | 2013-03-25 |
| WO2002040738A2 (fr) | 2002-05-23 |
| EP1348039A2 (fr) | 2003-10-01 |
| CN1636079A (zh) | 2005-07-06 |
| FR2816726A1 (fr) | 2002-05-17 |
| US20020057999A1 (en) | 2002-05-16 |
| BR0115420B1 (pt) | 2011-07-26 |
| US6458330B1 (en) | 2002-10-01 |
| JP4025196B2 (ja) | 2007-12-19 |
| JP2004514062A (ja) | 2004-05-13 |
| BR0115420A (pt) | 2003-10-21 |
| EP1348039B1 (fr) | 2013-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2002223753B2 (en) | Installation wherein is performed an operation requiring control of atmosphere inside a chamber | |
| KR100887447B1 (ko) | 기판 처리 장치, 가스 공급 장치, 기판 처리 방법 및 기억매체 | |
| US6015591A (en) | Deposition method | |
| EP0730532B1 (en) | Topology induced plasma enhancement for etched uniformity improvement | |
| EP1660697B1 (en) | Vertical flow rotating disk reactor and method using the same | |
| US6170431B1 (en) | Plasma reactor with a deposition shield | |
| US5648282A (en) | Autodoping prevention and oxide layer formation apparatus | |
| EP2245647B1 (en) | Method for treatment of a substrate with atmospheric pressure glow discharge electrode configuration | |
| JP3373990B2 (ja) | 成膜装置及びその方法 | |
| KR20050044248A (ko) | 표면파 여기 플라즈마 cvd 시스템 | |
| US5286295A (en) | Nozzle with nonsymmetrical feed for the formation of a coating layer on a ribbon of glass, by pyrolysis of a gas mixture | |
| US11725278B2 (en) | Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate | |
| DE3633386A1 (de) | Verfahren und vorrichtung zum behandeln von substraten im vakuum | |
| CN113169025A (zh) | 用于真空等离子体处理至少一个衬底或用于制造衬底的真空处理设备和方法 | |
| KR102067002B1 (ko) | 가스 공급 장치 | |
| US20100297361A1 (en) | Plasma deposition source and method for depositing thin films | |
| US6709556B2 (en) | Plasma processing apparatus | |
| JPS6127462B2 (https=) | ||
| WO2021002753A1 (en) | Spatially controlled plasma | |
| EP0807694A1 (en) | Deposition chamber and method for low dielectric constant film | |
| JP4303662B2 (ja) | プラズマ処理方法 | |
| US20010029894A1 (en) | Plasma reactor with a deposition shield | |
| IE53099B1 (en) | Apparatus including improved cathode for continuous deposition of amorphous material | |
| DE102014112669A1 (de) | Magnetronanordnung, Prozessieranordnung und Verfahren zum Beschichten eines Substrats | |
| JP2848755B2 (ja) | プラズマcvd装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC1 | Assignment before grant (sect. 113) |
Owner name: L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'E Free format text: FORMER APPLICANT(S): L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE; SOFTAL ELECTRONIC ERIK BLUMENFIELD GMBH & CO. |
|
| FGA | Letters patent sealed or granted (standard patent) | ||
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |