JP4020261B2 - 露光方法、露光装置、及び基板製造方法 - Google Patents

露光方法、露光装置、及び基板製造方法 Download PDF

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JP4020261B2
JP4020261B2 JP2003376238A JP2003376238A JP4020261B2 JP 4020261 B2 JP4020261 B2 JP 4020261B2 JP 2003376238 A JP2003376238 A JP 2003376238A JP 2003376238 A JP2003376238 A JP 2003376238A JP 4020261 B2 JP4020261 B2 JP 4020261B2
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JP2005140935A5 (enExample
JP2005140935A (ja
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伸壽 小松
聡 高橋
一政 関
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Hitachi High Tech Corp
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JP2003376238A 2003-11-05 2003-11-05 露光方法、露光装置、及び基板製造方法 Expired - Fee Related JP4020261B2 (ja)

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JP2007211212A Division JP2007293376A (ja) 2007-08-14 2007-08-14 露光装置及び基板製造方法
JP2007211211A Division JP2007306034A (ja) 2007-08-14 2007-08-14 露光装置及び基板製造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019047244A1 (zh) * 2017-09-11 2019-03-14 深圳市柔宇科技有限公司 机械手臂、曝光机前单元和温度控制方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4860966B2 (ja) * 2005-09-02 2012-01-25 Ｎｓｋテクノロジー株式会社 露光パターンの転写方法及び露光装置
US7440076B2 (en) * 2005-09-29 2008-10-21 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
JP4726814B2 (ja) * 2007-01-16 2011-07-20 株式会社日立ハイテクノロジーズ 基板の位置決め装置及び位置決め方法
US7923660B2 (en) * 2007-08-15 2011-04-12 Applied Materials, Inc. Pulsed laser anneal system architecture
JP2009295950A (ja) * 2008-05-09 2009-12-17 Nsk Ltd スキャン露光装置およびスキャン露光方法
JP2010169949A (ja) * 2009-01-23 2010-08-05 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
WO2011065380A1 (ja) * 2009-11-25 2011-06-03 日本精工株式会社 プリアライメント装置及びプリアライメント方法
JP2011158718A (ja) * 2010-02-01 2011-08-18 Hitachi High-Technologies Corp 露光装置、露光方法、及び表示用パネル基板の製造方法
JP5843161B2 (ja) * 2011-05-13 2016-01-13 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2017158943A1 (ja) * 2016-03-18 2017-09-21 コニカミノルタ株式会社 パターニング装置及び有機エレクトロルミネッセンス素子の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3571243B2 (ja) * 1999-02-22 2004-09-29 日立ハイテク電子エンジニアリング株式会社 プロキシミティ露光方法及び装置
JP2000250227A (ja) * 1999-03-02 2000-09-14 Adtec Engineeng Co Ltd 露光装置
JP2000292942A (ja) * 1999-04-06 2000-10-20 Adtec Engineeng Co Ltd 露光装置及び露光方法
JP2001093808A (ja) * 1999-09-21 2001-04-06 Nikon Corp 露光方法及び露光装置
JP4538884B2 (ja) * 2000-03-08 2010-09-08 凸版印刷株式会社 大型基板の露光装置
JP2003068600A (ja) * 2001-08-22 2003-03-07 Canon Inc 露光装置、および基板チャックの冷却方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019047244A1 (zh) * 2017-09-11 2019-03-14 深圳市柔宇科技有限公司 机械手臂、曝光机前单元和温度控制方法

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