JP3974154B2 - 光半導体モジュール及び光半導体装置 - Google Patents

光半導体モジュール及び光半導体装置 Download PDF

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Publication number
JP3974154B2
JP3974154B2 JP2006050188A JP2006050188A JP3974154B2 JP 3974154 B2 JP3974154 B2 JP 3974154B2 JP 2006050188 A JP2006050188 A JP 2006050188A JP 2006050188 A JP2006050188 A JP 2006050188A JP 3974154 B2 JP3974154 B2 JP 3974154B2
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JP
Japan
Prior art keywords
terminal
optical semiconductor
cathode
cathode terminal
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006050188A
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English (en)
Japanese (ja)
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JP2006148169A5 (enrdf_load_stackoverflow
JP2006148169A (ja
Inventor
功 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2006050188A priority Critical patent/JP3974154B2/ja
Publication of JP2006148169A publication Critical patent/JP2006148169A/ja
Publication of JP2006148169A5 publication Critical patent/JP2006148169A5/ja
Application granted granted Critical
Publication of JP3974154B2 publication Critical patent/JP3974154B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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JP2006050188A 2006-02-27 2006-02-27 光半導体モジュール及び光半導体装置 Expired - Fee Related JP3974154B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006050188A JP3974154B2 (ja) 2006-02-27 2006-02-27 光半導体モジュール及び光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006050188A JP3974154B2 (ja) 2006-02-27 2006-02-27 光半導体モジュール及び光半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2002250534A Division JP3790199B2 (ja) 2002-08-29 2002-08-29 光半導体装置及び光半導体モジュール

Publications (3)

Publication Number Publication Date
JP2006148169A JP2006148169A (ja) 2006-06-08
JP2006148169A5 JP2006148169A5 (enrdf_load_stackoverflow) 2006-07-20
JP3974154B2 true JP3974154B2 (ja) 2007-09-12

Family

ID=36627393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006050188A Expired - Fee Related JP3974154B2 (ja) 2006-02-27 2006-02-27 光半導体モジュール及び光半導体装置

Country Status (1)

Country Link
JP (1) JP3974154B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5026848B2 (ja) * 2007-04-19 2012-09-19 スタンレー電気株式会社 光半導体デバイスおよびその製造方法
JP2009246343A (ja) * 2008-03-11 2009-10-22 Rohm Co Ltd 半導体発光装置およびその製造方法
JP5212089B2 (ja) * 2008-12-25 2013-06-19 豊田合成株式会社 Ｌｅｄ発光装置

Also Published As

Publication number Publication date
JP2006148169A (ja) 2006-06-08

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