JP4015060B2 - 直接水冷型パワー半導体モジュール構造 - Google Patents

直接水冷型パワー半導体モジュール構造 Download PDF

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Publication number
JP4015060B2
JP4015060B2 JP2003141966A JP2003141966A JP4015060B2 JP 4015060 B2 JP4015060 B2 JP 4015060B2 JP 2003141966 A JP2003141966 A JP 2003141966A JP 2003141966 A JP2003141966 A JP 2003141966A JP 4015060 B2 JP4015060 B2 JP 4015060B2
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JP
Japan
Prior art keywords
fin
power semiconductor
cooling
semiconductor module
module structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003141966A
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English (en)
Japanese (ja)
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JP2004349324A (ja
JP2004349324A5 (OSRAM
Inventor
昭浩 丹波
達也 外木
要 佐々木
広一 井上
隆一 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Hitachi Ltd
Original Assignee
Hitachi Cable Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi Cable Ltd, Hitachi Ltd filed Critical Hitachi Cable Ltd
Priority to JP2003141966A priority Critical patent/JP4015060B2/ja
Publication of JP2004349324A publication Critical patent/JP2004349324A/ja
Publication of JP2004349324A5 publication Critical patent/JP2004349324A5/ja
Application granted granted Critical
Publication of JP4015060B2 publication Critical patent/JP4015060B2/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003141966A 2003-05-20 2003-05-20 直接水冷型パワー半導体モジュール構造 Expired - Fee Related JP4015060B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003141966A JP4015060B2 (ja) 2003-05-20 2003-05-20 直接水冷型パワー半導体モジュール構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003141966A JP4015060B2 (ja) 2003-05-20 2003-05-20 直接水冷型パワー半導体モジュール構造

Publications (3)

Publication Number Publication Date
JP2004349324A JP2004349324A (ja) 2004-12-09
JP2004349324A5 JP2004349324A5 (OSRAM) 2005-11-04
JP4015060B2 true JP4015060B2 (ja) 2007-11-28

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ID=33530184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003141966A Expired - Fee Related JP4015060B2 (ja) 2003-05-20 2003-05-20 直接水冷型パワー半導体モジュール構造

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JP (1) JP4015060B2 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4962836B2 (ja) * 2006-01-10 2012-06-27 中村製作所株式会社 冷却部を備えた電子部品用パッケージ、およびその形成方法
JP4569473B2 (ja) * 2006-01-04 2010-10-27 株式会社日立製作所 樹脂封止型パワー半導体モジュール
JP4715529B2 (ja) * 2006-01-26 2011-07-06 トヨタ自動車株式会社 パワー半導体素子の冷却構造
JP4770490B2 (ja) 2006-01-31 2011-09-14 トヨタ自動車株式会社 パワー半導体素子の冷却構造およびインバータ
JP2010080455A (ja) * 2006-12-22 2010-04-08 Nec Corp 電子機器の冷却装置及び冷却方法
JP5120604B2 (ja) * 2007-05-22 2013-01-16 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP5099417B2 (ja) * 2007-05-22 2012-12-19 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP5120605B2 (ja) 2007-05-22 2013-01-16 アイシン・エィ・ダブリュ株式会社 半導体モジュール及びインバータ装置
JP4445566B2 (ja) * 2007-11-02 2010-04-07 カルソニックカンセイ株式会社 熱交換器
US9671179B2 (en) * 2008-01-15 2017-06-06 Showa Denko K.K. Liquid-cooled-type cooling device
JP4785878B2 (ja) 2008-02-06 2011-10-05 本田技研工業株式会社 冷却装置及び該冷却装置を備える電気車両
JP5243353B2 (ja) * 2009-06-18 2013-07-24 本田技研工業株式会社 電力変換装置
US8064198B2 (en) 2009-06-29 2011-11-22 Honda Motor Co., Ltd. Cooling device for semiconductor element module and magnetic part
WO2013115285A1 (ja) * 2012-01-30 2013-08-08 京セラ株式会社 ヒートシンクおよびこのヒートシンクを備えた電子部品装置
JP6154248B2 (ja) * 2012-08-24 2017-06-28 京セラ株式会社 流路部材およびこれを用いた熱交換器ならびに半導体製造装置
JP6044215B2 (ja) * 2012-09-13 2016-12-14 富士電機株式会社 半導体装置
JP7321305B2 (ja) * 2022-01-12 2023-08-04 三菱電機株式会社 電力変換装置
DK202330338A1 (en) * 2023-11-20 2024-11-13 Vestas Wind Sys As Power module with cooling fins improving mechanical strength

Also Published As

Publication number Publication date
JP2004349324A (ja) 2004-12-09

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