JPH1112504A5 - - Google Patents

Info

Publication number
JPH1112504A5
JPH1112504A5 JP1997170663A JP17066397A JPH1112504A5 JP H1112504 A5 JPH1112504 A5 JP H1112504A5 JP 1997170663 A JP1997170663 A JP 1997170663A JP 17066397 A JP17066397 A JP 17066397A JP H1112504 A5 JPH1112504 A5 JP H1112504A5
Authority
JP
Japan
Prior art keywords
insulating layer
metal
type
coating
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997170663A
Other languages
English (en)
Japanese (ja)
Other versions
JP4023873B2 (ja
JPH1112504A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP17066397A priority Critical patent/JP4023873B2/ja
Priority claimed from JP17066397A external-priority patent/JP4023873B2/ja
Publication of JPH1112504A publication Critical patent/JPH1112504A/ja
Publication of JPH1112504A5 publication Critical patent/JPH1112504A5/ja
Application granted granted Critical
Publication of JP4023873B2 publication Critical patent/JP4023873B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP17066397A 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法 Expired - Fee Related JP4023873B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17066397A JP4023873B2 (ja) 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17066397A JP4023873B2 (ja) 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法

Publications (3)

Publication Number Publication Date
JPH1112504A JPH1112504A (ja) 1999-01-19
JPH1112504A5 true JPH1112504A5 (https=) 2005-05-12
JP4023873B2 JP4023873B2 (ja) 2007-12-19

Family

ID=15909075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17066397A Expired - Fee Related JP4023873B2 (ja) 1997-06-26 1997-06-26 無電解めっき可能な樹脂絶縁層用組成物及びそれを用いた配線基板製造方法

Country Status (1)

Country Link
JP (1) JP4023873B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854889B2 (ja) 2001-04-19 2006-12-06 キヤノン株式会社 金属または金属化合物パターンの製造方法および電子源の製造方法
JP4597431B2 (ja) * 2001-07-10 2010-12-15 富士通株式会社 配線形成方法
US6893681B2 (en) 2001-09-27 2005-05-17 Fujitsu Limited Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same
JP2007112112A (ja) * 2005-09-20 2007-05-10 Dainippon Ink & Chem Inc 金属積層板及び金属積層板の製造方法
JP5241304B2 (ja) 2008-04-23 2013-07-17 富士フイルム株式会社 表面金属膜材料の作製方法、表面金属膜材料、金属パターン材料の作製方法、及び金属パターン材料
KR101625421B1 (ko) 2008-12-26 2016-05-30 후지필름 가부시키가이샤 표면 금속막 재료, 표면 금속막 재료의 제작 방법, 금속 패턴 재료의 제작 방법, 및 금속 패턴 재료
JPWO2021205926A1 (https=) * 2020-04-08 2021-10-14
JP2024132457A (ja) * 2023-03-17 2024-10-01 株式会社Jcu 無電解めっき方法

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