JP4012515B2 - はんだ付け方法およびはんだ付け装置 - Google Patents
はんだ付け方法およびはんだ付け装置 Download PDFInfo
- Publication number
- JP4012515B2 JP4012515B2 JP2004005215A JP2004005215A JP4012515B2 JP 4012515 B2 JP4012515 B2 JP 4012515B2 JP 2004005215 A JP2004005215 A JP 2004005215A JP 2004005215 A JP2004005215 A JP 2004005215A JP 4012515 B2 JP4012515 B2 JP 4012515B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- soldering
- mask plate
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004005215A JP4012515B2 (ja) | 2004-01-13 | 2004-01-13 | はんだ付け方法およびはんだ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004005215A JP4012515B2 (ja) | 2004-01-13 | 2004-01-13 | はんだ付け方法およびはんだ付け装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005203406A JP2005203406A (ja) | 2005-07-28 |
| JP2005203406A5 JP2005203406A5 (enrdf_load_stackoverflow) | 2007-02-15 |
| JP4012515B2 true JP4012515B2 (ja) | 2007-11-21 |
Family
ID=34819615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004005215A Expired - Fee Related JP4012515B2 (ja) | 2004-01-13 | 2004-01-13 | はんだ付け方法およびはんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4012515B2 (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3942623B2 (ja) | 2005-12-12 | 2007-07-11 | 富士通テン株式会社 | フラットディップ装置およびフラットディップ装置のはんだ付け方法 |
| ES2331294B2 (es) * | 2006-12-08 | 2010-09-14 | Fujitsu Ten Limited | Aparato y metodo para la soldadura de una pieza de trabajo plana. |
| JP4724669B2 (ja) * | 2007-01-11 | 2011-07-13 | 日本電熱ホールディングス株式会社 | フローディップはんだ付け装置 |
| JP5333835B2 (ja) * | 2009-01-30 | 2013-11-06 | 日立化成株式会社 | プリント配線板および電子機器 |
| JP5199974B2 (ja) * | 2009-10-07 | 2013-05-15 | Ｆａシンカテクノロジー株式会社 | 半田付け装置の半田切り方法及びこれに用いるパレット装置 |
| KR102396902B1 (ko) * | 2015-10-12 | 2022-05-13 | 현대모비스 주식회사 | 기판 솔더링 장치 및 방법 |
| JP6645990B2 (ja) * | 2017-01-13 | 2020-02-14 | コーセル株式会社 | 半田付け装置及び半田付け方法 |
| JP7035793B2 (ja) * | 2018-05-18 | 2022-03-15 | 株式会社デンソー | はんだ付け装置、及び、はんだ付け方法 |
| JP7096563B2 (ja) | 2019-07-25 | 2022-07-06 | 有限会社森永技研 | 卓上半田付け装置及びこれを用いた半田付け方法 |
| TWI693980B (zh) * | 2019-10-28 | 2020-05-21 | 技嘉科技股份有限公司 | 解焊用高溫容器以及解焊設備 |
| CN117156713B (zh) * | 2023-08-18 | 2024-08-23 | 宜宾卓邦科技有限公司 | 一种电路板焊锡设备 |
-
2004
- 2004-01-13 JP JP2004005215A patent/JP4012515B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005203406A (ja) | 2005-07-28 |
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