JP4015668B2 - 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス - Google Patents
樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス Download PDFInfo
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- JP4015668B2 JP4015668B2 JP2005160356A JP2005160356A JP4015668B2 JP 4015668 B2 JP4015668 B2 JP 4015668B2 JP 2005160356 A JP2005160356 A JP 2005160356A JP 2005160356 A JP2005160356 A JP 2005160356A JP 4015668 B2 JP4015668 B2 JP 4015668B2
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| JP2005160356A JP4015668B2 (ja) | 2004-05-31 | 2005-05-31 | 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス |
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| JP2005160356A JP4015668B2 (ja) | 2004-05-31 | 2005-05-31 | 樹脂組成物、半導体パッケージ、接着フィルムおよび樹脂ワニス |
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| JP2006016610A JP2006016610A (ja) | 2006-01-19 |
| JP2006016610A5 JP2006016610A5 (enrdf_load_stackoverflow) | 2007-02-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007291375A (ja) * | 2004-05-31 | 2007-11-08 | Sumitomo Bakelite Co Ltd | 樹脂組成物、接着フィルムおよび樹脂ワニス |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200710570A (en) * | 2005-05-31 | 2007-03-16 | Taiyo Ink Mfg Co Ltd | Composition for forming adhesive pattern, multilayer structure obtained by using same, and method for producing such multilayer structure |
| EP1990389A4 (en) * | 2006-02-27 | 2010-05-26 | Sumitomo Bakelite Co | ADHESIVE FILM |
| JP2007258508A (ja) * | 2006-03-24 | 2007-10-04 | Sumitomo Bakelite Co Ltd | 半導体用接着剤、これを用いた半導体装置および半導体装置の製造方法 |
| JP5213313B2 (ja) * | 2006-05-23 | 2013-06-19 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| JP5005258B2 (ja) * | 2006-05-23 | 2012-08-22 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| JP5344802B2 (ja) * | 2007-03-30 | 2013-11-20 | リンテック株式会社 | チップ用保護膜形成用シートおよび保護膜付半導体チップ |
| JP4959627B2 (ja) * | 2007-05-25 | 2012-06-27 | 住友ベークライト株式会社 | 樹脂組成物、樹脂スペーサ用フィルムおよび半導体装置 |
| JP2009009110A (ja) * | 2007-05-30 | 2009-01-15 | Sumitomo Bakelite Co Ltd | 感光性接着剤樹脂組成物、接着フィルムおよび受光装置 |
| US7999354B2 (en) | 2007-06-12 | 2011-08-16 | Sumitomo Bakelite Company, Ltd. | Resin composition, filling material, insulating layer and semiconductor device |
| JP4091969B1 (ja) * | 2007-07-12 | 2008-05-28 | 住友ベークライト株式会社 | 受光装置および受光装置の製造方法 |
| JP5137538B2 (ja) * | 2007-11-28 | 2013-02-06 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
| WO2009116258A1 (ja) * | 2008-03-18 | 2009-09-24 | 住友ベークライト株式会社 | 感光性樹脂組成物、感光性樹脂スペーサ用フィルムおよび半導体装置 |
| JP5532658B2 (ja) * | 2008-09-04 | 2014-06-25 | 日立化成株式会社 | 積層体エレメント用感光性接着剤組成物、フィルム状接着剤、接着シート、及び、積層体エレメント |
| JP7726028B2 (ja) * | 2020-11-16 | 2025-08-20 | 住友ベークライト株式会社 | 樹脂組成物 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007291375A (ja) * | 2004-05-31 | 2007-11-08 | Sumitomo Bakelite Co Ltd | 樹脂組成物、接着フィルムおよび樹脂ワニス |
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