JP3979797B2 - 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 - Google Patents

電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 Download PDF

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Publication number
JP3979797B2
JP3979797B2 JP2001183185A JP2001183185A JP3979797B2 JP 3979797 B2 JP3979797 B2 JP 3979797B2 JP 2001183185 A JP2001183185 A JP 2001183185A JP 2001183185 A JP2001183185 A JP 2001183185A JP 3979797 B2 JP3979797 B2 JP 3979797B2
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JP
Japan
Prior art keywords
electronic component
component mounted
manufacturing
finished product
circuit pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001183185A
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English (en)
Japanese (ja)
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JP2003008167A5 (https=
JP2003008167A (ja
Inventor
法人 塚原
尚士 秋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001183185A priority Critical patent/JP3979797B2/ja
Publication of JP2003008167A publication Critical patent/JP2003008167A/ja
Publication of JP2003008167A5 publication Critical patent/JP2003008167A5/ja
Application granted granted Critical
Publication of JP3979797B2 publication Critical patent/JP3979797B2/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01221—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition
    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2001183185A 2001-06-18 2001-06-18 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品 Expired - Fee Related JP3979797B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001183185A JP3979797B2 (ja) 2001-06-18 2001-06-18 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001183185A JP3979797B2 (ja) 2001-06-18 2001-06-18 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Publications (3)

Publication Number Publication Date
JP2003008167A JP2003008167A (ja) 2003-01-10
JP2003008167A5 JP2003008167A5 (https=) 2005-05-19
JP3979797B2 true JP3979797B2 (ja) 2007-09-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001183185A Expired - Fee Related JP3979797B2 (ja) 2001-06-18 2001-06-18 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品

Country Status (1)

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JP (1) JP3979797B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070075436A1 (en) 2003-10-06 2007-04-05 Nec Corporation Electronic device and manufacturing method of the same

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Publication number Publication date
JP2003008167A (ja) 2003-01-10

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