JP3997185B2 - 両面研磨装置 - Google Patents
両面研磨装置 Download PDFInfo
- Publication number
- JP3997185B2 JP3997185B2 JP2003294827A JP2003294827A JP3997185B2 JP 3997185 B2 JP3997185 B2 JP 3997185B2 JP 2003294827 A JP2003294827 A JP 2003294827A JP 2003294827 A JP2003294827 A JP 2003294827A JP 3997185 B2 JP3997185 B2 JP 3997185B2
- Authority
- JP
- Japan
- Prior art keywords
- surface plate
- double
- annular body
- annular
- side polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
2 支持部
3 基部
4 ヘッド部
5 下定盤
6 太陽歯車
7 内歯歯車
8 キャリア
20 上定盤
20a 研磨パッド
21 背壁
21a リニアガイド
22 載設用板部材
22a 載設用板部材の孔
22b 研磨材供給部
23 メインシャフト(上定盤支持軸)
23m メインシャフトの下端部
231m 孔
232m 孔
24 調芯部
241 第1環状体
241a 周壁
241b 収納孔
241c 収納孔
241d 孔
241e 孔
242 第2環状体
242a 周壁
242b 収納孔
242c 収納孔
242d 孔
242e 孔
243 第3環状体
243a 周壁
243b 収納孔
243c 収納孔
243d 孔
243e 孔
25 回転被駆動部
26 歯車列
27 駆動板
27a 研磨剤収容溝
27b 供給孔
271 支持部材
28 エアシリンダ
28a ピストンロッド
29 枠体
B1,B2,B3,B4,B5,B6 ベアリング
J1,J2,J3,J4,J5,J6 環状体支持軸
W ワーク
Claims (4)
- ワークを上定盤と下定盤とで挟圧した状態で回転させてワーク両面の研磨を行うとともに、上定盤支持軸の下端部に設けた調芯部を介して上定盤を回転させるようにした両面研磨装置において、
上記調芯部は、上定盤支持軸の外周に中心から外側に向けて同心状かつ間隔を開けて順次設けたn0個(n0:2以上の整数)の環状体を有し、
上記環状体の各々は、その周壁と中心を貫く一本の回動軸の回りに揺動自在に設けられる、
ことを特徴とする両面研磨装置。 - 上記環状体の各々の回動軸は、360/(2n0)度ずつ異なる、請求項1に記載の両面研磨装置。
- 上記環状体は、環状の周壁と、その周壁の互いに対向する位置に嵌設したベアリングと、そのベアリングの各々に設けられベアリング内輪に一端が嵌入し他端が隣の環状体に支持されて当該環状体を支持する環状体支持軸とを有する、請求項1または2に記載の両面研磨装置。
- 上記環状体支持軸の他端が隣の環状体の周壁側に固定されている、請求項3に記載の両面研磨装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003294827A JP3997185B2 (ja) | 2003-08-19 | 2003-08-19 | 両面研磨装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003294827A JP3997185B2 (ja) | 2003-08-19 | 2003-08-19 | 両面研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005059175A JP2005059175A (ja) | 2005-03-10 |
JP3997185B2 true JP3997185B2 (ja) | 2007-10-24 |
Family
ID=34371241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003294827A Expired - Fee Related JP3997185B2 (ja) | 2003-08-19 | 2003-08-19 | 両面研磨装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3997185B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006032455A1 (de) * | 2006-07-13 | 2008-04-10 | Siltronic Ag | Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit |
JP2008055601A (ja) * | 2007-11-20 | 2008-03-13 | Tsc:Kk | 両面研磨装置 |
-
2003
- 2003-08-19 JP JP2003294827A patent/JP3997185B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2005059175A (ja) | 2005-03-10 |
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