JP4023873B2 - 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法 - Google Patents

無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法 Download PDF

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Publication number
JP4023873B2
JP4023873B2 JP17066397A JP17066397A JP4023873B2 JP 4023873 B2 JP4023873 B2 JP 4023873B2 JP 17066397 A JP17066397 A JP 17066397A JP 17066397 A JP17066397 A JP 17066397A JP 4023873 B2 JP4023873 B2 JP 4023873B2
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Japan
Prior art keywords
insulating layer
metal
film
resin
plating
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Expired - Fee Related
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JP17066397A
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Japanese (ja)
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JPH1112504A5 (https=
JPH1112504A (ja
Inventor
香苗 中川
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Fujitsu Ltd
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Fujitsu Ltd
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Priority to JP17066397A priority Critical patent/JP4023873B2/ja
Publication of JPH1112504A publication Critical patent/JPH1112504A/ja
Publication of JPH1112504A5 publication Critical patent/JPH1112504A5/ja
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  • Paints Or Removers (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP17066397A 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法 Expired - Fee Related JP4023873B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17066397A JP4023873B2 (ja) 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17066397A JP4023873B2 (ja) 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法

Publications (3)

Publication Number Publication Date
JPH1112504A JPH1112504A (ja) 1999-01-19
JPH1112504A5 JPH1112504A5 (https=) 2005-05-12
JP4023873B2 true JP4023873B2 (ja) 2007-12-19

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JP17066397A Expired - Fee Related JP4023873B2 (ja) 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854889B2 (ja) 2001-04-19 2006-12-06 キヤノン株式会社 金属または金属化合物パターンの製造方法および電子源の製造方法
JP4597431B2 (ja) * 2001-07-10 2010-12-15 富士通株式会社 配線形成方法
US6893681B2 (en) 2001-09-27 2005-05-17 Fujitsu Limited Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same
JP2007112112A (ja) * 2005-09-20 2007-05-10 Dainippon Ink & Chem Inc 金属積層板及び金属積層板の製造方法
JP5241304B2 (ja) 2008-04-23 2013-07-17 富士フイルム株式会社 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、及び金属パターン材料
KR101625421B1 (ko) 2008-12-26 2016-05-30 후지필름 가부시키가이샤 표면 금속막 재료, 표면 금속막 재료의 제작 방법, 금속 패턴 재료의 제작 방법, 및 금속 패턴 재료
JPWO2021205926A1 (https=) * 2020-04-08 2021-10-14
JP2024132457A (ja) * 2023-03-17 2024-10-01 株式会社Jcu 無電解めっき方法

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JPH1112504A (ja) 1999-01-19

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